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Class Information
Number: 438/677
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Selective deposition of conductive layer > Pretreatment of surface to enhance or retard deposition
Description: Processes including a step of treating the substrate surface preparatory to the selective deposition step to increase or decrease the deposition thereon.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8691667 Method and apparatus for depositing a pattern on a substrate Apr. 8, 2014
8669183 Manufacturing method of semiconductor device Mar. 11, 2014
8658911 Through-hole-vias in multi-layer printed circuit boards Feb. 25, 2014
8652966 Semiconductor device manufacturing method and semiconductor device Feb. 18, 2014
8647978 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Feb. 11, 2014
8647982 Methods of forming interconnects in a semiconductor structure Feb. 11, 2014
8637392 Solder interconnect with non-wettable sidewall pillars and methods of manufacture Jan. 28, 2014
8614140 Semiconductor device manufacturing apparatus Dec. 24, 2013
8609526 Preventing UBM oxidation in bump formation processes Dec. 17, 2013
8610278 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Dec. 17, 2013
8592277 Method of forming low resistance gate for power MOSFET applications Nov. 26, 2013
8592312 Method for depositing a conductive capping layer on metal lines Nov. 26, 2013
8586479 Methods for forming a contact metal layer in semiconductor devices Nov. 19, 2013
8557702 Plasma-enhanced atomic layers deposition of conductive material over dielectric layers Oct. 15, 2013
8557703 Method for pre-migration of metal ions in a semiconductor package Oct. 15, 2013
8518797 Method of making an SOI substrate by using a separation layer with regions of non-uniform concentration Aug. 27, 2013
8513116 Atomic layer deposition of tungsten materials Aug. 20, 2013
8486833 Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks Jul. 16, 2013
8461037 Method for fabricating interconnections with carbon nanotubes Jun. 11, 2013
8450211 Method for fabricating semiconductor device May. 28, 2013
8415252 Selective copper encapsulation layer deposition Apr. 9, 2013
8409987 Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics Apr. 2, 2013
8395257 Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive material Mar. 12, 2013
8357599 Seed layer passivation Jan. 22, 2013
8329577 Method of forming an alloy in an interconnect structure to increase electromigration resistance Dec. 11, 2012
8324103 Vias and method of making Dec. 4, 2012
8318533 Method of manufacturing an organic thin film transistor Nov. 27, 2012
8298946 Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits Oct. 30, 2012
8293646 Semiconductor device manufacturing method and substrate processing apparatus Oct. 23, 2012
8293647 Bottom up plating by organic surface passivation and differential plating retardation Oct. 23, 2012
8278136 Semiconductor device, method for producing the same, sensor and electro-optical device Oct. 2, 2012
8241948 Semiconductor device and manufacturing method of the same Aug. 14, 2012
8227344 Hybrid in-situ dry cleaning of oxidized surface layers Jul. 24, 2012
8227708 Via structure integrated in electronic substrate Jul. 24, 2012
8215010 Method of manufacturing a printed circuit board Jul. 10, 2012
8211799 Atomic layer deposition of tungsten materials Jul. 3, 2012
8128993 Anisotropic nanotube fabric layers and films and methods of forming same Mar. 6, 2012
8119526 Method of forming a metal layer and a method of fabricating a semiconductor device Feb. 21, 2012
8119525 Process for selective growth of films during ECP plating Feb. 21, 2012
8120184 Semiconductor constructions and methods of forming layers Feb. 21, 2012
8110502 Method of improving adhesion strength of low dielectric constant layers Feb. 7, 2012
8110503 Surface preparation for thin film growth by enhanced nucleation Feb. 7, 2012
8105945 Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same Jan. 31, 2012
8101521 Methods for improving uniformity and resistivity of thin tungsten films Jan. 24, 2012
8097527 Method of forming epitaxial layer Jan. 17, 2012
8097538 Method of manufacturing semiconductor device Jan. 17, 2012
8058170 Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics Nov. 15, 2011
8048800 Fabrication method of two-terminal semiconductor component using trench technology Nov. 1, 2011
8048804 Method of manufacturing semiconductor package Nov. 1, 2011
8039966 Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects Oct. 18, 2011

1 2 3 4 5 6 7 8

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