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Class Information
Number: 438/677
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Selective deposition of conductive layer > Pretreatment of surface to enhance or retard deposition
Description: Processes including a step of treating the substrate surface preparatory to the selective deposition step to increase or decrease the deposition thereon.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622380 |
Method of improving adhesion between two dielectric films |
Nov. 24, 2009 |
| RE40983 |
Method to plate C4 to copper stud |
Nov. 17, 2009 |
| 7615488 |
Method for forming pattern, thin film transistor, display device and method for manufacturing the same, and television device |
Nov. 10, 2009 |
| 7608535 |
Method for forming metal contact in semiconductor device |
Oct. 27, 2009 |
| 7598171 |
Method of manufacturing a semiconductor device |
Oct. 6, 2009 |
| 7592254 |
Methods for coating and filling high aspect ratio recessed features |
Sep. 22, 2009 |
| 7582557 |
Process for low resistance metal cap |
Sep. 1, 2009 |
| 7566657 |
Methods of forming through-substrate interconnects |
Jul. 28, 2009 |
| 7560372 |
Process for making a semiconductor device having a roughened surface |
Jul. 14, 2009 |
| 7547633 |
UV assisted thermal processing |
Jun. 16, 2009 |
| 7544614 |
Method of forming a coated film, method of forming an electronic device, and method of manufacturing an electron emission element |
Jun. 9, 2009 |
| 7534724 |
Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same |
May. 19, 2009 |
| 7528071 |
Method for fabricating semiconductor device |
May. 5, 2009 |
| 7517782 |
Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase |
Apr. 14, 2009 |
| 7494926 |
Method for forming highly conductive metal pattern on flexible substrate and EMI filter using metal pattern formed by the method |
Feb. 24, 2009 |
| 7476619 |
Semiconductor device |
Jan. 13, 2009 |
| 7476604 |
Aggressive cleaning process for semiconductor device contact formation |
Jan. 13, 2009 |
| 7456030 |
Electroforming technique for the formation of high frequency performance ferromagnetic films |
Nov. 25, 2008 |
| 7452810 |
Method of forming a barrier layer of a semiconductor device |
Nov. 18, 2008 |
| 7446034 |
Process for making a metal seed layer |
Nov. 4, 2008 |
| 7416975 |
Method of forming contact layers on substrates |
Aug. 26, 2008 |
| 7405158 |
Methods for depositing tungsten layers employing atomic layer deposition techniques |
Jul. 29, 2008 |
| 7405157 |
Methods for the electrochemical deposition of copper onto a barrier layer of a work piece |
Jul. 29, 2008 |
| 7405146 |
Electroplating method by transmitting electric current from a ball side |
Jul. 29, 2008 |
| 7393782 |
Process for producing layer structures for signal distribution |
Jul. 1, 2008 |
| 7390739 |
Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region |
Jun. 24, 2008 |
| 7375024 |
Method for fabricating metal interconnection line with use of barrier metal layer formed in low temperature |
May. 20, 2008 |
| 7358185 |
Device having contact pad with a conductive layer and a conductive passivation layer |
Apr. 15, 2008 |
| 7358554 |
Semiconductor manufacturing apparatus for modifying-in-film stress of thin films, and product formed thereby |
Apr. 15, 2008 |
| 7341947 |
Methods of forming metal-containing films over surfaces of semiconductor substrates |
Mar. 11, 2008 |
| 7341943 |
Post etch copper cleaning using dry plasma |
Mar. 11, 2008 |
| 7341942 |
Method for forming metal line of semiconductor device |
Mar. 11, 2008 |
| 7335586 |
Sealing porous dielectric material using plasma-induced surface polymerization |
Feb. 26, 2008 |
| 7335591 |
Method for forming three-dimensional structures on a substrate |
Feb. 26, 2008 |
| 7335594 |
Method for manufacturing a memory device having a nanocrystal charge storage region |
Feb. 26, 2008 |
| 7332432 |
Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same |
Feb. 19, 2008 |
| 7323411 |
Method of selective tungsten deposition on a silicon surface |
Jan. 29, 2008 |
| 7320937 |
Method of reliably electroless-plating integrated circuit die |
Jan. 22, 2008 |
| 7314824 |
Nitrogen-free ARC/capping layer and method of manufacturing the same |
Jan. 1, 2008 |
| 7285492 |
Method for processing substrate |
Oct. 23, 2007 |
| 7262135 |
Methods of forming layers |
Aug. 28, 2007 |
| 7259092 |
Semiconductor device and method for fabricating the same |
Aug. 21, 2007 |
| 7253092 |
Tungsten plug corrosion prevention method using water |
Aug. 7, 2007 |
| 7238610 |
Method and apparatus for selective deposition |
Jul. 3, 2007 |
| 7238615 |
Formation method for metal element, production method for semiconductor device, production method for electronic device, semiconductor device, electronic device, and electronic equipment |
Jul. 3, 2007 |
| 7226860 |
Method and apparatus for fabricating metal layer |
Jun. 5, 2007 |
| 7223694 |
Method for improving selectivity of electroless metal deposition |
May. 29, 2007 |
| 7217654 |
Semiconductor device and method of manufacturing the same |
May. 15, 2007 |
| 7214614 |
System for controlling metal formation processes using ion implantation |
May. 8, 2007 |
| 7202156 |
Process for manufacturing a wiring substrate |
Apr. 10, 2007 |
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