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Class Information
Number: 438/676
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Selective deposition of conductive layer > Utilizing electromagnetic or wave energy
Description: Processes wherein the selective deposition is accomplished through the irradiation of localized regions of the substrate with electromagnetic or wave energy.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| RE40983 |
Method to plate C4 to copper stud |
Nov. 17, 2009 |
| 7618892 |
Via hole forming method |
Nov. 17, 2009 |
| 7592258 |
Metallization layer of a semiconductor device having differently thick metal lines and a method of forming the same |
Sep. 22, 2009 |
| 7579274 |
Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices |
Aug. 25, 2009 |
| 7566661 |
Electroless treatment of noble metal barrier and adhesion layer |
Jul. 28, 2009 |
| 7557035 |
Method of forming semiconductor devices by microwave curing of low-k dielectric films |
Jul. 7, 2009 |
| 7538031 |
Method of manufacturing a wiring substrate and an electronic instrument |
May. 26, 2009 |
| 7514347 |
Interconnect structure and fabricating method thereof |
Apr. 7, 2009 |
| 7501156 |
Pattern formation substrate and method for pattern formation |
Mar. 10, 2009 |
| 7494923 |
Manufacturing method of wiring substrate and semiconductor device |
Feb. 24, 2009 |
| 7482273 |
Transmissive dynamic plasma steering method for radiant electromagnetic energy |
Jan. 27, 2009 |
| 7462556 |
Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes |
Dec. 9, 2008 |
| 7459373 |
Method for fabricating and separating semiconductor devices |
Dec. 2, 2008 |
| 7459387 |
Semiconductor electronic device and method of manufacturing thereof |
Dec. 2, 2008 |
| 7452827 |
Gas distribution showerhead featuring exhaust apertures |
Nov. 18, 2008 |
| 7452740 |
Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof |
Nov. 18, 2008 |
| 7442615 |
Semiconductor processing system and method |
Oct. 28, 2008 |
| 7442634 |
Method for constructing contact formations |
Oct. 28, 2008 |
| 7439192 |
Method of forming a layer on a semiconductor substrate |
Oct. 21, 2008 |
| 7410380 |
Voice and data telecommunications connector |
Aug. 12, 2008 |
| 7399705 |
Method for producing a local coating and combinatory substrate having such coating |
Jul. 15, 2008 |
| 7358169 |
Laser-assisted deposition |
Apr. 15, 2008 |
| 7316974 |
Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device |
Jan. 8, 2008 |
| 7288466 |
Processing method, manufacturing method of semiconductor device, and processing apparatus |
Oct. 30, 2007 |
| 7268077 |
Carbon nanotube reinforced metallic layer |
Sep. 11, 2007 |
| 7262106 |
Absorber layer for DSA processing |
Aug. 28, 2007 |
| 7253079 |
Coplanar mounting member for a MEM sensor |
Aug. 7, 2007 |
| 7238629 |
Deposition method, method of manufacturing semiconductor device, and semiconductor device |
Jul. 3, 2007 |
| 7214617 |
Method of forming thin film pattern, method of manufacturing device, electro-optical apparatus and electronic apparatus |
May. 8, 2007 |
| 7214618 |
Technique for high efficiency metalorganic chemical vapor deposition |
May. 8, 2007 |
| 7199043 |
Method of forming copper wiring in semiconductor device |
Apr. 3, 2007 |
| 7115529 |
Atomic layer deposition methods |
Oct. 3, 2006 |
| 7052991 |
Electrodeposition film forming method, and semiconductor apparatus |
May. 30, 2006 |
| 7033931 |
Temperature optimization of a physical vapor deposition process to prevent extrusion into openings |
Apr. 25, 2006 |
| 6998346 |
Method for the patterned, selective metallization of a surface of a substrate |
Feb. 14, 2006 |
| 6989328 |
Method of manufacturing semiconductor device having damascene interconnection |
Jan. 24, 2006 |
| 6987277 |
Systems and method for picking and placing of nanoscale objects utilizing differences in chemical and physical binding forces |
Jan. 17, 2006 |
| 6977223 |
Three dimensional microfabrication |
Dec. 20, 2005 |
| 6974771 |
Methods and apparatus for forming barrier layers in high aspect ratio vias |
Dec. 13, 2005 |
| 6973635 |
Printed wiring board design aiding system, printed wiring board CAD system, and record medium |
Dec. 6, 2005 |
| 6933216 |
Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same |
Aug. 23, 2005 |
| 6924188 |
Device and method for protecting against oxidation of a conductive layer in said device |
Aug. 2, 2005 |
| 6924079 |
Resist resin, chemical amplification type resist, and method of forming of pattern with the same |
Aug. 2, 2005 |
| 6897144 |
Cu capping layer deposition with improved integrated circuit reliability |
May. 24, 2005 |
| 6881437 |
Methods and system for processing a microelectronic topography |
Apr. 19, 2005 |
| 6852588 |
Methods of fabricating semiconductor structures comprising epitaxial Hf3Si2 layers |
Feb. 8, 2005 |
| 6841442 |
Method for forming metal contact of semiconductor device |
Jan. 11, 2005 |
| 6841468 |
Method of forming a conductive barrier layer having improve adhesion and resistivity characteristics |
Jan. 11, 2005 |
| 6838380 |
Fabrication of high resistivity structures using focused ion beams |
Jan. 4, 2005 |
| 6835646 |
Forming conductive layers on insulators by physical vapor deposition |
Dec. 28, 2004 |
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