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Class Information
Number: 438/676
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Selective deposition of conductive layer > Utilizing electromagnetic or wave energy
Description: Processes wherein the selective deposition is accomplished through the irradiation of localized regions of the substrate with electromagnetic or wave energy.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8628831 Preparation of a polymer article for selective metallization Jan. 14, 2014
8592312 Method for depositing a conductive capping layer on metal lines Nov. 26, 2013
8569650 Laser material removal methods and apparatus Oct. 29, 2013
8564961 Methods and apparatus for providing holes through portions of a housing of an electronic device Oct. 22, 2013
8557703 Method for pre-migration of metal ions in a semiconductor package Oct. 15, 2013
8530997 Double seal ring Sep. 10, 2013
8507358 Composite wafer semiconductor Aug. 13, 2013
8486833 Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks Jul. 16, 2013
8450768 Semiconductor light-emitting element and process for production thereof May. 28, 2013
8409907 Method for manufacturing information aquiring semiconductor device Apr. 2, 2013
8357598 Method for manufacturing antenna and method for manufacturing semiconductor device Jan. 22, 2013
8338298 Method and apparatus for manufacturing semiconductor integrated circuit device Dec. 25, 2012
8304845 Method for sealing an opening Nov. 6, 2012
8236674 Substrate processing method and semiconductor device manufacturing method including a proton injection step and a laser irradiation step Aug. 7, 2012
8173545 Method for the fabrication of a transistor gate using at least one electron beam May. 8, 2012
8129284 Heat treatment method and heat treatment apparatus for heating substrate by light irradiation Mar. 6, 2012
8048706 Ablative scribing of solar cell structures Nov. 1, 2011
8039966 Structures of and methods and tools for forming in-situ metallic/dielectric caps for interconnects Oct. 18, 2011
8012789 Nonvolatile memory device and method of manufacturing the same Sep. 6, 2011
7994030 Method for manufacturing antenna and method for manufacturing semiconductor device Aug. 9, 2011
7977156 Chipstack package and manufacturing method thereof Jul. 12, 2011
7911014 On chip antenna and method of manufacturing the same Mar. 22, 2011
7884018 Method for improving the selectivity of a CVD process Feb. 8, 2011
7867868 Absorber layer candidates and techniques for application Jan. 11, 2011
7855147 Methods and apparatus for engineering an interface between a diffusion barrier layer and a seed layer Dec. 21, 2010
7829463 Plasma processing method and plasma processing apparatus Nov. 9, 2010
7816254 Film forming method, fabrication process of semiconductor device, computer-readable recording medium and sputtering apparatus Oct. 19, 2010
7786009 Universal connector assembly and method of manufacturing Aug. 31, 2010
7780867 Edge bevel removal of copper from silicon wafers Aug. 24, 2010
7745332 PVD-based metallization methods for fabrication of interconnections in semiconductor devices Jun. 29, 2010
7709398 Process and apparatus for depositing semiconductor layers using two process gases, one of which is preconditioned May. 4, 2010
7700484 Method and apparatus for a metallic dry-filling process Apr. 20, 2010
7696042 Semiconductor capacitor structure and method to form same Apr. 13, 2010
7693597 Computer readable storage medium for controlling substrate processing apparatus Apr. 6, 2010
7655566 Method for manufacturing semiconductor device Feb. 2, 2010
7632754 Method for forming metal line in a semiconductor device Dec. 15, 2009
7618892 Via hole forming method Nov. 17, 2009
RE40983 Method to plate C4 to copper stud Nov. 17, 2009
7592258 Metallization layer of a semiconductor device having differently thick metal lines and a method of forming the same Sep. 22, 2009
7579274 Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices Aug. 25, 2009
7566661 Electroless treatment of noble metal barrier and adhesion layer Jul. 28, 2009
7557035 Method of forming semiconductor devices by microwave curing of low-k dielectric films Jul. 7, 2009
7538031 Method of manufacturing a wiring substrate and an electronic instrument May. 26, 2009
7514347 Interconnect structure and fabricating method thereof Apr. 7, 2009
7501156 Pattern formation substrate and method for pattern formation Mar. 10, 2009
7494923 Manufacturing method of wiring substrate and semiconductor device Feb. 24, 2009
7482273 Transmissive dynamic plasma steering method for radiant electromagnetic energy Jan. 27, 2009
7462556 Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes Dec. 9, 2008
7459373 Method for fabricating and separating semiconductor devices Dec. 2, 2008
7459387 Semiconductor electronic device and method of manufacturing thereof Dec. 2, 2008

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