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Class Information
Number: 438/672
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > And patterning of conductive layer > Plug formation (i.e., in viahole)
Description: Processes wherein the patterning step results in the remaining conductive material being recessed below the top surface of the substrate.










Patents under this class:

Patent Number Title Of Patent Date Issued
7732328 Method of fabricating semiconductor package structure Jun. 8, 2010
7719117 Semiconductor device having multilayer wiring structure May. 18, 2010
7718526 Fabrication method of semiconductor integrated circuit device May. 18, 2010
7713873 Methods of forming contact structures semiconductor devices May. 11, 2010
7713855 Method for forming bit-line contact plug and transistor structure May. 11, 2010
7709905 Dual damascene wiring and method May. 4, 2010
7709367 Method for fabricating storage node contact in semiconductor device May. 4, 2010
7704885 Semiconductor device and method for fabricating the same Apr. 27, 2010
7704874 Method for fabricating a frontside through-wafer via in a processed wafer and related structure Apr. 27, 2010
7700477 Method for fabricating semiconductor device Apr. 20, 2010
7700436 Method for forming a microelectronic structure having a conductive material and a fill material with a hardness of 0.04 GPA or higher within an aperture Apr. 20, 2010
7691748 Through-silicon via and method for forming the same Apr. 6, 2010
7691740 Semiconductor device and method of fabricating same Apr. 6, 2010
7691738 Metal line in semiconductor device and fabricating method thereof Apr. 6, 2010
7687395 Contact aperture and contact via with stepped sidewall and methods for fabrication thereof Mar. 30, 2010
7682972 Advanced multilayer coreless support structures and method for their fabrication Mar. 23, 2010
7682959 Method of forming solder bump on high topography plated Cu Mar. 23, 2010
7682778 Methods of forming contact plugs in semiconductor devices Mar. 23, 2010
7678696 Method of making through wafer vias Mar. 16, 2010
7678683 Method of fabricating copper damascene and dual damascene interconnect wiring Mar. 16, 2010
7678642 Method for manufacturing phase change memory device using a patterning process Mar. 16, 2010
7674712 Patterning method for light-emitting devices Mar. 9, 2010
7674703 Gridded contacts in semiconductor devices Mar. 9, 2010
7670946 Methods to eliminate contact plug sidewall slit Mar. 2, 2010
7670925 Semiconductor device, method of manufacturing same, and apparatus for designing same Mar. 2, 2010
7666789 Method of manufacturing a variable resistance structure and method of manufacturing a phase-change memory device using the same Feb. 23, 2010
7666784 Methods of trench and contact formation in memory cells Feb. 23, 2010
7659630 Interconnect structures with interlayer dielectric Feb. 9, 2010
7659202 Triaxial through-chip connection Feb. 9, 2010
7659201 Process for manufacturing semiconductor integrated circuit device Feb. 9, 2010
7659196 Soluble hard mask for interlayer dielectric patterning Feb. 9, 2010
7655554 Method for eliminating loading effect using a via plug Feb. 2, 2010
7655547 Metal spacer in single and dual damascene processing Feb. 2, 2010
7655499 Forming method of contact hole and manufacturing method of semiconductor device, liquid crystal display device and EL display device Feb. 2, 2010
7652354 Semiconductor devices and methods of manufacturing semiconductor devices Jan. 26, 2010
7651937 Bumping process and structure thereof Jan. 26, 2010
7651898 Method for fabricating semiconductor device Jan. 26, 2010
7648912 ASIC customization with predefined via mask Jan. 19, 2010
7648904 Metal line in semiconductor device and method for forming the same Jan. 19, 2010
7645700 Dry etchback of interconnect contacts Jan. 12, 2010
7645696 Deposition of thin continuous PVD seed layers having improved adhesion to the barrier layer Jan. 12, 2010
7642173 Three-dimensional face-to-face integration assembly Jan. 5, 2010
7638422 Method of manufacturing metal insulating layer in semiconductor device Dec. 29, 2009
7633161 Semiconductor device and method of forming metal interconnection layer thereof Dec. 15, 2009
7632736 Self-aligned contact formation utilizing sacrificial polysilicon Dec. 15, 2009
7629255 Method for reducing microloading in etching high aspect ratio structures Dec. 8, 2009
7629251 Semiconductor device and a method of manufacturing the same Dec. 8, 2009
7625818 Method for forming vias in a substrate Dec. 1, 2009
7625815 Reduced leakage interconnect structure Dec. 1, 2009
7622390 Method for treating a dielectric film to reduce damage Nov. 24, 2009











 
 
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