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Class Information
Number: 438/672
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > And patterning of conductive layer > Plug formation (i.e., in viahole)
Description: Processes wherein the patterning step results in the remaining conductive material being recessed below the top surface of the substrate.

Patents under this class:

Patent Number Title Of Patent Date Issued
7867924 Methods of reducing impurity concentration in isolating films in semiconductor devices Jan. 11, 2011
7867906 Semiconductor device and method for manufacturing same Jan. 11, 2011
7867902 Methods of forming a contact structure Jan. 11, 2011
7867895 Method of fabricating improved interconnect structure with a via gouging feature absent profile damage to the interconnect dielectric Jan. 11, 2011
7867874 Method and apparatus for packaging circuit devices Jan. 11, 2011
7863193 Integrated circuit fabrication process using a compression cap layer in forming a silicide with minimal post-laser annealing dopant deactivation Jan. 4, 2011
7863185 Artificially tilted via connection Jan. 4, 2011
7863183 Method for fabricating last level copper-to-C4 connection with interfacial cap structure Jan. 4, 2011
7858520 Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same Dec. 28, 2010
7858483 Method for fabricating capacitor of semiconductor device Dec. 28, 2010
7855145 Gap filling method and method for forming semiconductor memory device using the same Dec. 21, 2010
7851918 Three-dimensional package module Dec. 14, 2010
7851779 Medium for use in data storage, thermal energy storage and other applications, with functional layer made of different materials Dec. 14, 2010
7851364 Method for forming pattern in semiconductor device Dec. 14, 2010
7851357 Method of forming electrodeposited contacts Dec. 14, 2010
7851356 Integrated circuit and methods of manufacturing the same Dec. 14, 2010
7838421 Method of forming metal line of semiconductor device Nov. 23, 2010
7838420 Method for forming a packaged semiconductor device Nov. 23, 2010
7833893 Method for forming conductive structures Nov. 16, 2010
7829458 Method of forming a wiring structure in a semiconductor device Nov. 9, 2010
7820545 Methods of forming conductive interconnects Oct. 26, 2010
7820537 Method for fabricating semiconductor device Oct. 26, 2010
7820456 Semiconductor device and manufacturing method thereof Oct. 26, 2010
7816265 Method for forming vias in a substrate Oct. 19, 2010
7816257 Methods of fabricating semiconductor devices including contact plugs having laterally extending portions Oct. 19, 2010
7811935 Isolation regions and their formation Oct. 12, 2010
7811929 Method for forming dual damascene pattern Oct. 12, 2010
7799676 Method of manufacturing a contact structure to avoid open issue Sep. 21, 2010
7799672 Semiconductor device and method for manufacturing same Sep. 21, 2010
7799653 Method for forming capacitor in dynamic random access memory Sep. 21, 2010
7795142 Method for fabricating a semiconductor device Sep. 14, 2010
7795141 Method of manufacturing semiconductor device suitable for forming wiring using damascene method Sep. 14, 2010
7795135 Method for producing a layer arrangement Sep. 14, 2010
7795093 Front-end processing of nickel plated bond pads Sep. 14, 2010
7790615 Electronic component packaging Sep. 7, 2010
7790614 Semiconductor device and method of manufacturing the same Sep. 7, 2010
7790613 Semiconductor device and method of manufacturing the same Sep. 7, 2010
7786008 Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereof Aug. 31, 2010
7781331 Method for producing electrically conductive bushings through non-conductive or semiconductive substrates Aug. 24, 2010
7781320 Method for fabricating a semiconductor device by considering the extinction coefficient during etching of an interlayer insulating film Aug. 24, 2010
7763544 Method of forming fine pattern of semiconductor device using sige layer as sacrificial layer, and method of forming self-aligned contacts using the same Jul. 27, 2010
7763481 Liquid crystal display and fabrication method thereof Jul. 27, 2010
7754605 Ultrashallow semiconductor contact by outdiffusion from a solid source Jul. 13, 2010
7749904 Method of forming a dual damascene structure Jul. 6, 2010
7745331 Method for fabricating contact plug in semiconductor device Jun. 29, 2010
7745327 Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime Jun. 29, 2010
7745275 Integrated circuit and a method of making an integrated circuit to provide a gate contact over a diffusion region Jun. 29, 2010
7741215 Semiconductor device and method for manufacturing the same Jun. 22, 2010
7741207 Semiconductor device with multilayered metal pattern Jun. 22, 2010
7741174 Methods of forming pad structures and related methods of manufacturing recessed channel transistors that include such pad structures Jun. 22, 2010

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