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Class Information
Number: 438/672
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > And patterning of conductive layer > Plug formation (i.e., in viahole)
Description: Processes wherein the patterning step results in the remaining conductive material being recessed below the top surface of the substrate.










Patents under this class:

Patent Number Title Of Patent Date Issued
8048762 Manufacturing method of semiconductor device Nov. 1, 2011
8048689 Semiconductor chip with backside conductor structure Nov. 1, 2011
8043961 Method of forming a bond pad Oct. 25, 2011
8039393 Semiconductor structure, method for manufacturing semiconductor structure and semiconductor package Oct. 18, 2011
8034716 Semiconductor structures including vertical diode structures and methods for making the same Oct. 11, 2011
8034708 Structure and process for the formation of TSVs Oct. 11, 2011
8034701 Methods of forming recessed gate electrodes having covered layer interfaces Oct. 11, 2011
8034693 Method for fabricating semiconductor device Oct. 11, 2011
8030211 Methods for forming bit line contacts and bit lines during the formation of a semiconductor device Oct. 4, 2011
8026172 Method of forming contact hole arrays using a hybrid spacer technique Sep. 27, 2011
8021978 Methods of fabricating flash memory devices having shared sub active regions Sep. 20, 2011
8008196 Method to create a metal pattern using a damascene-like process Aug. 30, 2011
8008185 Semiconductor devices and methods of forming the same Aug. 30, 2011
8004087 Semiconductor device with dual damascene wirings and method for manufacturing same Aug. 23, 2011
8003532 Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film Aug. 23, 2011
8003514 Methods of fabricating semiconductor devices including storage node landing pads separated from bit line contact plugs Aug. 23, 2011
7998862 Method for fabricating semiconductor device Aug. 16, 2011
7998851 Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same Aug. 16, 2011
7994054 Semiconductor device having oxidized metal film and manufacture method of the same Aug. 9, 2011
7994050 Method for forming dual damascene pattern Aug. 9, 2011
7994048 Method of manufacturing a through electrode Aug. 9, 2011
7989347 Process for filling recessed features in a dielectric substrate Aug. 2, 2011
7977237 Fabricating vias of different size of a semiconductor device by splitting the via patterning process Jul. 12, 2011
7977234 Fabrication method of semiconductor integrated circuit device Jul. 12, 2011
7977208 Method and apparatus for packaging circuit devices Jul. 12, 2011
7977156 Chipstack package and manufacturing method thereof Jul. 12, 2011
7972941 Method of manufacturing a semiconductor device Jul. 5, 2011
7969011 MIIM diodes having stacked structure Jun. 28, 2011
7955976 Methods of forming semiconductor structures Jun. 7, 2011
7955519 Composition and method for planarizing surfaces Jun. 7, 2011
7935623 Semiconductor device and method for fabricating the same May. 3, 2011
7928008 Method for fabricating semiconductor device Apr. 19, 2011
7923370 Method for stacking serially-connected integrated circuits and multi-chip device made from same Apr. 12, 2011
7923270 Light-emitting device and its manufacturing method Apr. 12, 2011
7915736 Microfeature workpieces and methods for forming interconnects in microfeature workpieces Mar. 29, 2011
7915164 Method for forming doped polysilicon via connecting polysilicon layers Mar. 29, 2011
7915163 Method for forming doped polysilicon via connecting polysilicon layers Mar. 29, 2011
7910481 Method for fabricating semiconductor device Mar. 22, 2011
7910480 Method for insulating wires of semiconductor device Mar. 22, 2011
7906347 Magnetic storage device and method of manufacturing the same Mar. 15, 2011
7897959 Phase change memory device having a word line contact Mar. 1, 2011
7897517 Method of selectively depositing materials on a substrate using a supercritical fluid Mar. 1, 2011
7897512 Methods of forming integrated circuit devices including a multi-layer structure with a contact extending therethrough Mar. 1, 2011
7897511 Wafer-level stack package and method of fabricating the same Mar. 1, 2011
7897484 Fabricating a top conductive layer in a semiconductor die Mar. 1, 2011
7892973 Method for manufacturing a semiconductor device Feb. 22, 2011
7892972 Methods for fabricating and filling conductive vias and conductive vias so formed Feb. 22, 2011
7888737 Semiconductor device and method of manufacturing the same Feb. 15, 2011
7888177 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Feb. 15, 2011
7884008 Semiconductor device fabrication method Feb. 8, 2011











 
 
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