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Class Information
Number: 438/672
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > And patterning of conductive layer > Plug formation (i.e., in viahole)
Description: Processes wherein the patterning step results in the remaining conductive material being recessed below the top surface of the substrate.










Patents under this class:

Patent Number Title Of Patent Date Issued
8236690 Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad Aug. 7, 2012
8236683 Conductor structure including manganese oxide capping layer Aug. 7, 2012
8236639 Semiconductor device manufacturing method Aug. 7, 2012
8222139 Chemical mechanical polishing (CMP) processing of through-silicon via (TSV) and contact plug simultaneously Jul. 17, 2012
8222135 Increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride Jul. 17, 2012
8216932 Method of manufacturing semiconductor devices having metal lines Jul. 10, 2012
8209856 Printed wiring board and method for manufacturing the same Jul. 3, 2012
8202810 Low-H plasma treatment with N.sub.2 anneal for electronic memory devices Jun. 19, 2012
8202802 Method of fabricating semiconductor device Jun. 19, 2012
8198174 Air channel interconnects for 3-D integration Jun. 12, 2012
8187971 Method to alter silicide properties using GCIB treatment May. 29, 2012
8187969 Method for manufacturing semiconductor device May. 29, 2012
8183160 Method for manufacturing a semiconductor device and semiconductor device obtainable with such a method May. 22, 2012
8183146 Manufacturing method for a buried circuit structure May. 22, 2012
8183111 Method of fabricating conductive electrodes on the front and backside of a thin film structure May. 22, 2012
8178927 Integrated circuits having a contact structure having an elongate structure and methods for manufacturing the same May. 15, 2012
8173543 Method of forming hole in semiconductor device using mask May. 8, 2012
8164190 Structure of power grid for semiconductor devices and method of making the same Apr. 24, 2012
8158516 Method for manufacturing semiconductor device Apr. 17, 2012
8148770 Memory device with buried bit line structure Apr. 3, 2012
8148263 Methods for forming conductive vias in semiconductor device components Apr. 3, 2012
8143159 Fabrication of interconnects in a low-k interlayer dielectrics Mar. 27, 2012
8138059 Semiconductor device manufacturing method Mar. 20, 2012
8133777 Method of fabricating memory Mar. 13, 2012
8129275 Process for manufacturing semiconductor integrated circuit device Mar. 6, 2012
8129274 Method for making an aperture in a carrier and electrically connecting two opposite faces of the carrier Mar. 6, 2012
8129270 Method for depositing tungsten film having low resistivity, low roughness and high reflectivity Mar. 6, 2012
8124521 Electrical through contact Feb. 28, 2012
8119512 Method for fabricating semiconductor device with damascene bit line Feb. 21, 2012
8115317 Semiconductor device including electrode structure with first and second openings and manufacturing method thereof Feb. 14, 2012
8114769 Methods and structures to enable self-aligned via etch for Cu damascene structure using trench first metal hard mask (TFMHM) scheme Feb. 14, 2012
8114712 Method for fabricating a semiconductor device package Feb. 14, 2012
8110900 Manufacturing process of semiconductor device and semiconductor device Feb. 7, 2012
8110495 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation Feb. 7, 2012
8105887 Inducing stress in CMOS device Jan. 31, 2012
8101517 Semiconductor device and method for making same Jan. 24, 2012
8101496 Method of manufacturing ball grid array type semiconductor device Jan. 24, 2012
8084354 Method of fabricating a metal cap layer with enhanced etch resistivity for copper-based metal regions in semiconductor devices Dec. 27, 2011
8084349 Method for forming post bump Dec. 27, 2011
8084142 Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects Dec. 27, 2011
8076239 Semiconductor device and method of manufacturing the same Dec. 13, 2011
8072073 Semiconductor device and method of manufacturing same Dec. 6, 2011
8071474 Method of manufacturing semiconductor device suitable for forming wiring using damascene method Dec. 6, 2011
8062976 Low cost method of fabrication of vertical interconnections combined to metal top electrodes Nov. 22, 2011
8062970 Production method for semiconductor device Nov. 22, 2011
8058707 Semiconductor devices having redundant through-die vias and methods of fabricating the same Nov. 15, 2011
8058166 Method of manufacturing a semiconductor device Nov. 15, 2011
8053368 Method for removing residues from a patterned substrate Nov. 8, 2011
8053362 Method of forming metal electrode of system in package Nov. 8, 2011
8048803 Method for forming contact plug in a semiconductor device Nov. 1, 2011











 
 
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