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Class Information
Number: 438/672
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > And patterning of conductive layer > Plug formation (i.e., in viahole)
Description: Processes wherein the patterning step results in the remaining conductive material being recessed below the top surface of the substrate.










Patents under this class:

Patent Number Title Of Patent Date Issued
8395902 Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance and cooling structure and process Mar. 12, 2013
8394697 Methods of forming capacitors for semiconductor memory devices Mar. 12, 2013
8389406 Method of manufacturing semiconductor device Mar. 5, 2013
8383514 Method for stacking serially-connected integrated circuits and multi-chip device made from same Feb. 26, 2013
8378496 Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection Feb. 19, 2013
8367545 System and method for monitoring copper barrier layer preclean process Feb. 5, 2013
8367544 Self-aligned patterned etch stop layers for semiconductor devices Feb. 5, 2013
8362619 Nonvolatile memory device and method of manufacturing the same Jan. 29, 2013
8357613 Methods of fabricating semiconductor devices and semiconductor devices including a contact plug processed by rapid thermal annealing Jan. 22, 2013
8357612 Method for manufacturing semiconductor device and semiconductor device Jan. 22, 2013
8357600 Method for fabricating buried gate using pre landing plugs Jan. 22, 2013
8349736 Semiconductor device manufacturing method and semiconductor device Jan. 8, 2013
8349735 Semiconductor device and method of forming conductive TSV with insulating annular ring Jan. 8, 2013
8349728 Method of fabricating copper damascene and dual damascene interconnect wiring Jan. 8, 2013
8349727 Integrated method for high-density interconnection of electronic components through stretchable interconnects Jan. 8, 2013
8349723 Structure of power grid for semiconductor devices and method of making the same Jan. 8, 2013
8349639 Method for manufacturing image sensor Jan. 8, 2013
8344516 Integrated chip carrier with compliant interconnects Jan. 1, 2013
8344496 Distributing power with through-silicon-vias Jan. 1, 2013
8338294 Methods of forming bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate, and semiconductor structures formed by such methods Dec. 25, 2012
8334207 Method for fabricating semiconductor device with buried gates Dec. 18, 2012
8334204 Semiconductor device and manufacturing method therefor Dec. 18, 2012
8330256 Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus Dec. 11, 2012
8329582 Semiconductor device and method of manufacturing the same Dec. 11, 2012
8329580 Methods of forming a metal pattern and semiconductor device structure Dec. 11, 2012
8329574 Methods of fabricating flash memory devices having shared sub active regions Dec. 11, 2012
8329572 Semiconductor device and method for fabricating the same Dec. 11, 2012
8324100 Methods of forming conductive vias Dec. 4, 2012
8324098 Via and method of forming the via with a substantially planar top surface that is suitable for carbon nanotube applications Dec. 4, 2012
8314494 Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices Nov. 20, 2012
8309462 Double spacer quadruple patterning with self-connected hook-up Nov. 13, 2012
8309455 SiH.sub.4 soak for low hydrogen SiN deposition to improve flash memory device performance Nov. 13, 2012
8304348 Semiconductor device manufacturing method and semiconductor device Nov. 6, 2012
8298943 Self aligning via patterning Oct. 30, 2012
8298939 Method for forming conductive contact Oct. 30, 2012
8298931 Dual damascene with amorphous carbon for 3D deep via/trench application Oct. 30, 2012
8298928 Manufacturing method of a semiconductor device and method for creating a layout thereof Oct. 30, 2012
8293642 Method of manufacturing semiconductor devices Oct. 23, 2012
8278214 Through mold via polymer block package Oct. 2, 2012
8273658 Integrated circuit arrangement including vias having two sections, and method for producing the same Sep. 25, 2012
8273652 Semiconductor memory device and method of manufacturing the same Sep. 25, 2012
8269306 Isolation regions Sep. 18, 2012
8264086 Via structure with improved reliability Sep. 11, 2012
8264022 Semiconductor device including contact plug and associated methods Sep. 11, 2012
8263493 Silicon chip having through via and method for making the same Sep. 11, 2012
8253254 Semiconductor device and manufacturing method thereof Aug. 28, 2012
8247324 Semiconductor device with buried gate and method for fabricating the same Aug. 21, 2012
8241992 Method for air gap interconnect integration using photo-patternable low k material Aug. 14, 2012
8241950 System and method to manufacture an implantable electrode Aug. 14, 2012
8237284 Contact plug of semiconductor device and method of forming the same Aug. 7, 2012











 
 
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