Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Engineering
Class Information
Number: 438/672
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > And patterning of conductive layer > Plug formation (i.e., in viahole)
Description: Processes wherein the patterning step results in the remaining conductive material being recessed below the top surface of the substrate.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next

Patent Number Title Of Patent Date Issued
7407885 Methods of forming electrically conductive plugs Aug. 5, 2008
7405151 Method for forming a semiconductor device Jul. 29, 2008
7402515 Method of forming through-silicon vias with stress buffer collars and resulting devices Jul. 22, 2008
7399671 Disposable pillars for contact formation Jul. 15, 2008
7396750 Method and structure for contacting two adjacent GMR memory bit Jul. 8, 2008
7393781 Capping of metal interconnects in integrated circuit electronic devices Jul. 1, 2008
7390741 Method for fabricating semiconductor device Jun. 24, 2008
7388277 Chip and wafer integration process using vertical connections Jun. 17, 2008
7384866 Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer Jun. 10, 2008
7378341 Automatic process control of after-etch-inspection critical dimension May. 27, 2008
7375027 Method of providing contact via to a surface May. 20, 2008
7368389 Methods of forming electrically conductive plugs May. 6, 2008
7365004 Method for manufacturing semiconductor device Apr. 29, 2008
7364994 Method for manufacturing a superjunction device with wide mesas Apr. 29, 2008
7361591 Method of fabricating semiconductor memory device Apr. 22, 2008
7361583 RF semiconductor devices and methods for fabricating the same Apr. 22, 2008
7358184 Method of forming a conductive via plug Apr. 15, 2008
7358176 Screen printing method of forming conductive bumps Apr. 15, 2008
7358170 Methods of forming conductive interconnects, and methods of depositing nickel Apr. 15, 2008
7354852 Method of forming interconnection in semiconductor device Apr. 8, 2008
7354851 Method for fabricating semiconductor device Apr. 8, 2008
7354798 Three-dimensional device fabrication method Apr. 8, 2008
7351656 Semiconductor device having oxidized metal film and manufacture method of the same Apr. 1, 2008
7344979 High pressure treatment for improved grain growth and void reduction Mar. 18, 2008
7344976 Method for fabricating nonvolatile semiconductor memory device Mar. 18, 2008
7344959 Metal filled through via structure for providing vertical wafer-to-wafer interconnection Mar. 18, 2008
7342317 Low coefficient of thermal expansion build-up layer packaging and method thereof Mar. 11, 2008
7341938 Single mask via method and device Mar. 11, 2008
7335517 Multichip semiconductor device, chip therefor and method of formation thereof Feb. 26, 2008
7332449 Method for forming dual damascenes with supercritical fluid treatments Feb. 19, 2008
7332389 Selective polysilicon stud growth Feb. 19, 2008
7329953 Structure for reducing leakage currents and high contact resistance for embedded memory and method for making same Feb. 12, 2008
7329598 Method of manufacturing a semiconductor device Feb. 12, 2008
7323784 Top via pattern for bond pad structure Jan. 29, 2008
7323410 Dry etchback of interconnect contacts Jan. 29, 2008
7312146 Semiconductor device interconnect fabricating techniques Dec. 25, 2007
7312145 Electronic member, method for making the same, and semiconductor device Dec. 25, 2007
7307018 Method of fabricating conductive lines Dec. 11, 2007
7306954 Process flow for building MRAM structures Dec. 11, 2007
7303988 Methods of manufacturing multi-level metal lines in semiconductor devices Dec. 4, 2007
7301237 Semiconductor device Nov. 27, 2007
7300872 Method for manufacturing semiconductor device using dual-damascene pattern Nov. 27, 2007
7300868 Damascene interconnection having porous low k layer with a hard mask reduced in thickness Nov. 27, 2007
7297630 Methods of fabricating via hole and trench Nov. 20, 2007
7294572 Method of forming contact Nov. 13, 2007
7294571 Concave pattern formation method and method for forming semiconductor device Nov. 13, 2007
7291556 Method for forming small features in microelectronic devices using sacrificial layers Nov. 6, 2007
7288475 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner Oct. 30, 2007
7288442 Method for manufacturing contact structures of wirings Oct. 30, 2007
7282442 Contact hole structure of semiconductor device and method of forming the same Oct. 16, 2007

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next










 
 
  Recently Added Patents
Nucleic acids for cloning and expressing multiprotein complexes
Process to increase selectivity to ethylene in oxygenates-to-olefins conversions
System for alarming upon occurrence of secession of smart key for vehicles
Timing and cell specific system information handling for handover in evolved UTRA
Apparatus and method for extracting cascading style sheet rules
High density molecular memory storage with read and write capabilities
Electromagnetic sensor cable and electrical configuration therefor
  Randomly Featured Patents
Crytographic method for anonymous authentication and separate identification of a user
Carbon dioxide treatment of epoxy resin compositions
Nanosoldering heating element
Surface acoustic wave filter
Multi-pulse pulse compression radar system
Novel pesticides and pesticidal compositions cyclopropanecarboxylates and pesticidal method
Apparatus for automatically controlling the position of a plurality of slitters
Scanning probe microscope using a surface drive actuator to position the scanning tip
Refrigeration process with purge and recovery of refrigerant
Archery bow flexible sight pin