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Class Information
Number: 438/672
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > And patterning of conductive layer > Plug formation (i.e., in viahole)
Description: Processes wherein the patterning step results in the remaining conductive material being recessed below the top surface of the substrate.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618892 |
Via hole forming method |
Nov. 17, 2009 |
| 7615486 |
Apparatus and method for integrated surface treatment and deposition for copper interconnect |
Nov. 10, 2009 |
| 7615484 |
Integrated circuit manufacturing method using hard mask |
Nov. 10, 2009 |
| 7611986 |
Dual damascene patterning method |
Nov. 3, 2009 |
| 7608905 |
Independently addressable interdigitated nanowires |
Oct. 27, 2009 |
| 7608537 |
Method for fabricating semiconductor device |
Oct. 27, 2009 |
| 7605081 |
Sub-lithographic feature patterning using self-aligned self-assembly polymers |
Oct. 20, 2009 |
| 7605035 |
Method of fabricating semiconductor device by exposing upper sidewalls of contact plug to form charge storage electrode |
Oct. 20, 2009 |
| 7601624 |
Device comprising an ohmic via contact, and method of fabricating thereof |
Oct. 13, 2009 |
| 7598171 |
Method of manufacturing a semiconductor device |
Oct. 6, 2009 |
| 7598165 |
Methods for forming a multiplexer of a memory device |
Oct. 6, 2009 |
| 7595556 |
Semiconductor device and method for manufacturing the same |
Sep. 29, 2009 |
| 7595267 |
Method of forming contact hole of semiconductor device |
Sep. 29, 2009 |
| 7592703 |
RF and MMIC stackable micro-modules |
Sep. 22, 2009 |
| 7592258 |
Metallization layer of a semiconductor device having differently thick metal lines and a method of forming the same |
Sep. 22, 2009 |
| 7592253 |
Method for forming a damascene pattern of a copper metallization layer |
Sep. 22, 2009 |
| 7592247 |
Sub-lithographic local interconnects, and methods for forming same |
Sep. 22, 2009 |
| 7589021 |
Copper metal interconnection with a local barrier metal layer |
Sep. 15, 2009 |
| 7585757 |
Semiconductor device and method of manufacturing the same |
Sep. 8, 2009 |
| 7585710 |
Methods of forming electronic devices having partially elevated source/drain structures |
Sep. 8, 2009 |
| 7582561 |
Method of selectively depositing materials on a substrate using a supercritical fluid |
Sep. 1, 2009 |
| 7579622 |
Fabrication of MEMS devices with spin-on glass |
Aug. 25, 2009 |
| 7572717 |
Method of manufacturing semiconductor device |
Aug. 11, 2009 |
| 7569453 |
Contact structure |
Aug. 4, 2009 |
| 7569404 |
Ink-jet printhead fabrication |
Aug. 4, 2009 |
| 7566658 |
Method for fabricating a metal interconnection using a dual damascene process and resulting semiconductor device |
Jul. 28, 2009 |
| 7563704 |
Method of forming an interconnect including a dielectric cap having a tensile stress |
Jul. 21, 2009 |
| 7560016 |
Selectively accelerated plating of metal features |
Jul. 14, 2009 |
| 7557039 |
Method for fabricating contact hole of semiconductor device |
Jul. 7, 2009 |
| 7557038 |
Method for fabricating self-aligned contact hole |
Jul. 7, 2009 |
| 7557029 |
Semiconductor device and fabrication process thereof |
Jul. 7, 2009 |
| 7553764 |
Silicon wafer having through-wafer vias |
Jun. 30, 2009 |
| 7553763 |
Salicide process utilizing a cluster ion implantation process |
Jun. 30, 2009 |
| 7547628 |
Method for manufacturing capacitor |
Jun. 16, 2009 |
| 7545045 |
Dummy via for reducing proximity effect and method of using the same |
Jun. 9, 2009 |
| 7544569 |
Bidirectional split gate NAND flash memory structure and array, method of programming, erasing and reading thereof, and method of manufacturing |
Jun. 9, 2009 |
| 7541276 |
Methods for forming dual damascene wiring for semiconductor devices using protective via capping layer |
Jun. 2, 2009 |
| 7537959 |
Chip stack package and manufacturing method thereof |
May. 26, 2009 |
| 7534725 |
Advanced process control for semiconductor processing |
May. 19, 2009 |
| 7527993 |
Method and structure for fabricating smooth mirrors for liquid crystal on silicon devices |
May. 5, 2009 |
| 7524758 |
Interconnect structure and method for semiconductor device |
Apr. 28, 2009 |
| 7521359 |
Interconnect structure encased with high and low k interlevel dielectrics |
Apr. 21, 2009 |
| 7521357 |
Methods of forming metal wiring in semiconductor devices using etch stop layers |
Apr. 21, 2009 |
| 7521348 |
Method of fabricating semiconductor device having fine contact holes |
Apr. 21, 2009 |
| 7517796 |
Method for patterning submicron pillars |
Apr. 14, 2009 |
| 7514362 |
Integrated circuit including sub-lithographic structures |
Apr. 7, 2009 |
| 7510970 |
Process for manufacturing semiconductor integrated circuit device |
Mar. 31, 2009 |
| 7510967 |
Method for manufacturing semiconductor device |
Mar. 31, 2009 |
| 7510965 |
Method for fabricating a dual damascene structure |
Mar. 31, 2009 |
| 7510963 |
Semiconductor device having multilayer interconnection structure and manufacturing method thereof |
Mar. 31, 2009 |
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