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Class Information
Number: 438/672
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > And patterning of conductive layer > Plug formation (i.e., in viahole)
Description: Processes wherein the patterning step results in the remaining conductive material being recessed below the top surface of the substrate.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710673 Wiring structure in a semiconductor device, method of forming the wiring structure, semiconductor device including the wiring structure and method of manufacturing the semiconductor device Apr. 29, 2014
8709948 Tungsten barrier and seed for copper filled TSV Apr. 29, 2014
8709944 Method to alter silicide properties using GCIB treatment Apr. 29, 2014
8704284 Semiconductor device having bit line expanding islands Apr. 22, 2014
8703612 Process for forming contact plugs Apr. 22, 2014
8703607 Method to alter silicide properties using GCIB treatment Apr. 22, 2014
8692381 Integrated circuits with a resistance to single event upset occurrence and methods for providing the same Apr. 8, 2014
8691693 Methods of manufacturing semiconductor device Apr. 8, 2014
8691692 Semiconductor chips and methods of forming the same Apr. 8, 2014
8691691 TSV pillar as an interconnecting structure Apr. 8, 2014
8686568 Semiconductor package substrates having layered circuit segments, and related methods Apr. 1, 2014
8685854 Method of forming a via in a semiconductor device Apr. 1, 2014
8679974 Method for fabricating interconnecting lines inside via holes of semiconductor device Mar. 25, 2014
8679966 Semiconductor device having Au-Cu electrodes, and method of manufacturing semiconductor device Mar. 25, 2014
8674517 Method of assembling two integrated circuits and corresponding structure Mar. 18, 2014
8673787 Method to reduce charge buildup during high aspect ratio contact etch Mar. 18, 2014
8673776 Method for manufacturing semiconductor device having interlayer dielectric layers and a gate contact Mar. 18, 2014
8673774 Method for forming a via in a substrate Mar. 18, 2014
8673769 Methods and apparatuses for three dimensional integrated circuits Mar. 18, 2014
8673767 Manufacturing method for semiconductor device Mar. 18, 2014
8669642 Semiconductor chip and fabricating method thereof Mar. 11, 2014
8669180 Semiconductor device with self aligned end-to-end conductive line structure and method of forming the same Mar. 11, 2014
8664114 Image sensor and method for fabricating the same Mar. 4, 2014
8658535 Optimized annular copper TSV Feb. 25, 2014
8652966 Semiconductor device manufacturing method and semiconductor device Feb. 18, 2014
8647958 Method for fabricating semiconductor device having expanded critical dimension by performining surface treatment Feb. 11, 2014
8637995 Bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate Jan. 28, 2014
8637397 Method for manufacturing a through hole electrode substrate Jan. 28, 2014
8633108 Dual damascene process Jan. 21, 2014
8629058 Methods for via structure with improved reliability Jan. 14, 2014
8617991 Method of manufacturing semiconductor device Dec. 31, 2013
8614146 Semiconductor device manufacture method and semiconductor device Dec. 24, 2013
8614145 Through substrate via formation processing using sacrificial material Dec. 24, 2013
8609535 Semiconductor package having through electrodes that reduce leakage current and method for manufacturing the same Dec. 17, 2013
8609532 Magnetically sintered conductive via Dec. 17, 2013
8609531 Methods of selectively forming ruthenium liner layer Dec. 17, 2013
8598034 Package-on-package system with through vias and method of manufacture thereof Dec. 3, 2013
8598011 Resistive memory device and method for fabricating the same Dec. 3, 2013
8592691 Printed wiring board Nov. 26, 2013
8580684 Contact elements of semiconductor devices comprising a continuous transition to metal lines of a metallization layer Nov. 12, 2013
8580676 Multiple layer barrier metal for device component formed in contact trench Nov. 12, 2013
8575024 Semiconductor device having air gap and method for manufacturing the same Nov. 5, 2013
8564061 Semiconductor device Oct. 22, 2013
8563432 Method for forming through silicon via structure Oct. 22, 2013
8563405 Method for manufacturing semiconductor device Oct. 22, 2013
8557701 Method for fabricating a semiconductor device with formation of conductive lines Oct. 15, 2013
8552565 Chip package and method for forming the same Oct. 8, 2013
8551878 Metal interconnection method of semiconductor device Oct. 8, 2013
8546255 Method for forming vias in a semiconductor substrate and a semiconductor device having the semiconductor substrate Oct. 1, 2013
8536050 Selective shrinkage of contact elements in a semiconductor device Sep. 17, 2013











 
 
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