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Class Information
Number: 438/668
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Specified configuration of electrode or contact > Specified aspect ratio of conductor or viahole
Description: Processes wherein the width-to-depth ratio or width-to-height ratio of the electrical conductor or the viahole in which the same is to reside is given.

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8709946 Method for forming contact hole Apr. 29, 2014
8686519 MEMS accelerometer using capacitive sensing and production method thereof Apr. 1, 2014
8637401 Methods and devices for high accuracy deposition on a continuously moving substrate Jan. 28, 2014
8617990 Reduced PTH pad for enabling core routing and substrate layer count reduction Dec. 31, 2013
8604621 Semiconductor device and information processing system including the same Dec. 10, 2013
8580682 Cost-effective TSV formation Nov. 12, 2013
8569888 Wiring structure and method of forming the structure Oct. 29, 2013
8557699 Semiconductor device and manufacturing method thereof Oct. 15, 2013
8558390 Semiconductor device Oct. 15, 2013
8552565 Chip package and method for forming the same Oct. 8, 2013
8522430 Clustered stacked vias for reliable electronic substrates Sep. 3, 2013
8519538 Laser etch via formation Aug. 27, 2013
8487439 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board Jul. 16, 2013
8455357 Method of plating through wafer vias in a wafer for 3D packaging Jun. 4, 2013
8445298 Process of producing liquid discharge head base material May. 21, 2013
8436473 Integrated circuits including air gaps around interconnect structures, and fabrication methods thereof May. 7, 2013
8421234 Semiconductor device and method of manufacturing the same Apr. 16, 2013
8415178 Process of producing liquid discharge head base material Apr. 9, 2013
8399352 Semiconductor device comprising self-aligned contact bars and metal lines with increased via landing regions Mar. 19, 2013
8378496 Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection Feb. 19, 2013
8329582 Semiconductor device and method of manufacturing the same Dec. 11, 2012
8309460 Methods of manufacturing semiconductor devices Nov. 13, 2012
8252683 3D interconnection structure and method of manufacturing the same Aug. 28, 2012
8232115 Test structure for determination of TSV depth Jul. 31, 2012
8227338 Semiconductor package including a top-surface metal layer for implementing circuit features Jul. 24, 2012
8203207 Electronic device packages and methods of formation Jun. 19, 2012
8193091 Resin encapsulated semiconductor device and method for manufacturing the same Jun. 5, 2012
8148264 Methods for fabrication of high aspect ratio micropillars and nanopillars Apr. 3, 2012
8138539 Semiconductor devices and methods of manufacture thereof Mar. 20, 2012
8129273 Semiconductor device and method for producing the same Mar. 6, 2012
8110900 Manufacturing process of semiconductor device and semiconductor device Feb. 7, 2012
8101976 Device selection circuitry constructed with nanotube ribbon technology Jan. 24, 2012
8030208 Bonding method for through-silicon-via based 3D wafer stacking Oct. 4, 2011
8026172 Method of forming contact hole arrays using a hybrid spacer technique Sep. 27, 2011
8021981 Redistribution layers for microfeature workpieces, and associated systems and methods Sep. 20, 2011
8003532 Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film Aug. 23, 2011
7998862 Method for fabricating semiconductor device Aug. 16, 2011
7981798 Method of manufacturing substrate Jul. 19, 2011
7977239 Semiconductor device and method for fabricating the same Jul. 12, 2011
7955975 Semiconductor element and display device using the same Jun. 7, 2011
7921550 Process of fabricating circuit structure Apr. 12, 2011
7910479 Method of manufacturing a photodiode array with through-wafer vias Mar. 22, 2011
7892969 Method of manufacturing semiconductor device Feb. 22, 2011
7871927 Wafer via formation Jan. 18, 2011
7858483 Method for fabricating capacitor of semiconductor device Dec. 28, 2010
7851361 Laser ablation to selectively thin wafers/die to lower device R.sub.DSON Dec. 14, 2010
7807569 Method of manufacturing a contact structure for a semiconductor device Oct. 5, 2010
7772118 Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same Aug. 10, 2010
7767516 Semiconductor device, manufacturing method thereof, and manufacturing method of antenna Aug. 3, 2010
7768132 Circuit device and manufacturing method thereof Aug. 3, 2010

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