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Class Information
Number: 438/667
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Specified configuration of electrode or contact > Conductive feedthrough or through-hole in substrate
Description: Processes wherein the electrically conductive material is formed upon one surface of the semiconductor substrate and is able to make electrical contact with the opposing surface of the semiconductor substrate.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8709945 Area efficient through-hole connections Apr. 29, 2014
8710591 Semiconductor chip, stack module, and memory card Apr. 29, 2014
8710648 Wafer level packaging structure with large contact area and preparation method thereof Apr. 29, 2014
8710670 Integrated circuit packaging system with coupling features and method of manufacture thereof Apr. 29, 2014
8709936 Method and structure of forming backside through silicon via connections Apr. 29, 2014
8704375 Barrier structures and methods for through substrate vias Apr. 22, 2014
8704358 Method for forming an integrated circuit Apr. 22, 2014
8704284 Semiconductor device having bit line expanding islands Apr. 22, 2014
8703610 Semiconductor device and method of forming conductive TSV with insulating annular ring Apr. 22, 2014
8703609 Through-substrate via for semiconductor device Apr. 22, 2014
8703518 Packaged microelectronic imagers and methods of packaging microelectronic imagers Apr. 22, 2014
8691692 Semiconductor chips and methods of forming the same Apr. 8, 2014
8691691 TSV pillar as an interconnecting structure Apr. 8, 2014
8686519 MEMS accelerometer using capacitive sensing and production method thereof Apr. 1, 2014
8686568 Semiconductor package substrates having layered circuit segments, and related methods Apr. 1, 2014
8679974 Method for fabricating interconnecting lines inside via holes of semiconductor device Mar. 25, 2014
8674517 Method of assembling two integrated circuits and corresponding structure Mar. 18, 2014
8673778 Tungsten film forming method Mar. 18, 2014
8673775 Methods of forming semiconductor structures Mar. 18, 2014
8673774 Method for forming a via in a substrate Mar. 18, 2014
8673741 Etching a laser-cut semiconductor before dicing a die attach film (DAF) or other material layer Mar. 18, 2014
8669643 Wiring board, semiconductor device, and method for manufacturing wiring board Mar. 11, 2014
8669179 Through-wafer interconnects for photoimager and memory wafers Mar. 11, 2014
8669178 Semiconductor device, circuit substrate, and electronic device Mar. 11, 2014
8669140 Method of forming stacked die package using redistributed chip packaging Mar. 11, 2014
8664090 Electronic component package fabrication method Mar. 4, 2014
8664106 Method of manufacturing semiconductor device Mar. 4, 2014
8664761 Semiconductor structure and manufacturing method of the same Mar. 4, 2014
8658535 Optimized annular copper TSV Feb. 25, 2014
8658534 Method for producing a semiconductor component, and semiconductor component Feb. 25, 2014
8647920 Method for forming 3D-interconnect structures with airgaps Feb. 11, 2014
8643191 On-chip radial cavity power divider/combiner Feb. 4, 2014
8643186 Processed wafer via Feb. 4, 2014
8643062 III-N device structures and methods Feb. 4, 2014
8642456 Implementing semiconductor signal-capable capacitors with deep trench and TSV technologies Feb. 4, 2014
8637995 Bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate Jan. 28, 2014
8637962 Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate Jan. 28, 2014
8637401 Methods and devices for high accuracy deposition on a continuously moving substrate Jan. 28, 2014
8637397 Method for manufacturing a through hole electrode substrate Jan. 28, 2014
8637380 Method of processing silicon and glass substrates using a laser peeling technique Jan. 28, 2014
8637350 Method of manufacturing chip-stacked semiconductor package Jan. 28, 2014
8633583 Semiconductor package substrate and methods for forming same, in particular for MEMS devices Jan. 21, 2014
8633580 Integrated void fill for through silicon via Jan. 21, 2014
8633572 Low ohmic through substrate interconnection for semiconductor carriers Jan. 21, 2014
8633107 Method of producing a semiconductor device and semiconductor device having a through-wafer interconnect Jan. 21, 2014
8633091 Chip package and fabrication method thereof Jan. 21, 2014
8629059 Methods of forming integrated circuit chips having vertically extended through-substrate vias therein Jan. 14, 2014
8629060 Methods of forming through substrate interconnects Jan. 14, 2014
8629061 Method for three-dimensional packaging of electronic devices Jan. 14, 2014
8623763 Protective layer for protecting TSV tips during thermo-compressive bonding Jan. 7, 2014

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