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Class Information
Number: 438/667
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Specified configuration of electrode or contact > Conductive feedthrough or through-hole in substrate
Description: Processes wherein the electrically conductive material is formed upon one surface of the semiconductor substrate and is able to make electrical contact with the opposing surface of the semiconductor substrate.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622384 |
Method of making multi-chip electronic package with reduced line skew |
Nov. 24, 2009 |
| 7618892 |
Via hole forming method |
Nov. 17, 2009 |
| 7615406 |
Electronic device package manufacturing method and electronic device package |
Nov. 10, 2009 |
| 7615487 |
Power delivery package having through wafer vias |
Nov. 10, 2009 |
| 7605079 |
Manufacturing method for phase change RAM with electrode layer process |
Oct. 20, 2009 |
| 7605080 |
Semiconductor device and method of manufacturing the same |
Oct. 20, 2009 |
| 7602047 |
Semiconductor device having through vias |
Oct. 13, 2009 |
| 7595220 |
Image sensor package and fabrication method thereof |
Sep. 29, 2009 |
| 7592703 |
RF and MMIC stackable micro-modules |
Sep. 22, 2009 |
| 7589009 |
Method for fabricating a top conductive layer in a semiconductor die and related structure |
Sep. 15, 2009 |
| 7579667 |
Bonded-wafer superjunction semiconductor device |
Aug. 25, 2009 |
| 7576004 |
Semiconductor chip and method of manufacturing semiconductor chip |
Aug. 18, 2009 |
| 7572730 |
Method of manufacturing wiring substrate, liquid ejection head and image forming apparatus |
Aug. 11, 2009 |
| 7566656 |
Method and apparatus for providing void structures |
Jul. 28, 2009 |
| 7566657 |
Methods of forming through-substrate interconnects |
Jul. 28, 2009 |
| 7564137 |
Stackable integrated circuit structures and systems devices and methods related thereto |
Jul. 21, 2009 |
| 7564118 |
Chip and wafer integration process using vertical connections |
Jul. 21, 2009 |
| 7557036 |
Method, system, and apparatus for filling vias |
Jul. 7, 2009 |
| 7557037 |
Method of manufacturing semiconductor chip |
Jul. 7, 2009 |
| 7553764 |
Silicon wafer having through-wafer vias |
Jun. 30, 2009 |
| 7553765 |
Method of manufacturing thin-film electronic device having a through-hole extending through the base and in communicative connection with an opening in the electrically conductive layer |
Jun. 30, 2009 |
| 7547630 |
Method for stacking semiconductor chips |
Jun. 16, 2009 |
| 7545044 |
Semiconductor device and radiation detector employing it |
Jun. 9, 2009 |
| 7544611 |
Method of manufacturing III-V nitride semiconductor device |
Jun. 9, 2009 |
| 7538032 |
Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method |
May. 26, 2009 |
| 7538033 |
Post-attachment chip-to-chip connection |
May. 26, 2009 |
| 7538413 |
Semiconductor components having through interconnects |
May. 26, 2009 |
| 7534722 |
Back-to-front via process |
May. 19, 2009 |
| 7531453 |
Microelectronic devices and methods for forming interconnects in microelectronic devices |
May. 12, 2009 |
| 7528068 |
Method for manufacturing semiconductor device |
May. 5, 2009 |
| 7524763 |
Fabrication method of wafer level chip scale packages |
Apr. 28, 2009 |
| 7521359 |
Interconnect structure encased with high and low k interlevel dielectrics |
Apr. 21, 2009 |
| 7521360 |
Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby |
Apr. 21, 2009 |
| 7517734 |
Method of manufacturing a wafer level package with a cap structure for hermetically sealing a micro device |
Apr. 14, 2009 |
| 7517797 |
Carrier for wafer-scale package, wafer-scale package including the carrier, and methods |
Apr. 14, 2009 |
| 7517798 |
Methods for forming through-wafer interconnects and structures resulting therefrom |
Apr. 14, 2009 |
| 7514355 |
Multilayer interconnection structure and method for forming the same |
Apr. 7, 2009 |
| 7510968 |
Cap for semiconductor device package, and manufacturing method thereof |
Mar. 31, 2009 |
| 7510965 |
Method for fabricating a dual damascene structure |
Mar. 31, 2009 |
| 7507637 |
Method of manufacturing wafer level stack package |
Mar. 24, 2009 |
| 7508079 |
Circuit substrate and method of manufacturing the same |
Mar. 24, 2009 |
| 7501338 |
Semiconductor package substrate fabrication method |
Mar. 10, 2009 |
| 7498259 |
Through electrode and method for forming the same |
Mar. 3, 2009 |
| 7498258 |
Through-hole conductors for semiconductor substrates and method for making same |
Mar. 3, 2009 |
| 7498260 |
Pass through via technology for use during the manufacture of a semiconductor device |
Mar. 3, 2009 |
| 7494925 |
Method for making through-hole conductors for semiconductor substrates |
Feb. 24, 2009 |
| 7495316 |
Methods of forming conductive vias and methods of forming multichip modules including such conductive vias |
Feb. 24, 2009 |
| 7488675 |
Method for fabricating IC board without ring structure |
Feb. 10, 2009 |
| 7476963 |
Three-dimensional stack manufacture for integrated circuit devices and method of manufacture |
Jan. 13, 2009 |
| 7476974 |
Method to fabricate interconnect structures |
Jan. 13, 2009 |
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