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Class Information
Number: 438/666
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Specified configuration of electrode or contact
Description: Processes wherein the ohmic electrode or contact has a specified shape or configuration.










Sub-classes under this class:

Class Number Class Name Patents
438/667 Conductive feedthrough or through-hole in substrate 888
438/668 Specified aspect ratio of conductor or viahole 298


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
8710666 Semiconductor device and method for fabricating the same Apr. 29, 2014
8710667 Semiconductor device Apr. 29, 2014
8710675 Integrated circuit package system with bonding lands Apr. 29, 2014
8710520 Light emitting diode having multi-cell structure and method of manufacturing the same Apr. 29, 2014
8704342 Resin sealing type semiconductor device and method of manufacturing the same, and lead frame Apr. 22, 2014
8703573 Semiconductor device and method of manufacturing the same Apr. 22, 2014
8703608 Control of local environment for polysilicon conductors in integrated circuits Apr. 22, 2014
8691610 Semiconductor device and method for manufacturing the same Apr. 8, 2014
8686385 Phase-change random access memory device and method of manufacturing the same Apr. 1, 2014
8679974 Method for fabricating interconnecting lines inside via holes of semiconductor device Mar. 25, 2014
8680677 Carbon nanotube-based conductive connections for integrated circuit devices Mar. 25, 2014
8669180 Semiconductor device with self aligned end-to-end conductive line structure and method of forming the same Mar. 11, 2014
8669178 Semiconductor device, circuit substrate, and electronic device Mar. 11, 2014
8669582 Light emitting diode Mar. 11, 2014
8664106 Method of manufacturing semiconductor device Mar. 4, 2014
8658524 On-gate contacts in a MOS device Feb. 25, 2014
8652924 Methods of fabricating a storage node in a semiconductor device and methods of fabricating a capacitor using the same Feb. 18, 2014
8647961 Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches Feb. 11, 2014
8647976 Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same Feb. 11, 2014
8648467 Semiconductor memory device and method of manufacturing the same Feb. 11, 2014
8642464 Method of manufacturing semiconductor device Feb. 4, 2014
8642465 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus Feb. 4, 2014
8642469 Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer Feb. 4, 2014
8637982 Split loop cut pattern for spacer process Jan. 28, 2014
8637401 Methods and devices for high accuracy deposition on a continuously moving substrate Jan. 28, 2014
8637374 Method of fabricating self-aligned nanotube field effect transistor Jan. 28, 2014
8629052 Methods of forming semiconductor devices having narrow conductive line patterns Jan. 14, 2014
8629060 Methods of forming through substrate interconnects Jan. 14, 2014
8617986 Integrated circuits and methods for forming the integrated circuits Dec. 31, 2013
8614145 Through substrate via formation processing using sacrificial material Dec. 24, 2013
8614514 Micro-spring chip attachment using ribbon bonds Dec. 24, 2013
8609491 Method for fabricating semiconductor device with buried bit lines Dec. 17, 2013
8609536 Stair step formation using at least two masks Dec. 17, 2013
8598710 Semiconductor device with dummy contacts Dec. 3, 2013
8592255 Method for electrically connecting dual silicon-on-insulator device layers Nov. 26, 2013
8586472 Conductive lines and pads and method of manufacturing thereof Nov. 19, 2013
8586476 Fabrication method for circuit substrate having post-fed die side power supply connections Nov. 19, 2013
8587134 Semiconductor packages Nov. 19, 2013
8580675 Two-track cross-connect in double-patterned structure using rectangular via Nov. 12, 2013
8580681 Manufacturing method of device Nov. 12, 2013
8580682 Cost-effective TSV formation Nov. 12, 2013
8575025 Templated circuitry fabrication Nov. 5, 2013
8575022 Top corner rounding of damascene wire for insulator crack suppression Nov. 5, 2013
8563346 Method for manufacturing electrode of dye-sensitized solar cell and dye-sensitized solar cell having electrode thereof Oct. 22, 2013
8564030 Self-aligned trench contact and local interconnect with replacement gate process Oct. 22, 2013
8558348 Variable resistance memory device and methods of forming the same Oct. 15, 2013
8552557 Electronic component package fabrication method and structure Oct. 8, 2013
8552562 Profiled contact for semiconductor device Oct. 8, 2013
8552565 Chip package and method for forming the same Oct. 8, 2013
8547167 Die power structure Oct. 1, 2013

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19










 
 
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