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Class Information
Number: 438/665
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Utilizing textured surface
Description: Processes wherein a surface is roughened at some stage in the process.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7407862 |
Method for manufacturing ferroelectric memory device |
Aug. 5, 2008 |
| 7309650 |
Memory device having a nanocrystal charge storage region and method |
Dec. 18, 2007 |
| 7298002 |
Hemispherical silicon grain capacitor with variable grain size |
Nov. 20, 2007 |
| 7271071 |
Method of forming a catalytic surface comprising at least one of Pt, Pd, Co and Au in at least one of elemental and alloy forms |
Sep. 18, 2007 |
| 7253104 |
Methods of forming particle-containing materials |
Aug. 7, 2007 |
| 7220670 |
Method of producing rough polysilicon by the use of pulsed plasma chemical vapor deposition and products produced by same |
May. 22, 2007 |
| 7214569 |
Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
May. 8, 2007 |
| 7199043 |
Method of forming copper wiring in semiconductor device |
Apr. 3, 2007 |
| 7196000 |
Method for manufacturing a wafer level chip scale package |
Mar. 27, 2007 |
| 7183196 |
Multilayer interconnection board and production method thereof |
Feb. 27, 2007 |
| 7170176 |
Semiconductor device |
Jan. 30, 2007 |
| 7160744 |
Fabrication method of light emitting diode incorporating substrate surface treatment by laser and light emitting diode fabricated thereby |
Jan. 9, 2007 |
| 7132345 |
Method for fabricating flash memory device |
Nov. 7, 2006 |
| 7122456 |
Method for reduced input output area |
Oct. 17, 2006 |
| 7105384 |
Circuit device manufacturing method including mounting circuit elements on a conductive foil, forming separation grooves in the foil, and etching the rear of the foil |
Sep. 12, 2006 |
| 7101760 |
Charge trapping nanocrystal dielectric for non-volatile memory transistor |
Sep. 5, 2006 |
| 7078333 |
Method to improve adhesion of dielectric films in damascene interconnects |
Jul. 18, 2006 |
| 7041550 |
Device and method for protecting against oxidation of a conductive layer in said device |
May. 9, 2006 |
| 7022570 |
Methods of forming hemispherical grained silicon on a template on a semiconductor work object |
Apr. 4, 2006 |
| 7022603 |
Method for fabricating semiconductor device having stacked-gate structure |
Apr. 4, 2006 |
| 6987070 |
Method for forming low-k dielectric layer of semiconductor device |
Jan. 17, 2006 |
| 6977213 |
IC chip solder bump structure and method of manufacturing same |
Dec. 20, 2005 |
| 6949434 |
Method of manufacturing a vertical semiconductor device |
Sep. 27, 2005 |
| 6924523 |
Semiconductor memory device and method for manufacturing the device |
Aug. 2, 2005 |
| 6884691 |
Method of forming a substrate having a surface comprising at least one of Pt, Pd, Co and Au in at least one of elemental and alloy forms |
Apr. 26, 2005 |
| 6858894 |
Comprising agglomerates of one or more noble metals |
Feb. 22, 2005 |
| 6855596 |
Method for manufacturing a trench capacitor having an isolation trench |
Feb. 15, 2005 |
| 6849498 |
Method of manufacturing semiconductor capacitor |
Feb. 1, 2005 |
| 6835617 |
Methods of forming hemispherical grained silicon on a template on a semiconductor work object |
Dec. 28, 2004 |
| 6828193 |
Methods of forming hemispherical grained silicon on a template on a semiconductor work object |
Dec. 7, 2004 |
| 6815289 |
Method of manufacturing semiconductor device |
Nov. 9, 2004 |
| 6812112 |
Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers |
Nov. 2, 2004 |
| 6800901 |
Process for the selective formation of salicide on active areas of MOS devices |
Oct. 5, 2004 |
| 6797605 |
Method to improve adhesion of dielectric films in damascene interconnects |
Sep. 28, 2004 |
| 6770528 |
Method of forming a data-storing capacitive element made in an insulating film on a semiconductor substrate |
Aug. 3, 2004 |
| 6764943 |
Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers |
Jul. 20, 2004 |
| 6762121 |
Method of forming refractory metal contact in an opening, and resulting structure |
Jul. 13, 2004 |
| 6723576 |
Disposing method for semiconductor elements |
Apr. 20, 2004 |
| 6720257 |
Bump with basic metallization and method for manufacturing the basic metallization |
Apr. 13, 2004 |
| 6699745 |
Capacitor and memory structure and method |
Mar. 2, 2004 |
| 6693031 |
Formation of a metallic interlocking structure |
Feb. 17, 2004 |
| 6677217 |
Methods for manufacturing integrated circuit metal-insulator-metal capacitors including hemispherical grain lumps |
Jan. 13, 2004 |
| 6624069 |
Methods of forming integrated circuit capacitors having doped HSG electrodes |
Sep. 23, 2003 |
| 6608343 |
Rough (high surface area) electrode from Ti and TiN, capacitors and semiconductor devices including same |
Aug. 19, 2003 |
| 6586338 |
Methods for creating elements of predetermined shape and apparatus using these elements |
Jul. 1, 2003 |
| 6555764 |
Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor |
Apr. 29, 2003 |
| 6555430 |
Process flow for capacitance enhancement in a DRAM trench |
Apr. 29, 2003 |
| 6548351 |
Method for fabricating semiconductor capacitor |
Apr. 15, 2003 |
| 6544842 |
Method of forming hemisphere grained silicon on a template on a semiconductor work object |
Apr. 8, 2003 |
| 6541352 |
Semiconductor die with contoured bottom surface and method for making same |
Apr. 1, 2003 |
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