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Class Information
Number: 438/664
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Including heat treatment of conductive layer > Rapid thermal anneal > Forming silicide
Description: Processes wherein the rapid thermal anneal results in the formation of a single silicide layer by the reaction of a conductive layer and a silicon substrate region.


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
7622387 Gate electrode silicidation process Nov. 24, 2009
7605068 Semiconductor device having a silicide layer and manufacturing method thereof Oct. 20, 2009
7595264 Fabrication method of semiconductor device Sep. 29, 2009
7589009 Method for fabricating a top conductive layer in a semiconductor die and related structure Sep. 15, 2009
7589007 MESFETs integrated with MOSFETs on common substrate and methods of forming the same Sep. 15, 2009
7572722 Method of fabricating nickel silicide Aug. 11, 2009
7572723 Micropad for bonding and a method therefor Aug. 11, 2009
7569483 Methods of forming metal silicide layers by annealing metal layers using inert heat transferring gases established in a convection apparatus Aug. 4, 2009
7560331 Method for forming a silicided gate Jul. 14, 2009
7560379 Semiconductive device fabricated using a raised layer to silicide the gate Jul. 14, 2009
7557032 Silicided recessed silicon Jul. 7, 2009
7553762 Method for forming metal silicide layer Jun. 30, 2009
7550372 Method of fabricating conductive lines with silicide layer Jun. 23, 2009
7547607 Methods of fabricating integrated circuit capacitors using a dry etching process Jun. 16, 2009
7544616 Methods of forming nitride read only memory and word lines thereof Jun. 9, 2009
7544575 Dual metal silicide scheme using a dual spacer process Jun. 9, 2009
7531459 Methods of forming self-aligned silicide layers using multiple thermal processes May. 12, 2009
7528067 MOSFET structure with multiple self-aligned silicide contacts May. 5, 2009
7524751 Method for forming contact hole in semiconductor device Apr. 28, 2009
7517795 Stabilization of Ni monosilicide thin films in CMOS devices using implantation of ions before silicidation Apr. 14, 2009
7504329 Method of forming a Yb-doped Ni full silicidation low work function gate electrode for n-MOSFET Mar. 17, 2009
7501333 Work function adjustment on fully silicided (FUSI) gate Mar. 10, 2009
7491635 Method for forming a fully silicided gate and devices obtained thereof Feb. 17, 2009
7485558 Method of manufacturing semiconductor device Feb. 3, 2009
7456096 Method of manufacturing silicide layer for semiconductor device Nov. 25, 2008
7446008 Method for fabricating silicide layers for semiconductor device Nov. 4, 2008
7446043 Contact structure having silicide layers, semiconductor device employing the same, and methods of fabricating the contact structure and semiconductor device Nov. 4, 2008
7419905 Gate electrodes and the formation thereof Sep. 2, 2008
7417290 Air break for improved silicide formation with composite caps Aug. 26, 2008
7396764 Manufacturing method for forming all regions of the gate electrode silicided Jul. 8, 2008
7390729 Method of fabricating a semiconductor device Jun. 24, 2008
7361597 Semiconductor device and method of fabricating the same Apr. 22, 2008
7348230 Manufacturing method of semiconductor device Mar. 25, 2008
7344984 Technique for enhancing stress transfer into channel regions of NMOS and PMOS transistors Mar. 18, 2008
7344983 Clustered surface preparation for silicide and metal contacts Mar. 18, 2008
7344978 Fabrication method of semiconductor device Mar. 18, 2008
7341933 Method for manufacturing a silicided gate electrode using a buffer layer Mar. 11, 2008
7329604 Semiconductor device and method for fabricating the same Feb. 12, 2008
7326644 Semiconductor device and method of fabricating the same Feb. 5, 2008
7320938 Method for reducing dendrite formation in nickel silicon salicide processes Jan. 22, 2008
7307322 Ultra-uniform silicide system in integrated circuit technology Dec. 11, 2007
7303990 Nickel-silicon compound forming method, semiconductor device manufacturing method, and semiconductor device Dec. 4, 2007
7294570 Contact integration method Nov. 13, 2007
7285485 Method for forming a gate in a semiconductor, which prevents gate leaning caused by thermal processing Oct. 23, 2007
7285491 Salicide process Oct. 23, 2007
7265040 Cleaning solution and method for selectively removing layer in a silicidation process Sep. 4, 2007
7238612 Methods of forming a double metal salicide layer and methods of fabricating semiconductor devices incorporating the same Jul. 3, 2007
7238611 Salicide process Jul. 3, 2007
7235481 Method of manufacturing a semiconductor device having a silicidation blocking layer Jun. 26, 2007
7226859 Method of forming different silicide portions on different silicon-containing regions in a semiconductor device Jun. 5, 2007

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