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Class Information
Number: 438/661
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Including heat treatment of conductive layer > Subsequent fusing conductive layer
Description: Processes wherein the conductive layer is melted subsequent to the deposition thereof.

Sub-classes under this class:

Class Number Class Name Patents
438/662 Utilizing laser 175

Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8691685 Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures Apr. 8, 2014
8679964 Prevention and control of intermetallic alloy inclusions Mar. 25, 2014
8647959 Metal-insulator-metal capacitor alloying process Feb. 11, 2014
8642458 Method of fabricating nonvolatile memory device Feb. 4, 2014
8541304 Production of TSV interconnection structures made up of an insulating contour and a conductive zone situated in the contour and disconnected from the contour Sep. 24, 2013
8513123 Method of manufacturing solid electrolytic capacitor Aug. 20, 2013
8410592 Semiconductor device and method for producing the same Apr. 2, 2013
8357607 Method for fabricating nitride-based semiconductor device having electrode on m-plane Jan. 22, 2013
8334199 Method for fabricating nitride-based semiconductor device having electrode on m-plane Dec. 18, 2012
8318594 Method for fabricating nitride-based semiconductor device having electrode on m-plane Nov. 27, 2012
8298905 Method for forming functional element using metal-to-insulator transition material, functional element formed by method, method for producing functional device, and functional device produced Oct. 30, 2012
8177862 Thermal compressive bond head May. 15, 2012
8119492 Dissolving precipates in alloy material in capacitor structure Feb. 21, 2012
8119450 Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots Feb. 21, 2012
8110504 Method of manufacturing semiconductor device Feb. 7, 2012
8071472 Semiconductor device with solder balls having high reliability Dec. 6, 2011
8008171 Method of fabricating polycrystalline semiconductor Aug. 30, 2011
7888737 Semiconductor device and method of manufacturing the same Feb. 15, 2011
7863190 Method of selective coverage of high aspect ratio structures with a conformal film Jan. 4, 2011
7816202 Method for fabricating capacitor in semiconductor device Oct. 19, 2010
7811932 3-D semiconductor die structure with containing feature and method Oct. 12, 2010
7781323 Semiconductor device and manufacturing method thereof Aug. 24, 2010
7745266 Method of forming a fuse part Jun. 29, 2010
7723158 Method for producing and cleaning surface-mountable bases with external contacts May. 25, 2010
7709378 Method and apparatus for processing thin metal layers May. 4, 2010
7666790 Silicide gate field effect transistors and methods for fabrication thereof Feb. 23, 2010
7638433 Semiconductor device and method of fabricating the same Dec. 29, 2009
7491646 Electrically conductive feature fabrication process Feb. 17, 2009
7435679 Alloyed underlayer for microelectronic interconnects Oct. 14, 2008
7394150 Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys Jul. 1, 2008
7358181 Method for structuring a semiconductor device Apr. 15, 2008
7205230 Process for manufacturing a wiring board having a via Apr. 17, 2007
7115503 Method and apparatus for processing thin metal layers Oct. 3, 2006
7083850 Electrically conductive thermal interface Aug. 1, 2006
7064063 Photo-thermal induced diffusion Jun. 20, 2006
7049230 Method of forming a contact plug in a semiconductor device May. 23, 2006
7033930 Interconnect structures in a semiconductor device and processes of formation Apr. 25, 2006
6987070 Method for forming low-k dielectric layer of semiconductor device Jan. 17, 2006
6967162 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding Nov. 22, 2005
6872643 Implant damage removal by laser thermal annealing Mar. 29, 2005
6841473 Manufacturing an integrated circuit with low solubility metal-conductor interconnect cap Jan. 11, 2005
6825114 Selective stress-inducing implant and resulting pattern distortion in amorphous carbon patterning Nov. 30, 2004
6821888 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding Nov. 23, 2004
6821814 Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package Nov. 23, 2004
6790757 Wire bonding method for copper interconnects in semiconductor devices Sep. 14, 2004
6784017 Method of creating a high performance organic semiconductor device Aug. 31, 2004
6774035 Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication Aug. 10, 2004
6774025 Method for producing group III nitride compound semiconductor light-emitting element Aug. 10, 2004
6757971 Filling plugs through chemical mechanical polish Jul. 6, 2004
6737287 Ink used for ink jet, and methods for manufacturing conductive film, electron-emitting device, electron source and image-forming apparatus May. 18, 2004

1 2 3 4

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