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Class Information
Number: 438/660
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Including heat treatment of conductive layer
Description: Processes wherein a thermal treatment is performed on the electrically conductive layer (e.g., for modifying the electrical properties thereof, etc.).


Sub-classes under this class:

Class Number Class Name Patents
438/663 Rapid thermal anneal 256
438/661 Subsequent fusing conductive layer 130


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Patent Number Title Of Patent Date Issued
7622329 Method for fabricating core substrate using paste bumps Nov. 24, 2009
7621044 Method of manufacturing a resilient contact Nov. 24, 2009
7601638 Interconnect metallization method having thermally treated copper plate film with reduced micro-voids Oct. 13, 2009
7601575 Integration of pre-S/D anneal selective nitride/oxide composite cap for improving transistor performance Oct. 13, 2009
7576005 Dense seed layer and method of formation Aug. 18, 2009
7572718 Semiconductor device and manufacturing method thereof Aug. 11, 2009
7569484 Plasma and electron beam etching device and method Aug. 4, 2009
7541207 Light emitting device and method of manufacturing the same Jun. 2, 2009
7538030 Semiconductor device and method of manufacturing same May. 26, 2009
7538031 Method of manufacturing a wiring substrate and an electronic instrument May. 26, 2009
7531447 Process for forming integrated circuit comprising copper lines May. 12, 2009
7528024 Dual work function metal gate integration in semiconductor devices May. 5, 2009
7527497 Heat treating apparatus, heat treating method, and storage medium May. 5, 2009
7507647 Method of manufacturing a high voltage semiconductor device including a deep well and a gate oxide layer simultaneously Mar. 24, 2009
7494923 Manufacturing method of wiring substrate and semiconductor device Feb. 24, 2009
7485560 Method for fabricating crystalline silicon thin films Feb. 3, 2009
7485575 Method of manufacturing semiconductor device Feb. 3, 2009
7479451 Display device manufacturing method preventing diffusion of an aluminum element into a polysilicon layer in a heating step Jan. 20, 2009
7468320 Reduced electromigration and stressed induced migration of copper wires by surface coating Dec. 23, 2008
7465977 Method for producing a packaged integrated circuit Dec. 16, 2008
7462942 Die pillar structures and a method of their formation Dec. 9, 2008
7439137 Method for manufacturing semiconductor device Oct. 21, 2008
7432173 Methods of fabricating silicon-on-insulator substrates having a laser-formed single crystalline film Oct. 7, 2008
7419907 Eliminating metal-rich silicides using an amorphous Ni alloy silicide structure Sep. 2, 2008
7405156 Method of forming wiring pattern Jul. 29, 2008
7375031 Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity May. 20, 2008
7364968 Capacitor in semiconductor device and manufacturing method Apr. 29, 2008
7358175 Serial thermal processor arrangement Apr. 15, 2008
7354848 Poly-silicon-germanium gate stack and method for forming the same Apr. 8, 2008
7344979 High pressure treatment for improved grain growth and void reduction Mar. 18, 2008
7335596 Method for fabricating copper-based interconnections for semiconductor device Feb. 26, 2008
7326649 Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same Feb. 5, 2008
7323783 Electrode, method for producing same and semiconductor device using same Jan. 29, 2008
7316969 Method and apparatus for thermally treating substrates Jan. 8, 2008
7313931 Method and device for heat treatment Jan. 1, 2008
7312148 Copper barrier reflow process employing high speed optical annealing Dec. 25, 2007
7301129 Control circuit for semiconductor device having overheating protection function Nov. 27, 2007
7297626 Process for nickel silicide Ohmic contacts to n-SiC Nov. 20, 2007
7294570 Contact integration method Nov. 13, 2007
7288442 Method for manufacturing contact structures of wirings Oct. 30, 2007
7276438 Method of manufacturing wiring substrate Oct. 2, 2007
7271038 Methods of forming ruthenium film by changing process conditions during chemical vapor deposition and ruthenium films formed thereby Sep. 18, 2007
7268029 Method of fabricating CMOS transistor that prevents gate thinning Sep. 11, 2007
7262105 Semiconductor device with silicided source/drains Aug. 28, 2007
7259094 Apparatus and method for heat treating thin film Aug. 21, 2007
7256122 Method of fabricating semiconductor device Aug. 14, 2007
7256123 Method of forming an interface for a semiconductor device Aug. 14, 2007
7256125 Method of manufacturing a semiconductor device Aug. 14, 2007
7238613 Diffusion-enhanced crystallization of amorphous materials to improve surface roughness Jul. 3, 2007
7238617 Method for fabricating semiconductor device to minimize terminal effect in ECP process Jul. 3, 2007

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15


 
 
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