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Class Information
Number: 438/656
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Plural layered electrode or conductor > Having refractory group metal (i.e., titanium (ti), zirconium (zr), hafnium (hf), vanadium (v), niobium (nb), tantalum (ta), chromium (cr), molybdenum (mo), tungsten (w), or alloy thereof)
Description: Processes wherein at least one of the diverse conductive layers is formed using a refractory metal (i.e., titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), or tungsten (W), or alloy thereof).










Patents under this class:

Patent Number Title Of Patent Date Issued
8709943 Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region Apr. 29, 2014
8691691 TSV pillar as an interconnecting structure Apr. 8, 2014
8680682 Barrier for through-silicon via Mar. 25, 2014
8679978 Method for forming a film including Zr, Hf or the like, and method for manufacturing a semiconductor device using the same Mar. 25, 2014
8664105 Mitigation of silicide formation on wafer bevel Mar. 4, 2014
8647980 Method of forming wiring and method of manufacturing semiconductor substrates Feb. 11, 2014
8642468 NMOS metal gate materials, manufacturing methods, and equipment using CVD and ALD processes with metal based precursors Feb. 4, 2014
8642434 Structure and method for mobility enhanced MOSFETS with unalloyed silicide Feb. 4, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8603908 Mitigation of silicide formation on wafer bevel Dec. 10, 2013
8592307 Modulated deposition process for stress control in thick TiN films Nov. 26, 2013
8575000 Copper interconnects separated by air gaps and method of making thereof Nov. 5, 2013
8557697 Vapor deposition methods for forming a metal-containing layer on a substrate Oct. 15, 2013
8551851 Titanium-based high-K dielectric films Oct. 8, 2013
8529802 Solution composition and method of forming thin film and method of manufacturing thin film transistor using the solution composition Sep. 10, 2013
8524591 Maintaining integrity of a high-K gate stack by passivation using an oxygen plasma Sep. 3, 2013
8518765 Aqua regia and hydrogen peroxide HCl combination to remove Ni and NiPt residues Aug. 27, 2013
8507379 Semiconductor device and manufacturing method thereof Aug. 13, 2013
8492808 Semiconductor device and manufacturing method thereof Jul. 23, 2013
8466006 Thermally insulated phase material cells Jun. 18, 2013
8461044 Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region Jun. 11, 2013
8455352 Method for removing native oxide and associated residue from a substrate Jun. 4, 2013
8450772 Phase change RAM device and method for manufacturing the same May. 28, 2013
8450207 Method of fabricating a cell contact and a digit line for a semiconductor device May. 28, 2013
8449731 Method and apparatus for increasing local plasma density in magnetically confined plasma May. 28, 2013
8435886 Method and system for binding halide-based contaminants May. 7, 2013
8420519 Methods for fabricating integrated circuits with controlled P-channel threshold voltage Apr. 16, 2013
8409953 Method of manufacturing a semiconductor device Apr. 2, 2013
8389403 Semiconductor device and method for manufacturing the same Mar. 5, 2013
8372739 Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication Feb. 12, 2013
8367546 Methods for forming all tungsten contacts and lines Feb. 5, 2013
8357611 Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof Jan. 22, 2013
8357607 Method for fabricating nitride-based semiconductor device having electrode on m-plane Jan. 22, 2013
8354306 Method of fabricating organic light emitting diode display Jan. 15, 2013
8350344 Semiconductor device and method of fabricating the same Jan. 8, 2013
8344513 Barrier for through-silicon via Jan. 1, 2013
8334205 Method for removing polymer after etching gate stack structure of high-K gate dielectric/metal gate Dec. 18, 2012
8334199 Method for fabricating nitride-based semiconductor device having electrode on m-plane Dec. 18, 2012
8330234 Semiconductor device and manufacturing process therefor Dec. 11, 2012
8329576 Method for improving uniformity and adhesion of low resistivity tungsten film Dec. 11, 2012
8324098 Via and method of forming the via with a substantially planar top surface that is suitable for carbon nanotube applications Dec. 4, 2012
8318594 Method for fabricating nitride-based semiconductor device having electrode on m-plane Nov. 27, 2012
8304335 Electrode structure, semiconductor element, and methods of manufacturing the same Nov. 6, 2012
8278218 Electrical conductor line having a multilayer diffusion barrier for use in a semiconductor device and method for forming the same Oct. 2, 2012
8278212 Method for manufacturing semiconductor memory element and sputtering apparatus Oct. 2, 2012
8236691 Method of high aspect ratio plug fill Aug. 7, 2012
8232190 Three dimensional vertical E-fuse structures and methods of manufacturing the same Jul. 31, 2012
8227340 Method for producing a copper connection between two sides of a substrate Jul. 24, 2012
8227333 Ni plating of a BLM edge for Pb-free C4 undercut control Jul. 24, 2012
8222713 Storage element and storage apparatus Jul. 17, 2012











 
 
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