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Class Information
Number: 438/655
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Plural layered electrode or conductor > Silicide
Description: Processes wherein at least one of the diverse conductive layers is formed by the chemical combination of silicon (Si) with a metal atom.


Patents under this class:
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Patent Number Title Of Patent Date Issued
7622386 Method for improved formation of nickel silicide contacts in semiconductor devices Nov. 24, 2009
7618891 Method for forming self-aligned metal silicide contacts Nov. 17, 2009
7611943 Transistors, integrated circuits, systems, and processes of manufacture with improved work function modulation Nov. 3, 2009
7605033 Low resistance peripheral local interconnect contacts with selective wet strip of titanium Oct. 20, 2009
7601610 Method for manufacturing a high integration density power MOS device Oct. 13, 2009
7589007 MESFETs integrated with MOSFETs on common substrate and methods of forming the same Sep. 15, 2009
7585738 Method of forming a fully silicided semiconductor device with independent gate and source/drain doping and related device Sep. 8, 2009
7585767 Semiconductor device and method for fabricating the same Sep. 8, 2009
7582535 Method of forming MOS transistor having fully silicided metal gate electrode Sep. 1, 2009
7572723 Micropad for bonding and a method therefor Aug. 11, 2009
7557040 Method of manufacture of semiconductor device Jul. 7, 2009
7553762 Method for forming metal silicide layer Jun. 30, 2009
7553729 Method of manufacturing non-volatile memory device Jun. 30, 2009
7550356 Method of fabricating strained-silicon transistors Jun. 23, 2009
7550372 Method of fabricating conductive lines with silicide layer Jun. 23, 2009
7550381 Contact clean by remote plasma and repair of silicide surface Jun. 23, 2009
7544553 Integration scheme for fully silicided gate Jun. 9, 2009
7544616 Methods of forming nitride read only memory and word lines thereof Jun. 9, 2009
7538029 Method of room temperature growth of SiO.sub.x on silicide as an etch stop layer for metal contact open of semiconductor devices May. 26, 2009
7537998 Method for forming salicide in semiconductor device May. 26, 2009
7538016 Signal and/or ground planes with double buried insulator layers and fabrication process May. 26, 2009
7534732 Semiconductor devices with copper interconnects and composite silicon nitride capping layers May. 19, 2009
7531459 Methods of forming self-aligned silicide layers using multiple thermal processes May. 12, 2009
7528067 MOSFET structure with multiple self-aligned silicide contacts May. 5, 2009
7528070 Sputtering apparatus and method for forming metal silicide layer using the same May. 5, 2009
7524682 Method for monitoring temperature in thermal process Apr. 28, 2009
7510956 MOS device with multi-layer gate stack Mar. 31, 2009
7504336 Methods for forming CMOS devices with intrinsically stressed metal silicide layers Mar. 17, 2009
7501333 Work function adjustment on fully silicided (FUSI) gate Mar. 10, 2009
7495299 Semiconductor device Feb. 24, 2009
7494859 Semiconductor device having metal gate patterns and related method of manufacture Feb. 24, 2009
7488637 CMOS image sensor and method for forming the same Feb. 10, 2009
7485522 Method of manufacturing semiconductor device having dual gate electrode Feb. 3, 2009
7485558 Method of manufacturing semiconductor device Feb. 3, 2009
7482270 Fully and uniformly silicided gate structure and method for forming same Jan. 27, 2009
7479682 Structure of a field effect transistor having metallic silicide and manufacturing method thereof Jan. 20, 2009
7476581 Method of manufacturing semiconductor device having dual gate electrode Jan. 13, 2009
7465660 Graded/stepped silicide process to improve MOS transistor Dec. 16, 2008
7465620 Transistor mobility improvement by adjusting stress in shallow trench isolation Dec. 16, 2008
7449410 Methods of forming CoSi.sub.2, methods of forming field effect transistors, and methods of forming conductive contacts Nov. 11, 2008
7446062 Device having dual etch stop liner and reformed silicide layer and related methods Nov. 4, 2008
7432184 Integrated PVD system using designated PVD chambers Oct. 7, 2008
7429770 Semiconductor device and manufacturing method thereof Sep. 30, 2008
7419907 Eliminating metal-rich silicides using an amorphous Ni alloy silicide structure Sep. 2, 2008
7411254 Semiconductor substrate Aug. 12, 2008
7407880 Semiconductor device and manufacturing process therefore Aug. 5, 2008
7407882 Semiconductor component having a contact structure and method of manufacture Aug. 5, 2008
7405112 Low contact resistance CMOS circuits and methods for their fabrication Jul. 29, 2008
7405101 CMOS imager with selectively silicided gate Jul. 29, 2008
7399701 Semiconductor device manufacturing method including forming a metal silicide layer on an indium-containing layer Jul. 15, 2008

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