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Class Information
Number: 438/654
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Plural layered electrode or conductor > Having adhesion promoting layer
Description: Processes wherein a material (e.g., layer, etc.) is utilized to promote adhesion of the electrical contact or lead to an adjacent surface.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7432195 |
Method for integrating a conformal ruthenium layer into copper metallization of high aspect ratio features |
Oct. 7, 2008 |
| 7365007 |
Interconnects with direct metalization and conductive polymer |
Apr. 29, 2008 |
| 7354848 |
Poly-silicon-germanium gate stack and method for forming the same |
Apr. 8, 2008 |
| 7348268 |
Controlled breakdown phase change memory device |
Mar. 25, 2008 |
| 7329563 |
Method for fabrication of wafer level package incorporating dual compliant layers |
Feb. 12, 2008 |
| 7329603 |
Semiconductor device and manufacturing method thereof |
Feb. 12, 2008 |
| 7276441 |
Dielectric barrier layer for increasing electromigration lifetimes in copper interconnect structures |
Oct. 2, 2007 |
| 7276386 |
Semiconductor device and method of manufacturing the same |
Oct. 2, 2007 |
| 7265049 |
Ultrathin chemically grown oxide film as a dopant diffusion barrier in semiconductor devices |
Sep. 4, 2007 |
| 7259096 |
Method for forming aluminum interconnect |
Aug. 21, 2007 |
| 7247524 |
Manufacturing method of wiring substrate |
Jul. 24, 2007 |
| 7229913 |
Stitched micro-via to enhance adhesion and mechanical strength |
Jun. 12, 2007 |
| 7223685 |
Damascene fabrication with electrochemical layer removal |
May. 29, 2007 |
| 7220665 |
H.sub.2 plasma treatment |
May. 22, 2007 |
| 7217652 |
Method of forming highly conductive semiconductor structures via plasma etch |
May. 15, 2007 |
| 7217656 |
Structure and method for bond pads of copper-metallized integrated circuits |
May. 15, 2007 |
| 7214602 |
Method of forming a conductive structure |
May. 8, 2007 |
| 7214569 |
Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
May. 8, 2007 |
| 7183649 |
Methods and procedures for engineering of composite conductive films by atomic layer deposition |
Feb. 27, 2007 |
| 7179738 |
Semiconductor assembly having substrate with electroplated contact pads |
Feb. 20, 2007 |
| 7163888 |
Direct imprinting of etch barriers using step and flash imprint lithography |
Jan. 16, 2007 |
| 7157378 |
Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode |
Jan. 2, 2007 |
| 7144808 |
Integration flow to prevent delamination from copper |
Dec. 5, 2006 |
| 7115504 |
Method of forming electrode structure for use in an integrated circuit |
Oct. 3, 2006 |
| 7115498 |
Method of ultra-low energy ion implantation to form alloy layers in copper |
Oct. 3, 2006 |
| 7101795 |
Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer |
Sep. 5, 2006 |
| 7101790 |
Method of forming a robust copper interconnect by dilute metal doping |
Sep. 5, 2006 |
| 7101791 |
Method for forming conductive line of semiconductor device |
Sep. 5, 2006 |
| 7094690 |
Deposition methods and apparatuses providing surface activation |
Aug. 22, 2006 |
| 7087522 |
Multilayer copper structure for improving adhesion property |
Aug. 8, 2006 |
| 7084056 |
Electrical interconnection, method of forming the electrical interconnection, image sensor having the electrical interconnection and method of manufacturing the image sensor |
Aug. 1, 2006 |
| 7074709 |
Localized doping and/or alloying of metallization for increased interconnect performance |
Jul. 11, 2006 |
| 7071093 |
Integrated treatment method for obtaining robust low dielectric constant materials |
Jul. 4, 2006 |
| 7070687 |
Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
Jul. 4, 2006 |
| 7052936 |
Use of polybenzoxazoles (PBOS) for adhesion |
May. 30, 2006 |
| 7045461 |
Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these |
May. 16, 2006 |
| 7033931 |
Temperature optimization of a physical vapor deposition process to prevent extrusion into openings |
Apr. 25, 2006 |
| 7029937 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
Apr. 18, 2006 |
| 7012018 |
Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices |
Mar. 14, 2006 |
| 7012029 |
Method of forming a lamination film pattern and improved lamination film pattern |
Mar. 14, 2006 |
| 7008871 |
Selective capping of copper wiring |
Mar. 7, 2006 |
| 7001843 |
Methods of forming metal lines in semiconductor devices |
Feb. 21, 2006 |
| 6974768 |
Methods of providing an adhesion layer for adhesion of barrier and/or seed layers to dielectric films |
Dec. 13, 2005 |
| 6969678 |
Multi-silicide in integrated circuit technology |
Nov. 29, 2005 |
| 6958290 |
Method and apparatus for improving adhesion between layers in integrated devices |
Oct. 25, 2005 |
| 6955983 |
Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer |
Oct. 18, 2005 |
| 6955986 |
Atomic layer deposition methods for forming a multi-layer adhesion-barrier layer for integrated circuits |
Oct. 18, 2005 |
| 6951813 |
Methods of forming metal-containing layers including a metal bonded to halogens and trialkylaluminum |
Oct. 4, 2005 |
| 6939724 |
Method for obtaining reversible resistance switches on a PCMO thin film when integrated with a highly crystallized seed layer |
Sep. 6, 2005 |
| 6939797 |
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof |
Sep. 6, 2005 |
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