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Class Information
Number: 438/653
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Plural layered electrode or conductor > At least one layer forms a diffusion barrier
Description: Processes wherein at least one of the diverse conductive layers forms a barrier to the diffusional migration of a contact material into the semiconductor or into another contact layer.










Patents under this class:

Patent Number Title Of Patent Date Issued
8709943 Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region Apr. 29, 2014
8704373 Semiconductor device and a method of manufacturing the same Apr. 22, 2014
8691691 TSV pillar as an interconnecting structure Apr. 8, 2014
8691689 Methods for fabricating integrated circuits having low resistance device contacts Apr. 8, 2014
8691688 Method of manufacturing semiconductor structure Apr. 8, 2014
8685854 Method of forming a via in a semiconductor device Apr. 1, 2014
8680682 Barrier for through-silicon via Mar. 25, 2014
8679978 Method for forming a film including Zr, Hf or the like, and method for manufacturing a semiconductor device using the same Mar. 25, 2014
8679971 Metal-contamination-free through-substrate via structure Mar. 25, 2014
8679970 Structure and process for conductive contact integration Mar. 25, 2014
8673778 Tungsten film forming method Mar. 18, 2014
8669177 Semiconductor device and method for manufacturing semiconductor device Mar. 11, 2014
8669176 BEOL integration scheme for copper CMP to prevent dendrite formation Mar. 11, 2014
8669142 Method of manufacturing package structure Mar. 11, 2014
8664115 Copper interconnect with metal hardmask removal Mar. 4, 2014
8659090 Resistive memory and methods for forming the same Feb. 25, 2014
8658533 Semiconductor interconnect structure with multi-layered seed layer providing enhanced reliability and minimizing electromigration Feb. 25, 2014
8653525 Thin-film transistor and thin-film transistor manufacturing method Feb. 18, 2014
8652890 Methods for fabricating integrated circuits with narrow, metal filled openings Feb. 18, 2014
8648465 Semiconductor interconnect structure having enhanced performance and reliability Feb. 11, 2014
8647959 Metal-insulator-metal capacitor alloying process Feb. 11, 2014
8637396 Dielectric barrier deposition using oxygen containing precursor Jan. 28, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8623761 Method of forming a graphene cap for copper interconnect structures Jan. 7, 2014
8618661 Die having coefficient of thermal expansion graded layer Dec. 31, 2013
8617985 High temperature tungsten metallization process Dec. 31, 2013
8598465 Hermetic circuit ring for BCB WSA circuits Dec. 3, 2013
8592306 Redundant metal barrier structure for interconnect applications Nov. 26, 2013
8586976 Electrode foil and organic device Nov. 19, 2013
8586474 Method to form a via Nov. 19, 2013
8586473 Methods for fabricating integrated circuits with ruthenium-lined copper Nov. 19, 2013
8586472 Conductive lines and pads and method of manufacturing thereof Nov. 19, 2013
8586133 Method for strengthening adhesion between dielectric layers formed adjacent to metal layers Nov. 19, 2013
8580688 Copper interconnection structure and method for forming copper interconnections Nov. 12, 2013
8580682 Cost-effective TSV formation Nov. 12, 2013
8580679 Designs and methods for conductive bumps Nov. 12, 2013
8580354 Plasma treatment of substrates prior to deposition Nov. 12, 2013
8575027 Sputtering and aligning multiple layers having different boundaries Nov. 5, 2013
8563428 Methods for depositing metal in high aspect ratio features Oct. 22, 2013
8551879 Semiconductor device and method for manufacturing semiconductor device Oct. 8, 2013
8541303 Method for fabricating MOS transistor Sep. 24, 2013
8536707 Semiconductor structure comprising moisture barrier and conductive redistribution layer Sep. 17, 2013
8536706 Method for fabricating semiconductor device and semiconductor device Sep. 17, 2013
8536656 Self-aligned contacts for high k/metal gate process flow Sep. 17, 2013
8531033 Contact plug structure, semiconductor device, and method for forming contact plug Sep. 10, 2013
8530349 Methods for fabricating semiconductor devices including a seed generation accelerating layer Sep. 10, 2013
8530348 Integration of non-noble DRAM electrode Sep. 10, 2013
8524600 Post deposition treatments for CVD cobalt films Sep. 3, 2013
8524597 Methods for forming planarized hermetic barrier layers and structures formed thereby Sep. 3, 2013
8524512 Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method Sep. 3, 2013











 
 
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