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Class Information
Number: 438/652
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Plural layered electrode or conductor
Description: Processes for making an ohmic contact to a semiconductor region involving the formation of multiple conductive layers of differing composition or electrical characteristics.

Sub-classes under this class:

Class Number Class Name Patents
438/653 At least one layer forms a diffusion barrier 1,368
438/654 Having adhesion promoting layer 407
438/657 Having electrically conductive polysilicon component 328
438/656 Having refractory group metal (i.e., titanium (ti), zirconium (zr), hafnium (hf), vanadium (v), niobium (nb), tantalum (ta), chromium (cr), molybdenum (mo), tungsten (w), or alloy thereof) 1,022
438/655 Silicide 1,066

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Patent Number Title Of Patent Date Issued
8691685 Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures Apr. 8, 2014
8691687 Superfilled metal contact vias for semiconductor devices Apr. 8, 2014
8686385 Phase-change random access memory device and method of manufacturing the same Apr. 1, 2014
8686392 Semiconductor device Apr. 1, 2014
8679969 System for self-aligned contacts Mar. 25, 2014
8679964 Prevention and control of intermetallic alloy inclusions Mar. 25, 2014
8669177 Semiconductor device and method for manufacturing semiconductor device Mar. 11, 2014
8658489 Method for dual work function metal gate CMOS with selective capping Feb. 25, 2014
8652909 Methods of forming a nonvolatile memory cell and methods of forming an array of nonvolatile memory cells array of nonvolatile memory cells Feb. 18, 2014
8642377 Method of producing conductive thin film Feb. 4, 2014
8637392 Solder interconnect with non-wettable sidewall pillars and methods of manufacture Jan. 28, 2014
8633098 Method of manufacturing a semiconductor device Jan. 21, 2014
8633107 Method of producing a semiconductor device and semiconductor device having a through-wafer interconnect Jan. 21, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8623752 Ohmic electrode for SiC semiconductor, method of manufacturing ohmic electrode for SiC semiconductor, semiconductor device, and method of manufacturing semiconductor device Jan. 7, 2014
8624381 Integrated antennas in wafer level package Jan. 7, 2014
8609535 Semiconductor package having through electrodes that reduce leakage current and method for manufacturing the same Dec. 17, 2013
8604625 Semiconductor device having conductive pads to prevent solder reflow Dec. 10, 2013
8603672 Semiconductor-covered cathode active material and lithium secondary battery using the same Dec. 10, 2013
8598035 Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same Dec. 3, 2013
8586472 Conductive lines and pads and method of manufacturing thereof Nov. 19, 2013
8586473 Methods for fabricating integrated circuits with ruthenium-lined copper Nov. 19, 2013
8580679 Designs and methods for conductive bumps Nov. 12, 2013
8575023 Contact formation method, semiconductor device manufacturing method, and semiconductor device Nov. 5, 2013
8569168 Dual-metal self-aligned wires and vias Oct. 29, 2013
8557610 Methods of integrated shielding into MTJ device for MRAM Oct. 15, 2013
8547167 Die power structure Oct. 1, 2013
8541893 Semiconductor memory device and power line arrangement method thereof Sep. 24, 2013
8529802 Solution composition and method of forming thin film and method of manufacturing thin film transistor using the solution composition Sep. 10, 2013
8524596 Techniques for improving bond pad performance Sep. 3, 2013
8518821 Semiconductor device and a method of manufacturing the same Aug. 27, 2013
8507379 Semiconductor device and manufacturing method thereof Aug. 13, 2013
8492256 Method of manufacturing semiconductor apparatus Jul. 23, 2013
8492274 Metal alloy cap integration Jul. 23, 2013
8487412 Semiconductor device and a method of manufacturing the same Jul. 16, 2013
8475872 Patterning of thin film layers Jul. 2, 2013
8471367 Semiconductor device and method for manufacturing semiconductor device Jun. 25, 2013
8460967 Integrated antennas in wafer level package Jun. 11, 2013
8455361 Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device Jun. 4, 2013
8450207 Method of fabricating a cell contact and a digit line for a semiconductor device May. 28, 2013
8445899 Organic electronic panel and method for manufacturing organic electronic panel May. 21, 2013
8445352 Manufacturing method of semiconductor device May. 21, 2013
8435887 Copper interconnect formation May. 7, 2013
8431446 Via formation for cross-point memory Apr. 30, 2013
8431458 Methods of forming a nonvolatile memory cell and methods of forming an array of nonvolatile memory cells Apr. 30, 2013
8431483 Methods of forming electrically conductive plugs and method of forming resistance variable elements Apr. 30, 2013
8431484 Stable electroless fine pitch interconnect plating Apr. 30, 2013
8421228 Structure and methods of forming contact structures Apr. 16, 2013
8415247 Semiconductor device and method for manufacturing of same Apr. 9, 2013
8409937 Producing transistor including multi-layer reentrant profile Apr. 2, 2013

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

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