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Class Information
Number: 438/652
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Plural layered electrode or conductor
Description: Processes for making an ohmic contact to a semiconductor region involving the formation of multiple conductive layers of differing composition or electrical characteristics.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 438/653 |
At least one layer forms a diffusion barrier |
1,075 |
| 438/654 |
Having adhesion promoting layer |
338 |
| 438/657 |
Having electrically conductive polysilicon component |
304 |
| 438/656 |
Having refractory group metal (i.e., titanium (ti), zirconium (zr), hafnium (hf), vanadium (v), niobium (nb), tantalum (ta), chromium (cr), molybdenum (mo), tungsten (w), or alloy thereof) |
884 |
| 438/655 |
Silicide |
935 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615474 |
Method for manufacturing semiconductor device with reduced damage to metal wiring layer |
Nov. 10, 2009 |
| 7605079 |
Manufacturing method for phase change RAM with electrode layer process |
Oct. 20, 2009 |
| 7605460 |
Method and apparatus for a power distribution system |
Oct. 20, 2009 |
| 7575994 |
Semiconductor device and manufacturing method of the same |
Aug. 18, 2009 |
| 7576005 |
Dense seed layer and method of formation |
Aug. 18, 2009 |
| 7576706 |
Image display device including two display panels and method of manufacturing the same |
Aug. 18, 2009 |
| 7566975 |
Semiconductor device and method for manufacturing the same |
Jul. 28, 2009 |
| 7560381 |
Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process |
Jul. 14, 2009 |
| 7553750 |
Method for fabricating electrical conductive structure of circuit board |
Jun. 30, 2009 |
| 7553754 |
Electronic device, method of manufacture of the same, and sputtering target |
Jun. 30, 2009 |
| 7550380 |
Electroless plating of metal caps for chalcogenide-based memory devices |
Jun. 23, 2009 |
| 7550328 |
Method for production of thin-film semiconductor device |
Jun. 23, 2009 |
| 7547623 |
Methods of forming lead free solder bumps |
Jun. 16, 2009 |
| 7541278 |
Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
Jun. 2, 2009 |
| 7520049 |
Method for manufacturing a planar resistance heating element |
Apr. 21, 2009 |
| 7517785 |
Electronic interconnects and methods of making same |
Apr. 14, 2009 |
| 7514355 |
Multilayer interconnection structure and method for forming the same |
Apr. 7, 2009 |
| 7514354 |
Methods for forming damascene wiring structures having line and plug conductors formed from different materials |
Apr. 7, 2009 |
| 7507660 |
Deposition processes for tungsten-containing barrier layers |
Mar. 24, 2009 |
| 7504287 |
Methods for fabricating an integrated circuit |
Mar. 17, 2009 |
| 7501334 |
Semiconductor devices having a pocket line and methods of fabricating the same |
Mar. 10, 2009 |
| 7501328 |
Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization |
Mar. 10, 2009 |
| 7494924 |
Method for forming reinforced interconnects on a substrate |
Feb. 24, 2009 |
| 7479451 |
Display device manufacturing method preventing diffusion of an aluminum element into a polysilicon layer in a heating step |
Jan. 20, 2009 |
| 7479394 |
MgO/NiFe MTJ for high performance MRAM application |
Jan. 20, 2009 |
| 7473643 |
Dendrite growth control circuit |
Jan. 6, 2009 |
| 7470619 |
Interconnect with high aspect ratio plugged vias |
Dec. 30, 2008 |
| 7468316 |
Low fabrication cost, fine pitch and high reliability solder bump |
Dec. 23, 2008 |
| 7468319 |
Method for preventing a metal corrosion in a semiconductor device |
Dec. 23, 2008 |
| 7468320 |
Reduced electromigration and stressed induced migration of copper wires by surface coating |
Dec. 23, 2008 |
| 7462942 |
Die pillar structures and a method of their formation |
Dec. 9, 2008 |
| 7462523 |
Semiconductor memory device and method for manufacturing the same |
Dec. 9, 2008 |
| 7456092 |
Self-releasing spring structures and methods |
Nov. 25, 2008 |
| 7446006 |
Semiconductor fabrication process including silicide stringer removal processing |
Nov. 4, 2008 |
| 7443019 |
Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same |
Oct. 28, 2008 |
| 7435680 |
Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure |
Oct. 14, 2008 |
| 7436067 |
Methods for forming conductive structures and structures regarding same |
Oct. 14, 2008 |
| 7435672 |
Metal-germanium physical vapor deposition for semiconductor device defect reduction |
Oct. 14, 2008 |
| 7427543 |
Method to improve drive current by increasing the effective area of an electrode |
Sep. 23, 2008 |
| 7416975 |
Method of forming contact layers on substrates |
Aug. 26, 2008 |
| 7413974 |
Copper-metallized integrated circuits having electroless thick copper bond pads |
Aug. 19, 2008 |
| 7413975 |
Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
Aug. 19, 2008 |
| 7411298 |
Source/drain electrodes, thin-film transistor substrates, manufacture methods thereof, and display devices |
Aug. 12, 2008 |
| 7407838 |
Method of manufacturing a semiconductor method of manufacturing a thin-film transistor and thin-film transistor |
Aug. 5, 2008 |
| 7407883 |
Electronic package with improved current carrying capability and method of forming the same |
Aug. 5, 2008 |
| 7402944 |
Organic light emitting display device and method of fabricating the same |
Jul. 22, 2008 |
| 7399706 |
Manufacturing method of semiconductor device |
Jul. 15, 2008 |
| 7396750 |
Method and structure for contacting two adjacent GMR memory bit |
Jul. 8, 2008 |
| 7396763 |
Semiconductor package using flexible film and method of manufacturing the same |
Jul. 8, 2008 |
| 7375014 |
Methods of electrochemically treating semiconductor substrates |
May. 20, 2008 |
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