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Class Information
Number: 438/650
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Diverse conductors > Having noble group metal (i.e., silver (ag), gold (au), platinum (pt), palladium (pd), rhodium (rh), ruthenium (ru), iridium (ir), osmium (os), or alloy thereof)
Description: Processes for forming at least one of the conductive layers using one of the noble group elements (e.g., silver (Ag), gold (Au), platinum (Pt), palladium (Pd), rhodium (Rh), ruthenium (Ru), iridium (Ir), osmium (Os), or alloy thereof).
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618890 |
Methods for forming conductive structures and structures regarding same |
Nov. 17, 2009 |
| 7592259 |
Methods and systems for barrier layer surface passivation |
Sep. 22, 2009 |
| 7588667 |
Depositing rhuthenium films using ionized physical vapor deposition (IPVD) |
Sep. 15, 2009 |
| 7589014 |
Semiconductor device having multiple wiring layers and method of producing the same |
Sep. 15, 2009 |
| 7569482 |
Method for the selective removal of an unsilicided metal |
Aug. 4, 2009 |
| 7566661 |
Electroless treatment of noble metal barrier and adhesion layer |
Jul. 28, 2009 |
| 7541284 |
Method of depositing Ru films having high density |
Jun. 2, 2009 |
| 7528493 |
Interconnect structure and method of fabrication of same |
May. 5, 2009 |
| 7507665 |
Method of manufacturing electrical parts |
Mar. 24, 2009 |
| 7498179 |
Semiconductor device having ferroelectric material capacitor and method of making the same |
Mar. 3, 2009 |
| 7482269 |
Method for controlling the step coverage of a ruthenium layer on a patterned substrate |
Jan. 27, 2009 |
| 7476618 |
Selective formation of metal layers in an integrated circuit |
Jan. 13, 2009 |
| 7476615 |
Deposition process for iodine-doped ruthenium barrier layers |
Jan. 13, 2009 |
| 7470617 |
Treating a liner layer to reduce surface oxides |
Dec. 30, 2008 |
| 7468108 |
Metal layer forming methods and capacitor electrode forming methods |
Dec. 23, 2008 |
| 7462555 |
Ball grid array substrate having window and method of fabricating same |
Dec. 9, 2008 |
| 7459387 |
Semiconductor electronic device and method of manufacturing thereof |
Dec. 2, 2008 |
| 7459392 |
Noble metal barrier and seed layer for semiconductors |
Dec. 2, 2008 |
| 7456101 |
Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds |
Nov. 25, 2008 |
| 7435605 |
Method for fabricating a component having an electrical contact region |
Oct. 14, 2008 |
| 7435678 |
Method of depositing noble metal electrode using oxidation-reduction reaction |
Oct. 14, 2008 |
| 7435679 |
Alloyed underlayer for microelectronic interconnects |
Oct. 14, 2008 |
| 7436066 |
Semiconductor element |
Oct. 14, 2008 |
| 7436067 |
Methods for forming conductive structures and structures regarding same |
Oct. 14, 2008 |
| 7416982 |
Semiconductor devices and methods for manufacturing the same |
Aug. 26, 2008 |
| 7416974 |
Method of manufacturing semiconductor device, and semiconductor device |
Aug. 26, 2008 |
| 7393785 |
Methods and apparatus for forming rhodium-containing layers |
Jul. 1, 2008 |
| 7381614 |
Method for fabricating a semiconductor memory device that includes silicidizing a portion of a platinum group layer to form a silicide region and selectively removing the silicide region to de |
Jun. 3, 2008 |
| 7374701 |
Organometallic precursor composition and method of forming metal film or pattern using the same |
May. 20, 2008 |
| 7341947 |
Methods of forming metal-containing films over surfaces of semiconductor substrates |
Mar. 11, 2008 |
| 7312127 |
Incorporating dopants to enhance the dielectric properties of metal silicates |
Dec. 25, 2007 |
| 7288479 |
Method for forming a barrier/seed layer for copper metallization |
Oct. 30, 2007 |
| 7279231 |
Electroless plating structure |
Oct. 9, 2007 |
| 7273814 |
Method for forming a ruthenium metal layer on a patterned substrate |
Sep. 25, 2007 |
| 7262132 |
Metal plating using seed film |
Aug. 28, 2007 |
| 7253103 |
Method for producing semiconductor devices that includes forming a copper film in contact with a ruthenium film |
Aug. 7, 2007 |
| 7253102 |
Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers |
Aug. 7, 2007 |
| 7238611 |
Salicide process |
Jul. 3, 2007 |
| 7229913 |
Stitched micro-via to enhance adhesion and mechanical strength |
Jun. 12, 2007 |
| 7229917 |
Film formation method and apparatus for semiconductor process |
Jun. 12, 2007 |
| 7226861 |
Methods and apparatus for forming rhodium-containing layers |
Jun. 5, 2007 |
| 7220669 |
Thin films for magnetic device |
May. 22, 2007 |
| 7220665 |
H.sub.2 plasma treatment |
May. 22, 2007 |
| 7214602 |
Method of forming a conductive structure |
May. 8, 2007 |
| 7214611 |
Imprinting-damascene process for metal interconnection |
May. 8, 2007 |
| 7211509 |
Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds |
May. 1, 2007 |
| 7199043 |
Method of forming copper wiring in semiconductor device |
Apr. 3, 2007 |
| 7163835 |
Method for producing thin semiconductor films by deposition from solution |
Jan. 16, 2007 |
| 7157383 |
Method for forming silicon dioxide film on silicon substrate, method for forming oxide film on semiconductor substrate, and method for producing semiconductor device |
Jan. 2, 2007 |
| 7105401 |
Capacitor for semiconductor device, manufacturing method thereof, and electronic device employing the same |
Sep. 12, 2006 |
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