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Class Information
Number: 438/647
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Diverse conductors > Having electrically conductive polysilicon component
Description: Processes wherein one of the diverse conductive layers is polycrystalline silicon.

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8492238 Method and apparatus for fabricating piezoresistive polysilicon by low-temperature metal induced crystallization Jul. 23, 2013
8455360 Method for fabricating storage node of semiconductor device Jun. 4, 2013
8409989 Structure and method to fabricate a body contact Apr. 2, 2013
8105946 Method of forming conductive lines of semiconductor memory device Jan. 31, 2012
8063442 Power device with improved edge termination Nov. 22, 2011
8057857 Phase separation in patterned structures Nov. 15, 2011
8048739 Method of manufacturing flash memory device Nov. 1, 2011
8039358 Method of manufacturing semiconductor device on which a plurality of types of transistors are mounted Oct. 18, 2011
7981482 Methods of forming a doped semiconductor thin film, doped semiconductor thin film structures, doped silane compositions, and methods of making such compositions Jul. 19, 2011
7939434 Method for fabricating polysilicon film May. 10, 2011
7928008 Method for fabricating semiconductor device Apr. 19, 2011
7910481 Method for fabricating semiconductor device Mar. 22, 2011
7855143 Interconnect capping layer and method of fabrication Dec. 21, 2010
7833902 Semiconductor device and method of fabricating the same Nov. 16, 2010
7749778 Addressable hierarchical metal wire test methodology Jul. 6, 2010
7701058 Undoped polysilicon metal silicide wiring Apr. 20, 2010
7595521 Terraced film stack Sep. 29, 2009
7531451 SIP semiconductor device and method for manufacturing the same May. 12, 2009
7524757 Method for manufacturing multi-level transistor comprising forming selective epitaxial growth layer Apr. 28, 2009
7442319 Poly etch without separate oxide decap Oct. 28, 2008
7427543 Method to improve drive current by increasing the effective area of an electrode Sep. 23, 2008
7351654 Semiconductor device and method for producing the same Apr. 1, 2008
7291527 Work function control of metals Nov. 6, 2007
7265038 Method for forming a multi-layer seed layer for improved Cu ECP Sep. 4, 2007
7245015 Display apparatus Jul. 17, 2007
7195995 Method of manufacturing a multilayered doped conductor for a contact in an integrated circuit device Mar. 27, 2007
7189641 Methods of fabricating tungsten contacts with tungsten nitride barrier layers in semiconductor devices, tungsten contacts with tungsten nitride barrier layers Mar. 13, 2007
7169696 Method for making a system for selecting one wire from a plurality of wires Jan. 30, 2007
7162796 Method of making an interposer with contact structures Jan. 16, 2007
7160801 Integrated circuit using a dual poly process Jan. 9, 2007
7144807 Low resistivity titanium silicide on heavily doped semiconductor Dec. 5, 2006
7067391 Method to form a metal silicide gate device Jun. 27, 2006
7026232 Systems and methods for low leakage strained-channel transistor Apr. 11, 2006
7012021 Method for end point detection polysilicon chemical mechanical polishing in an anti-fuse memory device Mar. 14, 2006
7005378 Processes for fabricating conductive patterns using nanolithography as a patterning tool Feb. 28, 2006
6979880 Scalable high performance antifuse structure and process Dec. 27, 2005
6969916 Substrate having built-in semiconductor apparatus and manufacturing method thereof Nov. 29, 2005
6962861 Method of forming a polysilicon layer comprising microcrystalline grains Nov. 8, 2005
6960500 Semiconductor device and method of manufacturing the same including forming metal silicide gate lines and source lines Nov. 1, 2005
6946336 Method of making a nanoscale electronic device Sep. 20, 2005
6943065 Scalable high performance antifuse structure and process Sep. 13, 2005
6930039 Method of fabricating a contact structure having a composite barrier layer between a platinum layer and a polysilicon plug Aug. 16, 2005
6916704 Multiple deposition of metal layers for the fabrication of an upper capacitor electrode of a trench capacitor Jul. 12, 2005
6888242 Color contacts for a semiconductor package May. 3, 2005
6879043 Electrode structure and method for fabricating the same Apr. 12, 2005
6872639 Fabrication of semiconductor devices with transition metal boride films as diffusion barriers Mar. 29, 2005
6858529 Methods of forming contact plugs including polysilicon doped with an impurity having a lesser diffusion coefficient than phosphorus Feb. 22, 2005
6844259 Method for forming contact plug in semiconductor device Jan. 18, 2005
6844255 Methods of providing an interlevel dielectric layer intermediate different elevation conductive metal layers in the fabrication of integrated circuitry Jan. 18, 2005

1 2 3 4 5 6

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