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Class Information
Number: 438/644
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Diverse conductors > Having adhesion promoting layer
Description: Processes wherein a material (e.g., layer, etc.) is utilized to promote adhesion of the electrical conductor to an adjacent surface.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8669177 Semiconductor device and method for manufacturing semiconductor device Mar. 11, 2014
8669182 Metal cap with ultra-low .kappa. dielectric material for circuit interconnect applications Mar. 11, 2014
8569165 Self-aligned barrier and capping layers for interconnects Oct. 29, 2013
8563423 Fluorine depleted adhesion layer for metal interconnect structure Oct. 22, 2013
8507803 Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity Aug. 13, 2013
8377822 Semiconductor device and manufacturing method thereof Feb. 19, 2013
8372739 Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication Feb. 12, 2013
8349725 Method of manufacturing semiconductor device, semiconductor manufacturing apparatus, and storage medium Jan. 8, 2013
8268722 Interfacial capping layers for interconnects Sep. 18, 2012
8236687 Die-bonding method of LED chip and LED manufactured by the same Aug. 7, 2012
8211794 Properties of metallic copper diffusion barriers through silicon surface treatments Jul. 3, 2012
8212359 Semiconductor integrated circuit device, mounting structure of semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device Jul. 3, 2012
8183153 Method for manufacturing semiconductor device May. 22, 2012
8178436 Adhesion and electromigration performance at an interface between a dielectric and metal May. 15, 2012
8173538 Method of selectively forming a conductive barrier layer by ALD May. 8, 2012
8169077 Dielectric interconnect structures and methods for forming the same May. 1, 2012
8163602 Ultraviolet energy curable tape and method of making a semiconductor chip using the tape Apr. 24, 2012
8119524 Method of manufacturing semiconductor device Feb. 21, 2012
8110502 Method of improving adhesion strength of low dielectric constant layers Feb. 7, 2012
8105935 Method of manufacturing a semiconductor device Jan. 31, 2012
8089113 Damascene metal-insulator-metal (MIM) device Jan. 3, 2012
8053361 Interconnects with improved TDDB Nov. 8, 2011
7989342 Formation of a reliable diffusion-barrier cap on a Cu-containing interconnect element having grains with different crystal orientations Aug. 2, 2011
7968455 Copper deposition for filling features in manufacture of microelectronic devices Jun. 28, 2011
7910476 Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop Mar. 22, 2011
7888263 Cladded silver and silver alloy metallization for improved adhesion electromigration resistance Feb. 15, 2011
7858517 Method of manufacturing semiconductor device, and semiconductor device Dec. 28, 2010
7842609 Method for manufacturing semiconductor device Nov. 30, 2010
7838414 Method for manufacturing semiconductor device utilizing low dielectric layer filling gaps between metal lines Nov. 23, 2010
7807568 Methods for reducing damage to substrate layers in deposition processes Oct. 5, 2010
7767570 Dummy vias for damascene process Aug. 3, 2010
7737028 Selective ruthenium deposition on copper materials Jun. 15, 2010
7727883 Method of forming a diffusion barrier and adhesion layer for an interconnect structure Jun. 1, 2010
7709349 Semiconductor device manufactured using a gate silicidation involving a disposable chemical/mechanical polishing stop layer May. 4, 2010
7704885 Semiconductor device and method for fabricating the same Apr. 27, 2010
7674712 Patterning method for light-emitting devices Mar. 9, 2010
7670944 Conformal lining layers for damascene metallization Mar. 2, 2010
7659202 Triaxial through-chip connection Feb. 9, 2010
7629221 Method for forming capacitor of semiconductor device Dec. 8, 2009
7618855 Manufacturing method of semiconductor device Nov. 17, 2009
7611985 Formation of holes in substrates using dewetting coatings Nov. 3, 2009
7601637 Atomic layer deposited tantalum containing adhesion layer Oct. 13, 2009
7585782 Methods of forming semiconductor constructions, and methods of selectively removing metal-containing materials relative to oxide Sep. 8, 2009
7560342 Method of manufacturing a semiconductor device having a plurality of memory and non-memory devices Jul. 14, 2009
7541280 Method of foming a micromechanical structure Jun. 2, 2009
7517782 Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase Apr. 14, 2009
7510961 Utilization of energy absorbing layer to improve metal flow and fill in a novel interconnect structure Mar. 31, 2009
7470617 Treating a liner layer to reduce surface oxides Dec. 30, 2008
7459387 Semiconductor electronic device and method of manufacturing thereof Dec. 2, 2008
7456093 Method for improving a semiconductor device delamination resistance Nov. 25, 2008

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