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Class Information
Number: 438/643
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Diverse conductors > At least one layer forms a diffusion barrier
Description: Processes wherein at least one of the diverse conductive layers forms a barrier to the diffusional migration of a contact material into the semiconductor or into another contact layer.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7429338 |
Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization |
Sep. 30, 2008 |
| 7429516 |
Tungsten nitride atomic layer deposition processes |
Sep. 30, 2008 |
| 7427561 |
Method for manufacturing semiconductor device |
Sep. 23, 2008 |
| 7427563 |
Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures |
Sep. 23, 2008 |
| 7422979 |
Method of forming a semiconductor device having a diffusion barrier stack and structure thereof |
Sep. 9, 2008 |
| 7423110 |
Polysulfone compositions exhibiting very low color and high light transmittance properties and articles made therefrom |
Sep. 9, 2008 |
| 7419903 |
Thin films |
Sep. 2, 2008 |
| 7420275 |
Boron-doped SIC copper diffusion barrier films |
Sep. 2, 2008 |
| 7416980 |
Forming a barrier layer in interconnect joints and structures formed thereby |
Aug. 26, 2008 |
| 7413984 |
Multi-step process for forming a barrier film for use in copper layer formation |
Aug. 19, 2008 |
| 7410666 |
Metal nitride carbide deposition by ALD |
Aug. 12, 2008 |
| 7410918 |
Systems and methods for forming metal oxides using alcohols |
Aug. 12, 2008 |
| 7407881 |
Semiconductor device and method for manufacturing the same |
Aug. 5, 2008 |
| 7402516 |
Method for making integrated circuits |
Jul. 22, 2008 |
| 7393722 |
Reprogrammable metal-to-metal antifuse employing carbon-containing antifuse material |
Jul. 1, 2008 |
| 7384866 |
Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer |
Jun. 10, 2008 |
| 7381638 |
Fabrication technique using sputter etch and vacuum transfer |
Jun. 3, 2008 |
| 7368402 |
Systems and methods for forming tantalum oxide layers and tantalum precursor compounds |
May. 6, 2008 |
| 7368378 |
Methods for making integrated-circuit wiring from copper, silver, gold, and other metals |
May. 6, 2008 |
| 7368377 |
Method for selective deposition of a thin self-assembled monolayer |
May. 6, 2008 |
| 7365430 |
Semiconductor device and method of manufacturing the same |
Apr. 29, 2008 |
| 7354849 |
Catalytically enhanced atomic layer deposition process |
Apr. 8, 2008 |
| 7354853 |
Selective dry etching of tantalum and tantalum nitride |
Apr. 8, 2008 |
| 7338898 |
MOS transistor and fabrication thereof |
Mar. 4, 2008 |
| 7335587 |
Post polish anneal of atomic layer deposition barrier layers |
Feb. 26, 2008 |
| 7335590 |
Method of fabricating semiconductor device by forming diffusion barrier layer selectively and semiconductor device fabricated thereby |
Feb. 26, 2008 |
| 7327031 |
Semiconductor device and method of manufacturing the same |
Feb. 5, 2008 |
| 7319065 |
Semiconductor component and method of manufacture |
Jan. 15, 2008 |
| 7316783 |
Method of wiring formation and method for manufacturing electronic components |
Jan. 8, 2008 |
| 7312147 |
Method of forming barrier metal in semiconductor device |
Dec. 25, 2007 |
| 7307018 |
Method of fabricating conductive lines |
Dec. 11, 2007 |
| 7291557 |
Method for forming an interconnection structure for ic metallization |
Nov. 6, 2007 |
| 7282438 |
Low-k SiC copper diffusion barrier films |
Oct. 16, 2007 |
| 7279408 |
Semiconductor device, method for manufacturing the same, and plating solution |
Oct. 9, 2007 |
| 7279416 |
Methods of forming a conductive structure in an integrated circuit device |
Oct. 9, 2007 |
| 7271103 |
Surface treated low-k dielectric as diffusion barrier for copper metallization |
Sep. 18, 2007 |
| 7266882 |
Method of manufacturing a miniaturized three- dimensional electric component |
Sep. 11, 2007 |
| 7265038 |
Method for forming a multi-layer seed layer for improved Cu ECP |
Sep. 4, 2007 |
| 7265049 |
Ultrathin chemically grown oxide film as a dopant diffusion barrier in semiconductor devices |
Sep. 4, 2007 |
| 7262130 |
Methods for making integrated-circuit wiring from copper, silver, gold, and other metals |
Aug. 28, 2007 |
| 7262131 |
Dielectric barrier layer films |
Aug. 28, 2007 |
| 7253092 |
Tungsten plug corrosion prevention method using water |
Aug. 7, 2007 |
| 7253101 |
Deposition method of TiN thin film having a multi-layer structure |
Aug. 7, 2007 |
| 7244674 |
Process of forming a composite diffusion barrier in copper/organic low-k damascene technology |
Jul. 17, 2007 |
| 7239017 |
Low-k B-doped SiC copper diffusion barrier films |
Jul. 3, 2007 |
| 7238626 |
Chemically and electrically stabilized polymer films |
Jul. 3, 2007 |
| 7238606 |
Semiconductor devices and method for fabricating the same |
Jul. 3, 2007 |
| 7235487 |
Metal seed layer deposition |
Jun. 26, 2007 |
| 7232752 |
Method of removing contaminants from a silicon wafer after chemical-mechanical polishing operation |
Jun. 19, 2007 |
| 7233071 |
Low-k dielectric layer based upon carbon nanostructures |
Jun. 19, 2007 |
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