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Class Information
Number: 438/643
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Diverse conductors > At least one layer forms a diffusion barrier
Description: Processes wherein at least one of the diverse conductive layers forms a barrier to the diffusional migration of a contact material into the semiconductor or into another contact layer.










Patents under this class:

Patent Number Title Of Patent Date Issued
8709942 Methods for fabricating semiconductor devices Apr. 29, 2014
8704373 Semiconductor device and a method of manufacturing the same Apr. 22, 2014
8691691 TSV pillar as an interconnecting structure Apr. 8, 2014
8685853 Dual damascene copper process using a selected mask Apr. 1, 2014
8679971 Metal-contamination-free through-substrate via structure Mar. 25, 2014
8673772 Biosensor chip and a method of manufacturing the same Mar. 18, 2014
8669177 Semiconductor device and method for manufacturing semiconductor device Mar. 11, 2014
8669176 BEOL integration scheme for copper CMP to prevent dendrite formation Mar. 11, 2014
8661664 Techniques for forming narrow copper filled vias having improved conductivity Mar. 4, 2014
8648465 Semiconductor interconnect structure having enhanced performance and reliability Feb. 11, 2014
8648442 Semiconductor device and method of manufacturing the same Feb. 11, 2014
8637912 Vertical gate device with reduced word line resistivity Jan. 28, 2014
8637396 Dielectric barrier deposition using oxygen containing precursor Jan. 28, 2014
8633106 Heterojunction bipolar transistors and methods of manufacture Jan. 21, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8623760 Process for improving copper line cap formation Jan. 7, 2014
8618661 Die having coefficient of thermal expansion graded layer Dec. 31, 2013
8617984 Tungsten metallization: structure and fabrication of same Dec. 31, 2013
8610275 Semiconductor contact structure including a spacer formed within a via and method of manufacturing the same Dec. 17, 2013
8592306 Redundant metal barrier structure for interconnect applications Nov. 26, 2013
8586133 Method for strengthening adhesion between dielectric layers formed adjacent to metal layers Nov. 19, 2013
8564132 Tungsten metallization: structure and fabrication of same Oct. 22, 2013
8563427 Semiconductor chip with conductive diffusion regions, method for manufacturing the same, and stack package using the same Oct. 22, 2013
8552565 Chip package and method for forming the same Oct. 8, 2013
8546944 Multilayer dielectric memory device Oct. 1, 2013
8536707 Semiconductor structure comprising moisture barrier and conductive redistribution layer Sep. 17, 2013
8536706 Method for fabricating semiconductor device and semiconductor device Sep. 17, 2013
8536050 Selective shrinkage of contact elements in a semiconductor device Sep. 17, 2013
8531035 Interconnect barrier structure and method Sep. 10, 2013
8524597 Methods for forming planarized hermetic barrier layers and structures formed thereby Sep. 3, 2013
8518819 Semiconductor device contact structures and methods for making the same Aug. 27, 2013
8518762 Semiconductor device and manufacturing method thereof Aug. 27, 2013
8502381 Barrier layer configurations and methods for processing microelectronic topographies having barrier layers Aug. 6, 2013
8492808 Semiconductor device and manufacturing method thereof Jul. 23, 2013
8486773 Semiconductor device and manufacturing method thereof Jul. 16, 2013
8461684 Cobalt nitride layers for copper interconnects and methods for forming them Jun. 11, 2013
8461683 Self-forming, self-aligned barriers for back-end interconnects and methods of making same Jun. 11, 2013
8461043 Barrier layer for integrated circuit contacts Jun. 11, 2013
8460989 Niobium and vanadium organometallic precursors for thin film deposition Jun. 11, 2013
8440564 Schemes for forming barrier layers for copper in interconnect structures May. 14, 2013
8440515 Method of forming a field effect transistor May. 14, 2013
8435830 Methods of fabricating semiconductor devices May. 7, 2013
8432038 Through-silicon via structure and a process for forming the same Apr. 30, 2013
8431482 Integrated circuits and methods for processing integrated circuits with embedded features Apr. 30, 2013
8426307 Reducing resistivity in interconnect structures of integrated circuits Apr. 23, 2013
8424175 Process for fabricating piezoelectrically actuated ultrananocrystalline diamond tip array integrated with ferroelectric or phase change media for high-density memory Apr. 23, 2013
8420535 Copper interconnection, method for forming copper interconnection structure, and semiconductor device Apr. 16, 2013
8420531 Enhanced diffusion barrier for interconnect structures Apr. 16, 2013
8409989 Structure and method to fabricate a body contact Apr. 2, 2013
8409984 Apparatus and method for manufacturing multi-component oxide heterostructures Apr. 2, 2013











 
 
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