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Class Information
Number: 438/642
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Diverse conductors
Description: Processes wherein the electrically conductive pathway contacting multiple semiconductive regions is composed of plural conductive layers of differing composition or electrical characteristics.










Sub-classes under this class:

Class Number Class Name Patents
438/643 At least one layer forms a diffusion barrier 1,232
438/644 Having adhesion promoting layer 333
438/647 Having electrically conductive polysilicon component 289
438/650 Having noble group metal (i.e., silver (ag), gold (au), platinum (pt), palladium (pd), rhodium (rh), ruthenium (ru), iridium (ir), osmium (os), or alloy thereof) 249
438/645 Having planarization step 322
438/648 Having refractory group metal (i.e., titanium (ti), zirconium (zr), hafnium (hf), vanadium (v), niobium (nb), tantalum (ta), chromium (cr), molybdenum (mo), tungsten (w), or alloy thereof) 938


Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8691688 Method of manufacturing semiconductor structure Apr. 8, 2014
8658526 Methods for increased array feature density Feb. 25, 2014
8637389 Resist feature and removable spacer pitch doubling patterning method for pillar structures Jan. 28, 2014
8536706 Method for fabricating semiconductor device and semiconductor device Sep. 17, 2013
8461039 Patternable low-K dielectric interconnect structure with a graded cap layer and method of fabrication Jun. 11, 2013
8450205 Redundancy design with electro-migration immunity and method of manufacture May. 28, 2013
8432038 Through-silicon via structure and a process for forming the same Apr. 30, 2013
8426973 Integrated circuit of decreased size Apr. 23, 2013
8421228 Structure and methods of forming contact structures Apr. 16, 2013
8389403 Semiconductor device and method for manufacturing the same Mar. 5, 2013
8377822 Semiconductor device and manufacturing method thereof Feb. 19, 2013
8372740 Methods for increased array feature density Feb. 12, 2013
8344509 Method for fabricating semiconductor device and semiconductor device Jan. 1, 2013
8324058 Contacts for FET devices Dec. 4, 2012
8298879 Methods of fabricating metal oxide or metal oxynitride TFTS using wet process for source-drain metal etch Oct. 30, 2012
8278156 Spacer double patterning for lithography operations Oct. 2, 2012
RE43674 Post passivation metal scheme for high-performance integrated circuit devices Sep. 18, 2012
8268721 Semiconductor device and semiconductor device manufacturing method Sep. 18, 2012
8264083 Semiconductor device and semiconductor device manufacturing method Sep. 11, 2012
8242017 Method and structure for copper gap fill plating of interconnect structures for semiconductor integrated circuits Aug. 14, 2012
8236685 Phase change memory device having multiple metal silicide layers and method of manufacturing the same Aug. 7, 2012
8203264 Flat panel display and method of fabricating the same Jun. 19, 2012
8158499 Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating thin film transistor substrate Apr. 17, 2012
8124532 Semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer Feb. 28, 2012
8084348 Contact pads for silicon chip packages Dec. 27, 2011
8084347 Resist feature and removable spacer pitch doubling patterning method for pillar structures Dec. 27, 2011
8076239 Semiconductor device and method of manufacturing the same Dec. 13, 2011
8039380 Procedure for obtaining nanotube layers of carbon with conductor or semiconductor substrate Oct. 18, 2011
8018059 Electrical interconnect with an electrical pathway including at least a first member overlain by a second member at a contact point Sep. 13, 2011
8008178 Method for fabricating semiconductor device with an intermediate stack structure Aug. 30, 2011
8003519 Systems and methods for back end of line processing of semiconductor circuits Aug. 23, 2011
7981792 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument Jul. 19, 2011
7968455 Copper deposition for filling features in manufacture of microelectronic devices Jun. 28, 2011
7960276 Conductor-dielectric structure and method for fabricating Jun. 14, 2011
7943518 Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip May. 17, 2011
7939453 Method for manufacturing organic transistor and organic transistor May. 10, 2011
7928005 Method for forming narrow structures in a semiconductor device Apr. 19, 2011
7927913 Electrolyte pattern and method for manufacturing an electrolyte pattern Apr. 19, 2011
7915161 Post passivation interconnection schemes on top of IC chip Mar. 29, 2011
7910477 Etch residue reduction by ash methodology Mar. 22, 2011
7855143 Interconnect capping layer and method of fabrication Dec. 21, 2010
7833903 Semiconductor device and method of manufacturing the same Nov. 16, 2010
7825022 Method of enabling solder deposition on a substrate and electronic package formed thereby Nov. 2, 2010
7825398 Memory cell having improved mechanical stability Nov. 2, 2010
7807483 Method for manufacturing display device Oct. 5, 2010
7799676 Method of manufacturing a contact structure to avoid open issue Sep. 21, 2010
7799673 Semiconductor device manufacturing method Sep. 21, 2010
7781334 Method of manufacturing a semiconductor device with through-chip vias Aug. 24, 2010
7776739 Semiconductor device interconnection contact and fabrication method Aug. 17, 2010
7772110 Electrical contacts for integrated circuits and methods of forming using gas cluster ion beam processing Aug. 10, 2010

1 2 3 4 5 6










 
 
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