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Class Information
Number: 438/640
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > With formation of opening (i.e., viahole) in insulative layer > Having viahole of tapered shape
Description: Processes wherein the viahole is formed so as to possess nonparallel sidewalls.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626202 |
Contact structure and semiconductor device |
Dec. 1, 2009 |
| 7618887 |
Semiconductor device with a metal line and method of forming the same |
Nov. 17, 2009 |
| 7615486 |
Apparatus and method for integrated surface treatment and deposition for copper interconnect |
Nov. 10, 2009 |
| RE40965 |
Method of forming low-resistance contact electrodes in semiconductor devices |
Nov. 10, 2009 |
| 7598616 |
Interconnect structure |
Oct. 6, 2009 |
| 7598169 |
Method to remove beol sacrificial materials and chemical residues by irradiation |
Oct. 6, 2009 |
| 7589014 |
Semiconductor device having multiple wiring layers and method of producing the same |
Sep. 15, 2009 |
| 7575992 |
Method of forming micro patterns in semiconductor devices |
Aug. 18, 2009 |
| 7572732 |
Method to modulate etch rate in SLAM |
Aug. 11, 2009 |
| 7569481 |
Method for forming via-hole in semiconductor device |
Aug. 4, 2009 |
| 7541282 |
Methods of forming metal-nitride layers in contact holes |
Jun. 2, 2009 |
| 7538027 |
Fabrication method for semiconductor interconnections |
May. 26, 2009 |
| 7528493 |
Interconnect structure and method of fabrication of same |
May. 5, 2009 |
| 7524760 |
Semiconductor device and method for manufacturing the same |
Apr. 28, 2009 |
| 7514298 |
Printed wiring board for mounting semiconductor |
Apr. 7, 2009 |
| 7514362 |
Integrated circuit including sub-lithographic structures |
Apr. 7, 2009 |
| 7507658 |
Semiconductor apparatus and method of fabricating the apparatus |
Mar. 24, 2009 |
| 7504333 |
Method of forming bit line of semiconductor device |
Mar. 17, 2009 |
| 7494916 |
Design structures incorporating interconnect structures with liner repair layers |
Feb. 24, 2009 |
| 7482694 |
Semiconductor device and its manufacturing method |
Jan. 27, 2009 |
| 7482267 |
Ion implantation of spin on glass materials |
Jan. 27, 2009 |
| 7482266 |
Method of forming composite opening and method of dual damascene process using the same |
Jan. 27, 2009 |
| 7476614 |
Method of fabricating semiconductor device |
Jan. 13, 2009 |
| 7473598 |
Method for forming stack capacitor |
Jan. 6, 2009 |
| 7462523 |
Semiconductor memory device and method for manufacturing the same |
Dec. 9, 2008 |
| 7459384 |
Preventing cavitation in high aspect ratio dielectric regions of semiconductor device |
Dec. 2, 2008 |
| 7456097 |
System and method for faceting via top corners to improve metal fill |
Nov. 25, 2008 |
| 7453141 |
Semiconductor device package, method of manufacturing the same, and semiconductor device |
Nov. 18, 2008 |
| 7446036 |
Gap free anchored conductor and dielectric structure and method for fabrication thereof |
Nov. 4, 2008 |
| 7422978 |
Methods of manufacturing interposers with flexible solder pad elements |
Sep. 9, 2008 |
| 7416976 |
Method of forming contacts using auxiliary structures |
Aug. 26, 2008 |
| 7410824 |
Method for solder bumping, and solder-bumping structures produced thereby |
Aug. 12, 2008 |
| 7405156 |
Method of forming wiring pattern |
Jul. 29, 2008 |
| 7396762 |
Interconnect structures with linear repair layers and methods for forming such interconnection structures |
Jul. 8, 2008 |
| 7388279 |
Tapered dielectric and conductor structures and applications thereof |
Jun. 17, 2008 |
| 7384866 |
Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer |
Jun. 10, 2008 |
| 7358170 |
Methods of forming conductive interconnects, and methods of depositing nickel |
Apr. 15, 2008 |
| 7354856 |
Method for forming dual damascene structures with tapered via portions and improved performance |
Apr. 8, 2008 |
| 7341907 |
Single wafer thermal CVD processes for hemispherical grained silicon and nano-crystalline grain-sized polysilicon |
Mar. 11, 2008 |
| 7338897 |
Method of fabricating a semiconductor device having metal wiring |
Mar. 4, 2008 |
| 7335517 |
Multichip semiconductor device, chip therefor and method of formation thereof |
Feb. 26, 2008 |
| 7329601 |
Method of manufacturing semiconductor device |
Feb. 12, 2008 |
| 7326645 |
Methods for forming copper interconnect of semiconductor devices |
Feb. 5, 2008 |
| 7319067 |
Method of simultaneously controlling ADI-AEI CD differences of openings having different sizes and etching process utilizing the same method |
Jan. 15, 2008 |
| 7312400 |
Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method |
Dec. 25, 2007 |
| 7303648 |
Via etch process |
Dec. 4, 2007 |
| 7300879 |
Methods of fabricating metal wiring in semiconductor devices |
Nov. 27, 2007 |
| 7297628 |
Dynamically controllable reduction of vertical contact diameter through adjustment of etch mask stack for dielectric etch |
Nov. 20, 2007 |
| 7288205 |
Hermetic low dielectric constant layer for barrier applications |
Oct. 30, 2007 |
| 7285863 |
Pad structures including insulating layers having a tapered surface |
Oct. 23, 2007 |
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