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Class Information
Number: 438/640
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > With formation of opening (i.e., viahole) in insulative layer > Having viahole of tapered shape
Description: Processes wherein the viahole is formed so as to possess nonparallel sidewalls.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
8710648 Wafer level packaging structure with large contact area and preparation method thereof Apr. 29, 2014
8709942 Methods for fabricating semiconductor devices Apr. 29, 2014
8703606 Method for manufacturing semiconductor device having a wiring structure Apr. 22, 2014
8703609 Through-substrate via for semiconductor device Apr. 22, 2014
8673771 Pattern forming method Mar. 18, 2014
8664114 Image sensor and method for fabricating the same Mar. 4, 2014
8648404 Nonvolatile semiconductor memory device, three-dimensional semiconductor device, and method of manufacturing the same Feb. 11, 2014
8640072 Method for forming an electrical connection between metal layers Jan. 28, 2014
8629058 Methods for via structure with improved reliability Jan. 14, 2014
8629057 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods Jan. 14, 2014
8624253 Contact structure and semiconductor device Jan. 7, 2014
8586470 Multilevel interconnect structures and methods of fabricating same Nov. 19, 2013
8569167 Methods for forming a semiconductor structure Oct. 29, 2013
8563426 Shrinkage of contact elements and vias in a semiconductor device by incorporating additional tapering material Oct. 22, 2013
8524599 Methods of forming at least one conductive element and methods of forming a semiconductor structure Sep. 3, 2013
8519538 Laser etch via formation Aug. 27, 2013
8513130 Semiconductor substrate and method of fabricating semiconductor device Aug. 20, 2013
8492271 Semiconductor device and method of manufacturing the same Jul. 23, 2013
8487447 Semiconductor structure having offset passivation to reduce electromigration Jul. 16, 2013
8481887 Method for machining tapered micro holes Jul. 9, 2013
8466057 Integrated circuit packaging system with filled vias and method of manufacture thereof Jun. 18, 2013
8455350 Integrated circuit system employing gate shield and/or ground shield Jun. 4, 2013
8455357 Method of plating through wafer vias in a wafer for 3D packaging Jun. 4, 2013
8436473 Integrated circuits including air gaps around interconnect structures, and fabrication methods thereof May. 7, 2013
8431482 Integrated circuits and methods for processing integrated circuits with embedded features Apr. 30, 2013
8426299 Method of manufacturing semiconductor device Apr. 23, 2013
8404580 Methods for fabricating semiconductor devices Mar. 26, 2013
8399930 Method of manufacturing a semiconductor device having a contact plug Mar. 19, 2013
8394718 Methods of forming self-aligned through silicon via Mar. 12, 2013
8377820 Method of forming a metallization system of a semiconductor device by using a hard mask for defining the via size Feb. 19, 2013
8378496 Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection Feb. 19, 2013
8378498 Chip assembly with a coreless substrate employing a patterned adhesive layer Feb. 19, 2013
8368076 Contact structure and semiconductor device Feb. 5, 2013
8357571 Methods of forming semiconductor contacts Jan. 22, 2013
8349639 Method for manufacturing image sensor Jan. 8, 2013
8329582 Semiconductor device and method of manufacturing the same Dec. 11, 2012
8319347 Electronic device package and fabrication method thereof Nov. 27, 2012
8314026 Anchored conductive via and method for forming Nov. 20, 2012
8293644 Methods of manufacturing a semiconductor memory device Oct. 23, 2012
8293639 Method for controlling ADI-AEI CD difference ratio of openings having different sizes Oct. 23, 2012
8294034 Circuit board and process for fabricating the same Oct. 23, 2012
8278209 Method for manufacturing a semiconductor device using a hardmask layer Oct. 2, 2012
8278685 Semiconductor device used with high frequency band Oct. 2, 2012
8273657 Method for manufacturing a semiconductor apparatus having a through-hole interconnection Sep. 25, 2012
8273658 Integrated circuit arrangement including vias having two sections, and method for producing the same Sep. 25, 2012
8264086 Via structure with improved reliability Sep. 11, 2012
8258515 Contact structure and semiconductor device Sep. 4, 2012
8252659 Method for producing interconnect structures for integrated circuits Aug. 28, 2012
8252683 3D interconnection structure and method of manufacturing the same Aug. 28, 2012
8203207 Electronic device packages and methods of formation Jun. 19, 2012

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