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Class Information
Number: 438/64
Name: Semiconductor device manufacturing: process > Making device or circuit responsive to nonelectrical signal > Responsive to electromagnetic radiation > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process provided including (a) multiple

Sub-classes under this class:

Class Number Class Name Patents
438/65 Having additional optical element (e.g., optical fiber, etc.) 414
438/66 Plural responsive devices (e.g., array, etc.) 413

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Patent Number Title Of Patent Date Issued
7273765 Solid-state imaging device and method for producing the same Sep. 25, 2007
7271028 High density electronic interconnection Sep. 18, 2007
7268368 Semiconductor package having optical receptacles and light transmissive/opaque portions and method of making same Sep. 11, 2007
7262074 Methods of fabricating underfilled, encapsulated semiconductor die assemblies Aug. 28, 2007
7262405 Prefabricated housings for microelectronic imagers Aug. 28, 2007
7256410 Solid state relay Aug. 14, 2007
7253020 Deuterium alloy process for image sensors Aug. 7, 2007
7253355 Method for constructing a layer structure on a substrate Aug. 7, 2007
7253388 Assembly with self-alignment features to position a cover on a substrate that supports a micro component Aug. 7, 2007
7250324 Method for manufacturing an image sensor Jul. 31, 2007
7242069 Thin wafer detectors with improved radiation damage and crosstalk characteristics Jul. 10, 2007
7241640 Solder ball assembly for a semiconductor device and method of fabricating same Jul. 10, 2007
7235873 Protective device for subassemblies and method for producing a protective device Jun. 26, 2007
7223626 Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers May. 29, 2007
7217666 Reactive ion milling/RIE assisted CMP May. 15, 2007
7214116 Light-emitting diode and method for its production May. 8, 2007
7205175 Method for encapsulating a chip and/or other article Apr. 17, 2007
7195948 Method for fabricating semiconductor device Mar. 27, 2007
7192796 Methods and apparatus for packaging integrated circuit devices Mar. 20, 2007
7169691 Method of fabricating wafer-level packaging with sidewall passivation and related apparatus Jan. 30, 2007
7167376 Multilayer wiring board, method of mounting components, and image pick-up device Jan. 23, 2007
7157302 Imaging device and method of manufacture Jan. 2, 2007
7153718 Micromechanical component as well as a method for producing a micromechanical component Dec. 26, 2006
7154758 Method and semi-product for producing a chip card with a coil Dec. 26, 2006
7150568 Light-receiving element, manufacturing method for the same, optical module, and optical transmitting device Dec. 19, 2006
7148078 Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities Dec. 12, 2006
7148083 Transfer mold semiconductor packaging processes Dec. 12, 2006
7141448 Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials Nov. 28, 2006
7126216 Two part mold for wafer scale caps Oct. 24, 2006
7122874 Electronic package having a sealing structure on predetermined area, and the method thereof Oct. 17, 2006
7115853 Micro-lens configuration for small lens focusing in digital imaging devices Oct. 3, 2006
7115962 Housing for a photoactive semiconductor chip and a method for the production thereof Oct. 3, 2006
7112471 Leadless packaging for image sensor devices and methods of assembly Sep. 26, 2006
7098395 Thin-film solar cell module of see-through type Aug. 29, 2006
7091469 Packaging for optoelectronic devices Aug. 15, 2006
7087833 Nanostructure and nanocomposite based compositions and photovoltaic devices Aug. 8, 2006
7082678 Method of fabricating an integrated circuit package Aug. 1, 2006
7084511 Semiconductor device having resin-sealed area on circuit board thereof Aug. 1, 2006
7074638 Solid-state imaging device and method of manufacturing said solid-state imaging device Jul. 11, 2006
7067347 Method of manufacturing optical semiconductor integrated circuit device Jun. 27, 2006
7061697 Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device Jun. 13, 2006
7061127 Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus Jun. 13, 2006
7057271 Apparatus for connecting an IC terminal to a reference potential Jun. 6, 2006
7049166 Methods and apparatus for making integrated circuit package including opening exposing portion of the IC May. 23, 2006
7041611 Enhancement of fabrication yields of nanomechanical devices by thin film deposition May. 9, 2006
7026176 Mold making method for wafer scale caps Apr. 11, 2006
7022550 Methods for forming aluminum-containing p-contacts for group III-nitride light emitting diodes Apr. 4, 2006
7019401 Multi-layer substrate structure for reducing layout area Mar. 28, 2006
7018870 Laser diode and heatsink quick connect/disconnect assembly Mar. 28, 2006
7019375 Solid-state imaging apparatus and manufacturing method thereof Mar. 28, 2006

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

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