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Class Information
Number: 438/64
Name: Semiconductor device manufacturing: process > Making device or circuit responsive to nonelectrical signal > Responsive to electromagnetic radiation > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process provided including (a) multiple
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7262405 |
Prefabricated housings for microelectronic imagers |
Aug. 28, 2007 |
| 7256410 |
Solid state relay |
Aug. 14, 2007 |
| 7253020 |
Deuterium alloy process for image sensors |
Aug. 7, 2007 |
| 7253355 |
Method for constructing a layer structure on a substrate |
Aug. 7, 2007 |
| 7253388 |
Assembly with self-alignment features to position a cover on a substrate that supports a micro component |
Aug. 7, 2007 |
| 7250324 |
Method for manufacturing an image sensor |
Jul. 31, 2007 |
| 7241640 |
Solder ball assembly for a semiconductor device and method of fabricating same |
Jul. 10, 2007 |
| 7242069 |
Thin wafer detectors with improved radiation damage and crosstalk characteristics |
Jul. 10, 2007 |
| 7235873 |
Protective device for subassemblies and method for producing a protective device |
Jun. 26, 2007 |
| 7223626 |
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers |
May. 29, 2007 |
| 7217666 |
Reactive ion milling/RIE assisted CMP |
May. 15, 2007 |
| 7214116 |
Light-emitting diode and method for its production |
May. 8, 2007 |
| 7205175 |
Method for encapsulating a chip and/or other article |
Apr. 17, 2007 |
| 7195948 |
Method for fabricating semiconductor device |
Mar. 27, 2007 |
| 7192796 |
Methods and apparatus for packaging integrated circuit devices |
Mar. 20, 2007 |
| 7169691 |
Method of fabricating wafer-level packaging with sidewall passivation and related apparatus |
Jan. 30, 2007 |
| 7167376 |
Multilayer wiring board, method of mounting components, and image pick-up device |
Jan. 23, 2007 |
| 7157302 |
Imaging device and method of manufacture |
Jan. 2, 2007 |
| 7154758 |
Method and semi-product for producing a chip card with a coil |
Dec. 26, 2006 |
| 7153718 |
Micromechanical component as well as a method for producing a micromechanical component |
Dec. 26, 2006 |
| 7150568 |
Light-receiving element, manufacturing method for the same, optical module, and optical transmitting device |
Dec. 19, 2006 |
| 7148078 |
Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities |
Dec. 12, 2006 |
| 7148083 |
Transfer mold semiconductor packaging processes |
Dec. 12, 2006 |
| 7141448 |
Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials |
Nov. 28, 2006 |
| 7126216 |
Two part mold for wafer scale caps |
Oct. 24, 2006 |
| 7122874 |
Electronic package having a sealing structure on predetermined area, and the method thereof |
Oct. 17, 2006 |
| 7115962 |
Housing for a photoactive semiconductor chip and a method for the production thereof |
Oct. 3, 2006 |
| 7115853 |
Micro-lens configuration for small lens focusing in digital imaging devices |
Oct. 3, 2006 |
| 7112471 |
Leadless packaging for image sensor devices and methods of assembly |
Sep. 26, 2006 |
| 7098395 |
Thin-film solar cell module of see-through type |
Aug. 29, 2006 |
| 7091469 |
Packaging for optoelectronic devices |
Aug. 15, 2006 |
| 7087833 |
Nanostructure and nanocomposite based compositions and photovoltaic devices |
Aug. 8, 2006 |
| 7082678 |
Method of fabricating an integrated circuit package |
Aug. 1, 2006 |
| 7084511 |
Semiconductor device having resin-sealed area on circuit board thereof |
Aug. 1, 2006 |
| 7074638 |
Solid-state imaging device and method of manufacturing said solid-state imaging device |
Jul. 11, 2006 |
| 7067347 |
Method of manufacturing optical semiconductor integrated circuit device |
Jun. 27, 2006 |
| 7061697 |
Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device |
Jun. 13, 2006 |
| 7061127 |
Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus |
Jun. 13, 2006 |
| 7057271 |
Apparatus for connecting an IC terminal to a reference potential |
Jun. 6, 2006 |
| 7049166 |
Methods and apparatus for making integrated circuit package including opening exposing portion of the IC |
May. 23, 2006 |
| 7041611 |
Enhancement of fabrication yields of nanomechanical devices by thin film deposition |
May. 9, 2006 |
| 7026176 |
Mold making method for wafer scale caps |
Apr. 11, 2006 |
| 7022550 |
Methods for forming aluminum-containing p-contacts for group III-nitride light emitting diodes |
Apr. 4, 2006 |
| 7019401 |
Multi-layer substrate structure for reducing layout area |
Mar. 28, 2006 |
| 7018870 |
Laser diode and heatsink quick connect/disconnect assembly |
Mar. 28, 2006 |
| 7019375 |
Solid-state imaging apparatus and manufacturing method thereof |
Mar. 28, 2006 |
| 7005720 |
Semiconductor package with photosensitive chip and fabrication method thereof |
Feb. 28, 2006 |
| 7005311 |
Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
Feb. 28, 2006 |
| 7001795 |
Total internal reflection (TIR) CMOS imager |
Feb. 21, 2006 |
| 7000664 |
Sheet set apparatus for sealing preparation, output lead wire set apparatus for sealing preparation, and sealing preparation apparatus |
Feb. 21, 2006 |
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