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Class Information
Number: 438/64
Name: Semiconductor device manufacturing: process > Making device or circuit responsive to nonelectrical signal > Responsive to electromagnetic radiation > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process provided including (a) multiple










Sub-classes under this class:

Class Number Class Name Patents
438/65 Having additional optical element (e.g., optical fiber, etc.) 414
438/66 Plural responsive devices (e.g., array, etc.) 413


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Patent Number Title Of Patent Date Issued
7479398 Methods and apparatus for packaging integrated circuit devices Jan. 20, 2009
7479627 Semiconductor device having transparent member and manufacturing method of the same Jan. 20, 2009
7477811 Method of forming a three-dimensional stacked optical device Jan. 13, 2009
7473578 Encapsulation for particle entrapment Jan. 6, 2009
7470560 Image sensor having a charge storage region provided within an implant region Dec. 30, 2008
7468293 Method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing Dec. 23, 2008
7468288 Die-level opto-electronic device and method of making same Dec. 23, 2008
7465603 Wafer level package structure of optical-electronic device and method for making the same Dec. 16, 2008
7465873 Solar cell module, method of laying solar cell modules, and apparatus for preventing solar cell modules from being blown off Dec. 16, 2008
7449362 One-component hot-setting epoxy resin composition and semiconductor mounting underfill material Nov. 11, 2008
7445959 Sensor module and method of manufacturing same Nov. 4, 2008
7425750 Snap lid camera module Sep. 16, 2008
7422929 Wafer-level packaging of optoelectronic devices Sep. 9, 2008
7419854 Methods for packaging image sensitive electronic devices Sep. 2, 2008
7416913 Methods of manufacturing microelectronic imaging units with discrete standoffs Aug. 26, 2008
7417309 Circuit device and portable device with symmetrical arrangement Aug. 26, 2008
7414661 CMOS image sensor using gradient index chip scale lenses Aug. 19, 2008
7410820 MEMS passivation with phosphonate surfactants Aug. 12, 2008
7402454 Molded integrated circuit package with exposed active area Jul. 22, 2008
7402453 Microelectronic imaging units and methods of manufacturing microelectronic imaging units Jul. 22, 2008
7399997 Semiconductor laser device and fabrication method thereof Jul. 15, 2008
7390687 Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers Jun. 24, 2008
7384805 Transfer mold semiconductor packaging processes Jun. 10, 2008
7371652 Alignment using fiducial features May. 13, 2008
7371606 Manufacturing method of a semiconductor device May. 13, 2008
7371603 Method of fabricating light emitting diode package May. 13, 2008
7371602 Semiconductor package structure and method for manufacturing the same May. 13, 2008
7368758 Method for hermetically housing optical components, and optical components produced according to said method May. 6, 2008
7365266 Method and system for mounting photovoltaic material Apr. 29, 2008
7361525 Semiconductor integrated device having solid-state image sensor packaged within and production method for same Apr. 22, 2008
7348193 Hermetic seals for micro-electromechanical system devices Mar. 25, 2008
7348203 Hermetic packaging Mar. 25, 2008
7335870 Method for image sensor protection Feb. 26, 2008
7332411 Systems and methods for wafer bonding by localized induction heating Feb. 19, 2008
7332701 Dual-mode CMOS imaging sensor with supporting LED Feb. 19, 2008
7326590 Method for manufacturing ball grid array package Feb. 5, 2008
7323779 Semiconductor device Jan. 29, 2008
7321455 Microelectronic devices and methods for packaging microelectronic devices Jan. 22, 2008
RE39957 Method of making semiconductor package with heat spreader Dec. 25, 2007
7312521 Semiconductor device with holding member Dec. 25, 2007
7301225 Multi-row lead frame Nov. 27, 2007
7297573 Methods and apparatus for particle reduction in MEMS devices Nov. 20, 2007
7294827 Electronic module with light-blocking features Nov. 13, 2007
7291513 Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy Nov. 6, 2007
7291518 Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof Nov. 6, 2007
7288757 Microelectronic imaging devices and associated methods for attaching transmissive elements Oct. 30, 2007
7288435 Method for producing a cover, method for producing a packaged device Oct. 30, 2007
7276387 Castellation wafer level packaging of integrated circuit chips Oct. 2, 2007
7276393 Microelectronic imaging units and methods of manufacturing microelectronic imaging units Oct. 2, 2007
7276394 Large area flat image sensor assembly Oct. 2, 2007

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15










 
 
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