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Class Information
Number: 438/64
Name: Semiconductor device manufacturing: process > Making device or circuit responsive to nonelectrical signal > Responsive to electromagnetic radiation > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process provided including (a) multiple










Sub-classes under this class:

Class Number Class Name Patents
438/65 Having additional optical element (e.g., optical fiber, etc.) 414
438/66 Plural responsive devices (e.g., array, etc.) 413


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Patent Number Title Of Patent Date Issued
7655540 Method and jig structure for positioning bare dice Feb. 2, 2010
7655507 Microelectronic imaging units and methods of manufacturing microelectronic imaging units Feb. 2, 2010
7651881 Solid-state imaging device and method for manufacturing the same Jan. 26, 2010
7651882 RFID tag circuit die with shielding layer to control I/O bump flow Jan. 26, 2010
7648851 Method of fabricating backside illuminated image sensor Jan. 19, 2010
7646539 Optical device and manufacturing method thereof Jan. 12, 2010
7642137 Manufacturing method of chip package Jan. 5, 2010
7642119 Method for manufacturing image sensor Jan. 5, 2010
7638348 Microlenses of CMOS image sensor and method for fabricating the same Dec. 29, 2009
7635600 Photovoltaic structure with a conductive nanowire array electrode Dec. 22, 2009
7635606 Wafer level package with cavities for active devices Dec. 22, 2009
7632707 Electronic device package and method of manufacturing the same Dec. 15, 2009
7632713 Methods of packaging microelectronic imaging devices Dec. 15, 2009
7626247 Electronic package with integral electromagnetic radiation shield and methods related thereto Dec. 1, 2009
7626167 Infrared sensor Dec. 1, 2009
7619312 Method and apparatus for precisely aligning integrated circuit chips Nov. 17, 2009
7615397 Micro-element package and manufacturing method thereof Nov. 10, 2009
7608470 Interconnection device including one or more embedded vias and method of producing the same Oct. 27, 2009
7601559 Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor Oct. 13, 2009
7595540 Semiconductor device and method of manufacturing the same Sep. 29, 2009
7592195 Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement Sep. 22, 2009
7588951 Method of packaging a semiconductor device and a prefabricated connector Sep. 15, 2009
7582505 Solid-state imaging device and method of manufacturing said solid-state imaging device Sep. 1, 2009
7582954 Optical leadless leadframe package Sep. 1, 2009
7579583 Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same Aug. 25, 2009
7576403 Method of manufacturing infrared rays receiver and structure thereof Aug. 18, 2009
7572665 Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same Aug. 11, 2009
7566588 Semiconductor device with a resin-sealed optical semiconductor element Jul. 28, 2009
7564033 Microstructured sensor Jul. 21, 2009
7563652 Method for encapsulating sensor chips Jul. 21, 2009
7553688 Methods for packaging image sensitive electronic devices Jun. 30, 2009
7550319 Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof Jun. 23, 2009
7547571 Packaging method of a light-sensing semiconductor device and packaging structure thereof Jun. 16, 2009
7547583 Light emitting diode package with direct leadframe heat dissipation Jun. 16, 2009
7534645 CMOS type image sensor module having transparent polymeric encapsulation material May. 19, 2009
7531845 Semiconductor light emitting device May. 12, 2009
7524696 Sensor including lead frame and method of forming sensor including lead frame Apr. 28, 2009
7520680 Light-receiving element, manufacturing method for the same, optical module, and optical transmitting device Apr. 21, 2009
7521271 Method of manufacturing a transponder Apr. 21, 2009
7521279 Image projection at different image planes Apr. 21, 2009
7517712 Wafer-level hermetic micro-device packages Apr. 14, 2009
7511374 Microelectronic imaging units having covered image sensors Mar. 31, 2009
7510902 Image sensor chip package and method of fabricating the same Mar. 31, 2009
7510889 Light emitting chip package and manufacturing method thereof Mar. 31, 2009
7504278 Image sensor and method for manufacturing the same Mar. 17, 2009
7498678 Electronic assemblies and systems with filled no-flow underfill Mar. 3, 2009
7494848 Flip-chip packaging of a photo-sensor die on a transparent substrate Feb. 24, 2009
7491570 Die package having an adhesive flow restriction area Feb. 17, 2009
7485848 Optical device and production method thereof Feb. 3, 2009
7485489 Electronics circuit manufacture Feb. 3, 2009

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15










 
 
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