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Class Information
Number: 438/64
Name: Semiconductor device manufacturing: process > Making device or circuit responsive to nonelectrical signal > Responsive to electromagnetic radiation > Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor
Description: Process provided including (a) multiple
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7615397 |
Micro-element package and manufacturing method thereof |
Nov. 10, 2009 |
| 7608470 |
Interconnection device including one or more embedded vias and method of producing the same |
Oct. 27, 2009 |
| 7601559 |
Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor |
Oct. 13, 2009 |
| 7595540 |
Semiconductor device and method of manufacturing the same |
Sep. 29, 2009 |
| 7592195 |
Method for producing a sensor or actuator arrangement, and corresponding sensor or actuator arrangement |
Sep. 22, 2009 |
| 7588951 |
Method of packaging a semiconductor device and a prefabricated connector |
Sep. 15, 2009 |
| 7582505 |
Solid-state imaging device and method of manufacturing said solid-state imaging device |
Sep. 1, 2009 |
| 7582954 |
Optical leadless leadframe package |
Sep. 1, 2009 |
| 7579583 |
Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same |
Aug. 25, 2009 |
| 7576403 |
Method of manufacturing infrared rays receiver and structure thereof |
Aug. 18, 2009 |
| 7572665 |
Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same |
Aug. 11, 2009 |
| 7566588 |
Semiconductor device with a resin-sealed optical semiconductor element |
Jul. 28, 2009 |
| 7564033 |
Microstructured sensor |
Jul. 21, 2009 |
| 7563652 |
Method for encapsulating sensor chips |
Jul. 21, 2009 |
| 7553688 |
Methods for packaging image sensitive electronic devices |
Jun. 30, 2009 |
| 7550319 |
Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
Jun. 23, 2009 |
| 7547583 |
Light emitting diode package with direct leadframe heat dissipation |
Jun. 16, 2009 |
| 7547571 |
Packaging method of a light-sensing semiconductor device and packaging structure thereof |
Jun. 16, 2009 |
| 7534645 |
CMOS type image sensor module having transparent polymeric encapsulation material |
May. 19, 2009 |
| 7531845 |
Semiconductor light emitting device |
May. 12, 2009 |
| 7524696 |
Sensor including lead frame and method of forming sensor including lead frame |
Apr. 28, 2009 |
| 7520680 |
Light-receiving element, manufacturing method for the same, optical module, and optical transmitting device |
Apr. 21, 2009 |
| 7521271 |
Method of manufacturing a transponder |
Apr. 21, 2009 |
| 7521279 |
Image projection at different image planes |
Apr. 21, 2009 |
| 7517712 |
Wafer-level hermetic micro-device packages |
Apr. 14, 2009 |
| 7511374 |
Microelectronic imaging units having covered image sensors |
Mar. 31, 2009 |
| 7510902 |
Image sensor chip package and method of fabricating the same |
Mar. 31, 2009 |
| 7510889 |
Light emitting chip package and manufacturing method thereof |
Mar. 31, 2009 |
| 7504278 |
Image sensor and method for manufacturing the same |
Mar. 17, 2009 |
| 7498678 |
Electronic assemblies and systems with filled no-flow underfill |
Mar. 3, 2009 |
| 7494848 |
Flip-chip packaging of a photo-sensor die on a transparent substrate |
Feb. 24, 2009 |
| 7491570 |
Die package having an adhesive flow restriction area |
Feb. 17, 2009 |
| 7485848 |
Optical device and production method thereof |
Feb. 3, 2009 |
| 7485489 |
Electronics circuit manufacture |
Feb. 3, 2009 |
| 7479398 |
Methods and apparatus for packaging integrated circuit devices |
Jan. 20, 2009 |
| 7479627 |
Semiconductor device having transparent member and manufacturing method of the same |
Jan. 20, 2009 |
| 7477811 |
Method of forming a three-dimensional stacked optical device |
Jan. 13, 2009 |
| 7473578 |
Encapsulation for particle entrapment |
Jan. 6, 2009 |
| 7470560 |
Image sensor having a charge storage region provided within an implant region |
Dec. 30, 2008 |
| 7468293 |
Method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing |
Dec. 23, 2008 |
| 7468288 |
Die-level opto-electronic device and method of making same |
Dec. 23, 2008 |
| 7465603 |
Wafer level package structure of optical-electronic device and method for making the same |
Dec. 16, 2008 |
| 7465873 |
Solar cell module, method of laying solar cell modules, and apparatus for preventing solar cell modules from being blown off |
Dec. 16, 2008 |
| 7449362 |
One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
Nov. 11, 2008 |
| 7445959 |
Sensor module and method of manufacturing same |
Nov. 4, 2008 |
| 7425750 |
Snap lid camera module |
Sep. 16, 2008 |
| 7422929 |
Wafer-level packaging of optoelectronic devices |
Sep. 9, 2008 |
| 7419854 |
Methods for packaging image sensitive electronic devices |
Sep. 2, 2008 |
| 7416913 |
Methods of manufacturing microelectronic imaging units with discrete standoffs |
Aug. 26, 2008 |
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