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Class Information
Number: 438/639
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > With formation of opening (i.e., viahole) in insulative layer > Having viahole with sidewall component
Description: Processes wherein the viahole has an additional component formed along the sidewall thereof.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8710672 Semiconductor device and method of manufacturing the same Apr. 29, 2014
8703605 High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability Apr. 22, 2014
8704343 Borderless interconnect line structure self-aligned to upper and lower level contact vias Apr. 22, 2014
8686385 Phase-change random access memory device and method of manufacturing the same Apr. 1, 2014
8679968 Method for forming a self-aligned contact opening by a lateral etch Mar. 25, 2014
8673767 Manufacturing method for semiconductor device Mar. 18, 2014
8673787 Method to reduce charge buildup during high aspect ratio contact etch Mar. 18, 2014
8674508 Seal ring structures with reduced moisture-induced reliability degradation Mar. 18, 2014
8669180 Semiconductor device with self aligned end-to-end conductive line structure and method of forming the same Mar. 11, 2014
8664114 Image sensor and method for fabricating the same Mar. 4, 2014
8653664 Barrier layers for copper interconnect Feb. 18, 2014
8652966 Semiconductor device manufacturing method and semiconductor device Feb. 18, 2014
8647920 Method for forming 3D-interconnect structures with airgaps Feb. 11, 2014
8643186 Processed wafer via Feb. 4, 2014
8637962 Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate Jan. 28, 2014
8637397 Method for manufacturing a through hole electrode substrate Jan. 28, 2014
8640072 Method for forming an electrical connection between metal layers Jan. 28, 2014
8629057 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods Jan. 14, 2014
8617975 Semiconductor processing methods Dec. 31, 2013
8614515 Wiring method for semiconductor integrated circuit, semiconductor-circuit wiring apparatus and semiconductor integrated circuit Dec. 24, 2013
8610275 Semiconductor contact structure including a spacer formed within a via and method of manufacturing the same Dec. 17, 2013
8609533 Methods for fabricating integrated circuits having substrate contacts and integrated circuits having substrate contacts Dec. 17, 2013
8609534 Electrical fuse structure and method of fabricating same Dec. 17, 2013
8603918 Semiconductor devices and methods of manufacture thereof Dec. 10, 2013
8598042 Device manufacturing and cleaning method Dec. 3, 2013
8580669 Method for fabricating semiconductor device Nov. 12, 2013
8575019 Metal interconnection structure and method for forming metal interlayer via and metal interconnection line Nov. 5, 2013
8575758 Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies Nov. 5, 2013
8563426 Shrinkage of contact elements and vias in a semiconductor device by incorporating additional tapering material Oct. 22, 2013
8564135 Backside illuminated sensor and manufacturing method thereof Oct. 22, 2013
8536051 Manufacture method for semiconductor device Sep. 17, 2013
8519482 Reliable contacts Aug. 27, 2013
8513115 Method of forming an interconnect structure having an enlarged region Aug. 20, 2013
8513113 Methods of forming semiconductor constructions and assemblies Aug. 20, 2013
8506831 Combination, method, and composition for chemical mechanical planarization of a tungsten-containing substrate Aug. 13, 2013
8509277 Optical device Aug. 13, 2013
8492271 Semiconductor device and method of manufacturing the same Jul. 23, 2013
8492808 Semiconductor device and manufacturing method thereof Jul. 23, 2013
8492272 Passivated through wafer vias in low-doped semiconductor substrates Jul. 23, 2013
8487447 Semiconductor structure having offset passivation to reduce electromigration Jul. 16, 2013
8481416 Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same Jul. 9, 2013
8461692 Semiconductor device structures including damascene trenches with conductive structures and related method Jun. 11, 2013
8455357 Method of plating through wafer vias in a wafer for 3D packaging Jun. 4, 2013
8445325 Package-in-package using through-hole via die on saw streets May. 21, 2013
8435874 Method of forming openings in a semiconductor device and a semiconductor device fabricated by the method May. 7, 2013
8431487 Method for forming a plug structure Apr. 30, 2013
8426308 Method of forming through silicon via of semiconductor device using low-k dielectric material Apr. 23, 2013
8415251 Electric component and component and method for the production thereof Apr. 9, 2013
8409956 Methods of forming integrated circuit devices using self-aligned contact formation techniques Apr. 2, 2013
8388854 Methods of forming nanodots using spacer patterning techniques and structures formed thereby Mar. 5, 2013

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