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Class Information
Number: 438/638
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > With formation of opening (i.e., viahole) in insulative layer > Having viaholes of diverse width
Description: Processes wherein at least one viahole is formed which is wider than at least one other viahole.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618889 |
Dual damascene fabrication with low k materials |
Nov. 17, 2009 |
| 7618860 |
Method for fabricating semiconductor device |
Nov. 17, 2009 |
| 7615480 |
Methods of post-contact back end of the line through-hole via integration |
Nov. 10, 2009 |
| 7615484 |
Integrated circuit manufacturing method using hard mask |
Nov. 10, 2009 |
| 7605085 |
Method of manufacturing interconnecting structure with vias |
Oct. 20, 2009 |
| 7601635 |
Method of manufacturing a semiconductor device |
Oct. 13, 2009 |
| 7601641 |
Two step optical planarizing layer etch |
Oct. 13, 2009 |
| 7598616 |
Interconnect structure |
Oct. 6, 2009 |
| 7595236 |
Method for production of semiconductor device having a hole extending through a first insulating film, a second insulating film and a third insulating film |
Sep. 29, 2009 |
| 7592253 |
Method for forming a damascene pattern of a copper metallization layer |
Sep. 22, 2009 |
| 7589008 |
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
Sep. 15, 2009 |
| 7589014 |
Semiconductor device having multiple wiring layers and method of producing the same |
Sep. 15, 2009 |
| 7585758 |
Interconnect layers without electromigration |
Sep. 8, 2009 |
| 7585762 |
Vapor deposition processes for tantalum carbide nitride materials |
Sep. 8, 2009 |
| 7582555 |
CVD flowable gap fill |
Sep. 1, 2009 |
| 7576413 |
Packaged stacked semiconductor device and method for manufacturing the same |
Aug. 18, 2009 |
| 7575999 |
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies |
Aug. 18, 2009 |
| 7575998 |
Semiconductor device and metal line fabrication method of the same |
Aug. 18, 2009 |
| 7575996 |
Semiconductor device and method for manufacturing the same |
Aug. 18, 2009 |
| 7572682 |
Semiconductor structure for fuse and anti-fuse applications |
Aug. 11, 2009 |
| 7572727 |
Semiconductor formation method that utilizes multiple etch stop layers |
Aug. 11, 2009 |
| 7572728 |
Semiconductor device and method for manufacturing the same |
Aug. 11, 2009 |
| 7569485 |
Method for an integrated circuit contact |
Aug. 4, 2009 |
| 7569480 |
Semiconductor devices and methods of fabricating the same |
Aug. 4, 2009 |
| 7569479 |
Method for fabricating semiconductor device |
Aug. 4, 2009 |
| 7566643 |
Liquid phase deposition of contacts in programmable resistance and switching devices |
Jul. 28, 2009 |
| 7566648 |
Method of making solder pad |
Jul. 28, 2009 |
| 7563708 |
Method for manufacturing semiconductor device |
Jul. 21, 2009 |
| 7563710 |
Method of fabrication of interconnect structures |
Jul. 21, 2009 |
| 7560378 |
Method for manufacturing semiconductor device |
Jul. 14, 2009 |
| 7560377 |
Plasma processes for depositing low dielectric constant films |
Jul. 14, 2009 |
| 7560375 |
Gas dielectric structure forming methods |
Jul. 14, 2009 |
| 7557034 |
Semiconductor device and a method of manufacturing the same |
Jul. 7, 2009 |
| 7557035 |
Method of forming semiconductor devices by microwave curing of low-k dielectric films |
Jul. 7, 2009 |
| 7553758 |
Method of fabricating interconnections of microelectronic device using dual damascene process |
Jun. 30, 2009 |
| 7553761 |
Method of fabricating semiconductor device |
Jun. 30, 2009 |
| 7547584 |
Method of reducing charging damage to integrated circuits during semiconductor manufacturing |
Jun. 16, 2009 |
| RE40748 |
Process for producing semiconductor device |
Jun. 16, 2009 |
| 7544608 |
Porous and dense hybrid interconnect structure and method of manufacture |
Jun. 9, 2009 |
| 7544605 |
Method of making a contact on a backside of a die |
Jun. 9, 2009 |
| 7544602 |
Method and structure for ultra narrow crack stop for multilevel semiconductor device |
Jun. 9, 2009 |
| 7541281 |
Method for manufacturing electronic device |
Jun. 2, 2009 |
| 7538027 |
Fabrication method for semiconductor interconnections |
May. 26, 2009 |
| 7538028 |
Barrier layer, IC via, and IC line forming methods |
May. 26, 2009 |
| 7534721 |
Semiconductor device manufacturing device |
May. 19, 2009 |
| 7534720 |
Methods of fabricating semiconductor device having slope at lower sides of interconnection hole with etch-stop layer |
May. 19, 2009 |
| 7531446 |
Method of manufacturing a semiconductor device |
May. 12, 2009 |
| 7531448 |
Manufacturing method of dual damascene structure |
May. 12, 2009 |
| 7531449 |
Method of forming fine patterns using double patterning process |
May. 12, 2009 |
| 7531450 |
Method of fabricating semiconductor device having contact hole with high aspect-ratio |
May. 12, 2009 |
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