| Patent Number |
Title Of Patent |
Date Issued |
| 7247556 |
Control of wafer warpage during backend processing |
Jul. 24, 2007 |
| 7232746 |
Method for forming dual damascene interconnection in semiconductor device |
Jun. 19, 2007 |
| 7232748 |
BARC/resist via etchback process |
Jun. 19, 2007 |
| 7220679 |
Method for forming patterns in a semiconductor device |
May. 22, 2007 |
| 7189640 |
Method of forming damascene structures |
Mar. 13, 2007 |
| 7183200 |
Method for fabricating a semiconductor device |
Feb. 27, 2007 |
| 7179732 |
Interconnection structure and fabrication method thereof |
Feb. 20, 2007 |
| 7176130 |
Plasma treatment for surface of semiconductor device |
Feb. 13, 2007 |
| 7151054 |
Semiconductor processing methods of forming and utilizing antireflective material layers, and methods of forming transistor gate stacks |
Dec. 19, 2006 |
| 7135400 |
Damascene process capable of avoiding via resist poisoning |
Nov. 14, 2006 |
| 7132362 |
Semiconductor device with contacts having uniform contact resistance and method for manufacturing the same |
Nov. 7, 2006 |
| 7125741 |
Rework process of patterned photo-resist layer |
Oct. 24, 2006 |
| 7119009 |
Semiconductor device with dual damascene wiring |
Oct. 10, 2006 |
| 7101787 |
System and method for minimizing increases in via resistance by applying a nitrogen plasma after a titanium liner deposition |
Sep. 5, 2006 |
| 7075137 |
Semiconductor memory having charge trapping memory cells |
Jul. 11, 2006 |
| 7056826 |
Method of forming copper interconnects |
Jun. 6, 2006 |
| 7052988 |
Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing |
May. 30, 2006 |
| 7045454 |
Chemical mechanical planarization of conductive material |
May. 16, 2006 |
| 7045455 |
Via electromigration improvement by changing the via bottom geometric profile |
May. 16, 2006 |
| 7030031 |
Method for forming damascene structure utilizing planarizing material coupled with diffusion barrier material |
Apr. 18, 2006 |
| 7015133 |
Dual damascene structure formed of low-k dielectric materials |
Mar. 21, 2006 |
| 7015134 |
Method for reducing anti-reflective coating layer removal during removal of photoresist |
Mar. 21, 2006 |
| 7015135 |
Method and system for reducing contact defects using non conventional contact formation method for semiconductor cells |
Mar. 21, 2006 |
| 7012022 |
Self-patterning of photo-active dielectric materials for interconnect isolation |
Mar. 14, 2006 |
| 7008869 |
Method for forming metal wiring without metal byproducts that create bridge between metal wires in a semiconductor device |
Mar. 7, 2006 |
| 7005374 |
Method for forming contact hole |
Feb. 28, 2006 |
| 7001833 |
Method for forming openings in low-k dielectric layers |
Feb. 21, 2006 |
| 7001843 |
Methods of forming metal lines in semiconductor devices |
Feb. 21, 2006 |
| 7001836 |
Two step trench definition procedure for formation of a dual damascene opening in a stack of insulator layers |
Feb. 21, 2006 |
| 7001838 |
Method of wet etching an inorganic antireflection layer |
Feb. 21, 2006 |
| 6987060 |
Semiconductor device having improved contact hole structure and method for fabricating the same |
Jan. 17, 2006 |
| 6962874 |
Method for fabricating semiconductor device |
Nov. 8, 2005 |
| 6960529 |
Methods for sidewall protection of metal interconnect for unlanded vias using physical vapor deposition |
Nov. 1, 2005 |
| 6960523 |
Method of reducing erosion of a nitride gate cap layer during reactive ion etch of nitride liner layer for bit line contact of DRAM device |
Nov. 1, 2005 |
| 6958294 |
Method for photoresist strip, sidewall polymer removal and passivation for aluminum metallization |
Oct. 25, 2005 |
| 6951826 |
Silicon carbide deposition for use as a low dielectric constant anti-reflective coating |
Oct. 4, 2005 |
| 6948238 |
Method for dissociating metals from metal compounds |
Sep. 27, 2005 |
| 6939794 |
Boron-doped amorphous carbon film for use as a hard etch mask during the formation of a semiconductor device |
Sep. 6, 2005 |
| 6936539 |
Antireflective coating for use during the manufacture of a semiconductor device |
Aug. 30, 2005 |
| 6933227 |
Semiconductor device and method of forming the same |
Aug. 23, 2005 |
| 6933191 |
Two-mask process for metal-insulator-metal capacitors and single mask process for thin film resistors |
Aug. 23, 2005 |
| 6930036 |
Semiconductor device and method of manufacturing the same |
Aug. 16, 2005 |
| 6924228 |
Method of forming a via contact structure using a dual damascene technique |
Aug. 2, 2005 |
| 6908852 |
Method of forming an arc layer for a semiconductor device |
Jun. 21, 2005 |
| 6903007 |
Process for forming bottom anti-reflection coating for semiconductor fabrication photolithography which inhibits photoresist footing |
Jun. 7, 2005 |
| 6900123 |
BARC etch comprising a selective etch chemistry and a high polymerizing gas for CD control |
May. 31, 2005 |
| 6893958 |
Methods for preventing cross-linking between multiple resists and patterning multiple resists |
May. 17, 2005 |
| 6884651 |
Producing method of CMOS image sensor |
Apr. 26, 2005 |
| 6867129 |
Method of improving the top plate electrode stress inducting voids for 1T-RAM process |
Mar. 15, 2005 |
| 6864556 |
CVD organic polymer film for advanced gate patterning |
Mar. 8, 2005 |
