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Class Information
Number: 438/635
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Insulator formed by reaction with conductor (e.g., oxidation, etc.)
Description: Processes wherein an insulating layer is formed by the conversion of a conductive layer at least in part to an electrically insulative material.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8709954 Wafer recycling method Apr. 29, 2014
8557697 Vapor deposition methods for forming a metal-containing layer on a substrate Oct. 15, 2013
8551851 Titanium-based high-K dielectric films Oct. 8, 2013
8349725 Method of manufacturing semiconductor device, semiconductor manufacturing apparatus, and storage medium Jan. 8, 2013
8294202 Metal gate structure of a semiconductor device Oct. 23, 2012
8216933 Krypton sputtering of low resistivity tungsten Jul. 10, 2012
8183150 Semiconductor device having silicon carbide and conductive pathway interface May. 22, 2012
8119524 Method of manufacturing semiconductor device Feb. 21, 2012
8034705 Method of forming a seam-free tungsten plug Oct. 11, 2011
8021989 Method for high topography patterning Sep. 20, 2011
7989339 Vapor deposition processes for tantalum carbide nitride materials Aug. 2, 2011
7989342 Formation of a reliable diffusion-barrier cap on a Cu-containing interconnect element having grains with different crystal orientations Aug. 2, 2011
7968452 Titanium-based high-K dielectric films Jun. 28, 2011
7892964 Vapor deposition methods for forming a metal-containing layer on a substrate Feb. 22, 2011
7842603 Method for fabricating semiconductor memory device Nov. 30, 2010
7833900 Interconnections for integrated circuits including reducing an overburden and annealing Nov. 16, 2010
7829457 Protection of conductors from oxidation in deposition chambers Nov. 9, 2010
7736963 Method of forming a gate structure for a semiconductor device and method of forming a cell gate structure for a non-volatile memory device Jun. 15, 2010
7709349 Semiconductor device manufactured using a gate silicidation involving a disposable chemical/mechanical polishing stop layer May. 4, 2010
7674724 Oxidizing method and oxidizing unit for object to be processed Mar. 9, 2010
7618891 Method for forming self-aligned metal silicide contacts Nov. 17, 2009
7585762 Vapor deposition processes for tantalum carbide nitride materials Sep. 8, 2009
7569467 Semiconductor device and manufacturing method thereof Aug. 4, 2009
7569477 Method for fabricating fine pattern in semiconductor device Aug. 4, 2009
7566643 Liquid phase deposition of contacts in programmable resistance and switching devices Jul. 28, 2009
7491638 Method of forming an insulating capping layer for a copper metallization layer Feb. 17, 2009
7476605 Method of manufacturing semiconductor device Jan. 13, 2009
7473577 Integrated chip carrier with compliant interconnect Jan. 6, 2009
7425480 Semiconductor device and method of manufacture thereof Sep. 16, 2008
7413985 Method for forming a self-aligned nitrogen-containing copper silicide capping layer in a microstructure device Aug. 19, 2008
7335606 Silicide formed from ternary metal alloy films Feb. 26, 2008
7303946 Method of manufacturing a semiconductor device using an oxidation process Dec. 4, 2007
7297628 Dynamically controllable reduction of vertical contact diameter through adjustment of etch mask stack for dielectric etch Nov. 20, 2007
7217667 Processes for forming electronic devices including a semiconductor layer May. 15, 2007
7151018 Method and apparatus for transistor sidewall salicidation Dec. 19, 2006
7148158 Semiconductor device and method for manufacturing the same Dec. 12, 2006
7144808 Integration flow to prevent delamination from copper Dec. 5, 2006
7064058 Low-temperature growth high-quality ultra-thin praseodymium gate dieletrics Jun. 20, 2006
7021983 Circuit array substrate for display device and method of manufacturing the same Apr. 4, 2006
6964879 Method of fabricating a contact Nov. 15, 2005
6960541 Process for fabrication of a semiconductor component having a tungsten oxide layer Nov. 1, 2005
6933191 Two-mask process for metal-insulator-metal capacitors and single mask process for thin film resistors Aug. 23, 2005
6916737 Methods of manufacturing a semiconductor device Jul. 12, 2005
6911389 Self aligned vias in dual damascene interconnect, buried mask approach Jun. 28, 2005
6900122 Low-temperature grown high-quality ultra-thin praseodymium gate dielectrics May. 31, 2005
6893978 Method for oxidizing a metal layer May. 17, 2005
6872656 Semiconductor device and method of fabricating the same Mar. 29, 2005
6869878 Method of forming a selective barrier layer using a sacrificial layer Mar. 22, 2005
6867128 Method for making an electronic component with self-aligned drain and gate, in damascene architecture Mar. 15, 2005
6861351 Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer Mar. 1, 2005

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