 |
|
 |
| |
 |
|
Class Information
Number: 438/635
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Insulator formed by reaction with conductor (e.g., oxidation, etc.)
Description: Processes wherein an insulating layer is formed by the conversion of a conductive layer at least in part to an electrically insulative material.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7425480 |
Semiconductor device and method of manufacture thereof |
Sep. 16, 2008 |
| 7413985 |
Method for forming a self-aligned nitrogen-containing copper silicide capping layer in a microstructure device |
Aug. 19, 2008 |
| 7335606 |
Silicide formed from ternary metal alloy films |
Feb. 26, 2008 |
| 7303946 |
Method of manufacturing a semiconductor device using an oxidation process |
Dec. 4, 2007 |
| 7297628 |
Dynamically controllable reduction of vertical contact diameter through adjustment of etch mask stack for dielectric etch |
Nov. 20, 2007 |
| 7217667 |
Processes for forming electronic devices including a semiconductor layer |
May. 15, 2007 |
| 7151018 |
Method and apparatus for transistor sidewall salicidation |
Dec. 19, 2006 |
| 7148158 |
Semiconductor device and method for manufacturing the same |
Dec. 12, 2006 |
| 7144808 |
Integration flow to prevent delamination from copper |
Dec. 5, 2006 |
| 7064058 |
Low-temperature growth high-quality ultra-thin praseodymium gate dieletrics |
Jun. 20, 2006 |
| 7021983 |
Circuit array substrate for display device and method of manufacturing the same |
Apr. 4, 2006 |
| 6964879 |
Method of fabricating a contact |
Nov. 15, 2005 |
| 6960541 |
Process for fabrication of a semiconductor component having a tungsten oxide layer |
Nov. 1, 2005 |
| 6933191 |
Two-mask process for metal-insulator-metal capacitors and single mask process for thin film resistors |
Aug. 23, 2005 |
| 6916737 |
Methods of manufacturing a semiconductor device |
Jul. 12, 2005 |
| 6911389 |
Self aligned vias in dual damascene interconnect, buried mask approach |
Jun. 28, 2005 |
| 6900122 |
Low-temperature grown high-quality ultra-thin praseodymium gate dielectrics |
May. 31, 2005 |
| 6893978 |
Method for oxidizing a metal layer |
May. 17, 2005 |
| 6872656 |
Semiconductor device and method of fabricating the same |
Mar. 29, 2005 |
| 6869878 |
Method of forming a selective barrier layer using a sacrificial layer |
Mar. 22, 2005 |
| 6867128 |
Method for making an electronic component with self-aligned drain and gate, in damascene architecture |
Mar. 15, 2005 |
| 6861351 |
Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer |
Mar. 1, 2005 |
| 6852551 |
Method of forming a ferroelectric film and fabrication process of a semiconductor device having a ferroelectric film |
Feb. 8, 2005 |
| 6849537 |
Method of suppressing void formation in a metal line |
Feb. 1, 2005 |
| 6838305 |
Method of fabricating a solid-state imaging device |
Jan. 4, 2005 |
| 6828229 |
Method of manufacturing interconnection line in semiconductor device |
Dec. 7, 2004 |
| 6821882 |
Semiconductor device manufacturing method for improving adhesivity of copper metal layer to barrier layer |
Nov. 23, 2004 |
| 6815820 |
Method for forming a semiconductor interconnect with multiple thickness |
Nov. 9, 2004 |
| 6806162 |
Method for composing a dielectric layer within an interconnect structure of a multilayer semiconductor device |
Oct. 19, 2004 |
| 6790767 |
Method for formation of copper diffusion barrier film using aluminum |
Sep. 14, 2004 |
| 6780759 |
Method for multi-frequency bonding |
Aug. 24, 2004 |
| 6777333 |
Method for fabricating semiconductor device |
Aug. 17, 2004 |
| 6774029 |
Method for forming a conductive film and a conductive pattern of a semiconductor device |
Aug. 10, 2004 |
| 6764942 |
Re-oxidation process of semiconductor device |
Jul. 20, 2004 |
| 6764943 |
Methods for forming and integrated circuit structures containing enhanced-surface-area conductive layers |
Jul. 20, 2004 |
| 6756298 |
Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals |
Jun. 29, 2004 |
| 6737341 |
Semiconductor integrated circuit device and method for manufacturing the same |
May. 18, 2004 |
| 6677238 |
System and methods for fabrication of a thin film pattern |
Jan. 13, 2004 |
| 6673704 |
Semiconductor device and method of manufacturing the same |
Jan. 6, 2004 |
| 6664179 |
Semiconductor device production method and semiconductor device production apparatus |
Dec. 16, 2003 |
| 6638810 |
Tantalum nitride CVD deposition by tantalum oxide densification |
Oct. 28, 2003 |
| 6624071 |
Systems and method for fabrication of a thin film pattern |
Sep. 23, 2003 |
| 6620714 |
Method for reducing oxidation encroachment of stacked gate layer |
Sep. 16, 2003 |
| 6593229 |
Semiconductor integrated circuit device and method for manufacturing the same |
Jul. 15, 2003 |
| 6573607 |
Semiconductor device and manufacturing method thereof |
Jun. 3, 2003 |
| 6544886 |
Process for isolating an exposed conducting surface |
Apr. 8, 2003 |
| 6524957 |
Method of forming in-situ electroplated oxide passivating film for corrosion inhibition |
Feb. 25, 2003 |
| 6518177 |
Method of manufacturing a semiconductor device |
Feb. 11, 2003 |
| 6511859 |
IC-compatible parylene MEMS technology and its application in integrated sensors |
Jan. 28, 2003 |
| 6479379 |
Self-aligned etch stop for polycrystalline silicon plugs on a semiconductor device |
Nov. 12, 2002 |
|
|
|
 |
|
 |
|
| |
Randomly Featured Patents |
|
