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Class Information
Number: 438/633
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Having planarization step > Simultaneously by chemical and mechanical means
Description: Processes wherein the planarization step is conducted by the simultaneous chemical and mechanical material removal.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6984582 Method of making semiconductor device by polishing with intermediate clean polishing Jan. 10, 2006
6979646 Hardening of copper to improve copper CMP performance Dec. 27, 2005
6977218 Method for fabricating copper interconnects Dec. 20, 2005
6972217 Low k polymer E-beam printable mechanical support Dec. 6, 2005
6969301 Filling plugs through chemical mechanical polish Nov. 29, 2005
6967157 Method of forming buried wiring in semiconductor device Nov. 22, 2005
6967158 Method for forming a low-k dielectric structure on a substrate Nov. 22, 2005
6967166 Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing Nov. 22, 2005
6962869 SiOCH low k surface protection layer formation by CxHy gas plasma treatment Nov. 8, 2005
6962874 Method for fabricating semiconductor device Nov. 8, 2005
6960521 Method and apparatus for polishing metal and dielectric substrates Nov. 1, 2005
6958247 Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process Oct. 25, 2005
6949007 System and method for multi-stage process control in film removal Sep. 27, 2005
6949480 Method for depositing silicon nitride layer of semiconductor device Sep. 27, 2005
6946397 Chemical mechanical polishing process with reduced defects in a copper process Sep. 20, 2005
6946392 Filling plugs through chemical mechanical polish Sep. 20, 2005
6946388 Method for fabricating semiconductor devices Sep. 20, 2005
6946384 Stacked device underfill and a method of fabrication Sep. 20, 2005
6946383 Method for forming wiring structure which includes annealing conductive film before and after removal of a portion of the conductive film Sep. 20, 2005
6943113 Metal chemical polishing process for minimizing dishing during semiconductor wafer fabrication Sep. 13, 2005
6939796 System, method and apparatus for improved global dual-damascene planarization Sep. 6, 2005
6939793 Dual damascene integration scheme for preventing copper contamination of dielectric layer Sep. 6, 2005
6933226 Method of forming a metal gate in a semiconductor device Aug. 23, 2005
6930038 Dual damascene partial gap fill polymer fabrication process Aug. 16, 2005
6930036 Semiconductor device and method of manufacturing the same Aug. 16, 2005
6927160 Fabrication of copper-containing region such as electrical interconnect Aug. 9, 2005
6924227 Slurry for chemical mechanical polishing and method of manufacturing semiconductor device Aug. 2, 2005
6919266 Copper technology for ULSI metallization Jul. 19, 2005
6916737 Methods of manufacturing a semiconductor device Jul. 12, 2005
6911229 Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof Jun. 28, 2005
6908851 Corrosion resistance for copper interconnects Jun. 21, 2005
6908847 Method of manufacturing a semiconductor device having an interconnect embedded in an insulating film Jun. 21, 2005
6908848 Method for forming an electrical interconnection providing improved surface morphology of tungsten Jun. 21, 2005
6905957 Polishing method and polishing apparatus permitting control of polishing time at a high accuracy Jun. 14, 2005
6904675 Method of forming electrical interconnects having electromigration-inhibiting plugs Jun. 14, 2005
6903002 Low-k dielectric layer with air gaps Jun. 7, 2005
6903011 Displacement method to grow cu overburden Jun. 7, 2005
6903020 Method of forming buried wiring in semiconductor device Jun. 7, 2005
6899603 Polishing apparatus May. 31, 2005
6897134 Method for making a semiconductor device having a high-k gate dielectric May. 24, 2005
6893953 Fabrication process of a semiconductor device including a CVD process of a metal film May. 17, 2005
6881660 Method for forming wiring structure Apr. 19, 2005
6878620 Side wall passivation films for damascene cu/low k electronic devices Apr. 12, 2005
6875091 Method and apparatus for conditioning a polishing pad with sonic energy Apr. 5, 2005
6872654 Method of fabricating a bismaleimide (BMI) ASA sacrifical material for an integrated circuit air gap dielectric Mar. 29, 2005
6867125 Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material Mar. 15, 2005
6861353 Methods for planarization of metal-containing surfaces using halogens and halide salts Mar. 1, 2005
6861352 Semiconductor structure having an improved pre-metal dielectric stack and method for forming the same Mar. 1, 2005
6861348 Pre-pattern surface modification of low-k dielectrics Mar. 1, 2005
6858549 Method for forming wiring structure Feb. 22, 2005

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