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Class Information
Number: 438/633
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Having planarization step > Simultaneously by chemical and mechanical means
Description: Processes wherein the planarization step is conducted by the simultaneous chemical and mechanical material removal.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8703612 Process for forming contact plugs Apr. 22, 2014
8703605 High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability Apr. 22, 2014
8673768 Fabrication method for improving surface planarity after tungsten chemical mechanical polishing Mar. 18, 2014
8669180 Semiconductor device with self aligned end-to-end conductive line structure and method of forming the same Mar. 11, 2014
8617979 Method for manufacturing semiconductor device and semiconductor device Dec. 31, 2013
8592297 Wafer and method of processing wafer Nov. 26, 2013
8575022 Top corner rounding of damascene wire for insulator crack suppression Nov. 5, 2013
8551878 Metal interconnection method of semiconductor device Oct. 8, 2013
8551886 CMP process for processing STI on two distinct silicon planes Oct. 8, 2013
8518825 Method to manufacture trench-first copper interconnection Aug. 27, 2013
8513815 Implementing integrated circuit mixed double density and high performance wire structure Aug. 20, 2013
8491807 Abrasive liquid for metal and method for polishing Jul. 23, 2013
8481342 Method of manufacturing semiconductor device, semiconductor device and semiconductor composite device Jul. 9, 2013
8461042 Electrode contact contaminate removal Jun. 11, 2013
8420529 Copper wiring surface protective liquid and method for manufacturing semiconductor circuit Apr. 16, 2013
8367547 Method for creating a metal crystalline region, in particular in an integrated circuit Feb. 5, 2013
8357575 Technique for exposing a placeholder material in a replacement gate approach by modifying a removal rate of stressed dielectric overlayers Jan. 22, 2013
8330274 Semiconductor structure and method for making same Dec. 11, 2012
8318599 Resin layer formation method and semiconductor device fabrication method Nov. 27, 2012
8314031 Planarization process for pre-damascene structure including metal hard mask Nov. 20, 2012
8299614 Interconnection structure, a thin film transistor substrate, and a manufacturing method thereof, as well as a display device Oct. 30, 2012
8293638 Method of fabricating damascene structures Oct. 23, 2012
8247281 Technique for exposing a placeholder material in a replacement gate approach by modifying a removal rate of stressed dielectric overlayers Aug. 21, 2012
8247327 Methods and compositions for polishing silicon-containing substrates Aug. 21, 2012
8207060 High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability Jun. 26, 2012
8187966 Manufacturing method for semiconductor integrated circuit device May. 29, 2012
8178439 Surface cleaning and selective deposition of metal-containing cap layers for semiconductor devices May. 15, 2012
8158520 Method of forming a via structure dual damascene structure for the manufacture of semiconductor integrated circuit devices Apr. 17, 2012
8137791 Fuse and pad stress relief Mar. 20, 2012
8137995 Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures Mar. 20, 2012
8124526 Methods of forming a thin ferroelectric layer and methods of manufacturing a semiconductor device including the same Feb. 28, 2012
8119522 Method of fabricating damascene structures Feb. 21, 2012
8084350 Method for manufacturing semiconductor device Dec. 27, 2011
8053357 Prevention of post CMP defects in CU/FSG process Nov. 8, 2011
8048803 Method for forming contact plug in a semiconductor device Nov. 1, 2011
8043967 Process for through silicon via filling Oct. 25, 2011
8038898 Abrasive liquid for metal and method for polishing Oct. 18, 2011
8026164 Semiconductor device and method of manufacturing the same Sep. 27, 2011
8013373 Semiconductor device having MOS-transistor formed on semiconductor substrate and method for manufacturing thereof Sep. 6, 2011
8008187 Method for reducing dielectric overetch using a dielectric etch stop at a planar surface Aug. 30, 2011
8003516 BEOL interconnect structures and related fabrication methods Aug. 23, 2011
7994068 Method for fabricating a 3-D integrated circuit using a hard mask of silicon-oxynitride on amorphous carbon Aug. 9, 2011
7989334 Method of manufacturing semiconductor device Aug. 2, 2011
7981801 Chemical mechanical polishing (CMP) method for gate last process Jul. 19, 2011
7968447 Semiconductor device and methods of manufacturing the same Jun. 28, 2011
7951706 Method of manufacturing metal interconnection May. 31, 2011
7951714 High aspect ratio electroplated metal feature and method May. 31, 2011
7947596 Semiconductor device and method of manufacturing the same May. 24, 2011
7936051 Silicon wafer and its manufacturing method May. 3, 2011
7901954 Method for detecting a void Mar. 8, 2011

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