| |
 |
|
Class Information
Number: 438/633
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Having planarization step > Simultaneously by chemical and mechanical means
Description: Processes wherein the planarization step is conducted by the simultaneous chemical and mechanical material removal.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7608536 |
Method of manufacturing contact opening |
Oct. 27, 2009 |
| 7605074 |
Chemical mechanical polishing and method for manufacturing semiconductor device using the same |
Oct. 20, 2009 |
| 7595263 |
Atomic layer deposition of barrier materials |
Sep. 29, 2009 |
| 7592258 |
Metallization layer of a semiconductor device having differently thick metal lines and a method of forming the same |
Sep. 22, 2009 |
| 7589014 |
Semiconductor device having multiple wiring layers and method of producing the same |
Sep. 15, 2009 |
| 7582558 |
Reducing corrosion in copper damascene processes |
Sep. 1, 2009 |
| 7582564 |
Process and composition for conductive material removal by electrochemical mechanical polishing |
Sep. 1, 2009 |
| 7575997 |
Method for forming contact hole of semiconductor device |
Aug. 18, 2009 |
| 7575981 |
Method for fabricating isolation layer in semiconductor device |
Aug. 18, 2009 |
| 7566643 |
Liquid phase deposition of contacts in programmable resistance and switching devices |
Jul. 28, 2009 |
| 7566652 |
Electrically inactive via for electromigration reliability improvement |
Jul. 28, 2009 |
| 7560378 |
Method for manufacturing semiconductor device |
Jul. 14, 2009 |
| 7557035 |
Method of forming semiconductor devices by microwave curing of low-k dielectric films |
Jul. 7, 2009 |
| RE40790 |
Method for making electrical contact with an active area through sub-micron contact openings and a semiconductor device |
Jun. 23, 2009 |
| 7550378 |
Method of manufacturing a semiconductor device having a cell area with a high device element density |
Jun. 23, 2009 |
| 7544606 |
Method to implement stress free polishing |
Jun. 9, 2009 |
| 7541225 |
Method of manufacturing a thin film transistor array panel that includes using chemical mechanical polishing of a conductive film to form a pixel electrode connected to a drain electrode |
Jun. 2, 2009 |
| 7541279 |
Method for manufacturing semiconductor device |
Jun. 2, 2009 |
| 7538037 |
Method for manufacturing semiconductor device |
May. 26, 2009 |
| 7534719 |
Method for reduction in metal dishing after CMP |
May. 19, 2009 |
| 7531447 |
Process for forming integrated circuit comprising copper lines |
May. 12, 2009 |
| 7528059 |
Method for reducing polish-induced damage in a contact structure by forming a capping layer |
May. 5, 2009 |
| 7524752 |
Method of manufacturing semiconductor device |
Apr. 28, 2009 |
| 7521348 |
Method of fabricating semiconductor device having fine contact holes |
Apr. 21, 2009 |
| 7510972 |
Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device |
Mar. 31, 2009 |
| 7507657 |
Method for fabricating storage node contact in semiconductor device |
Mar. 24, 2009 |
| 7504287 |
Methods for fabricating an integrated circuit |
Mar. 17, 2009 |
| 7494921 |
Aluminum metal line of a semiconductor device and method of fabricating the same |
Feb. 24, 2009 |
| 7479433 |
Method for manufacturing semiconductor device |
Jan. 20, 2009 |
| 7470612 |
Method of forming metal wiring layer of semiconductor device |
Dec. 30, 2008 |
| 7470630 |
Approach to reduce parasitic capacitance from dummy fill |
Dec. 30, 2008 |
| 7465652 |
Method of forming a catalyst layer on the barrier layer of a conductive interconnect of a semiconductor device |
Dec. 16, 2008 |
| 7465977 |
Method for producing a packaged integrated circuit |
Dec. 16, 2008 |
| 7453152 |
Device having reduced chemical mechanical planarization |
Nov. 18, 2008 |
| 7435673 |
Methods of forming integrated circuit devices having metal interconnect structures therein |
Oct. 14, 2008 |
| 7432191 |
Method of forming a dual damascene structure utilizing a developable anti-reflective coating |
Oct. 7, 2008 |
| 7413989 |
Method of manufacturing semiconductor device |
Aug. 19, 2008 |
| 7399671 |
Disposable pillars for contact formation |
Jul. 15, 2008 |
| 7399697 |
Very low dielectric constant plasma-enhanced CVD films |
Jul. 15, 2008 |
| 7381638 |
Fabrication technique using sputter etch and vacuum transfer |
Jun. 3, 2008 |
| 7375023 |
Method and apparatus for chemical mechanical polishing of semiconductor substrates |
May. 20, 2008 |
| 7371679 |
Semiconductor device with a metal line and method of forming the same |
May. 13, 2008 |
| 7371665 |
Method for fabricating shallow trench isolation layer of semiconductor device |
May. 13, 2008 |
| 7368383 |
Hillock reduction in copper films |
May. 6, 2008 |
| 7364997 |
Methods of forming integrated circuitry and methods of forming local interconnects |
Apr. 29, 2008 |
| 7348272 |
Method of fabricating interconnect |
Mar. 25, 2008 |
| 7338907 |
Selective etching processes of silicon nitride and indium oxide thin films for FeRAM device applications |
Mar. 4, 2008 |
| 7327034 |
Compositions for planarization of metal-containing surfaces using halogens and halide salts |
Feb. 5, 2008 |
| 7323407 |
Method of fabricating dual damascene interconnections of microelectronic device using diffusion barrier layer against base material |
Jan. 29, 2008 |
| 7316980 |
Method for forming ferrocapacitors and FeRAM devices |
Jan. 8, 2008 |
|
|
|
