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Class Information
Number: 438/631
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Having planarization step
Description: Processes wherein at least one of the metallization levels or at least one separating insulating layer is leveled into a single plane at any stage in the process.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7625816 |
Method of fabricating passivation |
Dec. 1, 2009 |
| 7611985 |
Formation of holes in substrates using dewetting coatings |
Nov. 3, 2009 |
| 7582556 |
Circuitry component and method for forming the same |
Sep. 1, 2009 |
| 7579271 |
Method for forming low dielectric constant fluorine-doped layers |
Aug. 25, 2009 |
| 7575997 |
Method for forming contact hole of semiconductor device |
Aug. 18, 2009 |
| 7575995 |
Method of forming fine metal pattern and method of forming metal line using the same |
Aug. 18, 2009 |
| 7560375 |
Gas dielectric structure forming methods |
Jul. 14, 2009 |
| 7550310 |
Techniques and systems for analyte detection |
Jun. 23, 2009 |
| 7544606 |
Method to implement stress free polishing |
Jun. 9, 2009 |
| 7534719 |
Method for reduction in metal dishing after CMP |
May. 19, 2009 |
| 7528066 |
Structure and method for metal integration |
May. 5, 2009 |
| 7528064 |
Interconnect structures with bond-pads and methods of forming bump sites on bond-pads |
May. 5, 2009 |
| 7524697 |
Method for manufactuing a semiconductor integrated circuit device |
Apr. 28, 2009 |
| 7524757 |
Method for manufacturing multi-level transistor comprising forming selective epitaxial growth layer |
Apr. 28, 2009 |
| 7510972 |
Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device |
Mar. 31, 2009 |
| 7510959 |
Method of manufacturing a semiconductor device having damascene structures with air gaps |
Mar. 31, 2009 |
| 7507647 |
Method of manufacturing a high voltage semiconductor device including a deep well and a gate oxide layer simultaneously |
Mar. 24, 2009 |
| 7504287 |
Methods for fabricating an integrated circuit |
Mar. 17, 2009 |
| 7488637 |
CMOS image sensor and method for forming the same |
Feb. 10, 2009 |
| 7476612 |
Method for manufacturing semiconductor device |
Jan. 13, 2009 |
| 7470619 |
Interconnect with high aspect ratio plugged vias |
Dec. 30, 2008 |
| 7446033 |
Method of forming a metal interconnection of a semiconductor device, and metal interconnection formed by such method |
Nov. 4, 2008 |
| 7425501 |
Semiconductor structure implementing sacrificial material and methods for making and implementing the same |
Sep. 16, 2008 |
| 7416985 |
Semiconductor device having a multilayer interconnection structure and fabrication method thereof |
Aug. 26, 2008 |
| 7407879 |
Chemical planarization performance for copper/low-k interconnect structures |
Aug. 5, 2008 |
| 7405152 |
Reducing wire erosion during damascene processing |
Jul. 29, 2008 |
| 7405154 |
Structure and method of forming electrodeposited contacts |
Jul. 29, 2008 |
| 7399699 |
On-die reflectance arrangements |
Jul. 15, 2008 |
| 7399696 |
Method for high performance inductor fabrication using a triple damascene process with copper BEOL |
Jul. 15, 2008 |
| 7399671 |
Disposable pillars for contact formation |
Jul. 15, 2008 |
| 7399649 |
Semiconductor light-emitting device and fabrication method thereof |
Jul. 15, 2008 |
| 7396768 |
Copper damascene chemical mechanical polishing (CMP) for thin film head writer fabrication |
Jul. 8, 2008 |
| 7387963 |
Semiconductor wafer and process for producing a semiconductor wafer |
Jun. 17, 2008 |
| 7384865 |
Semiconductor device with a metal line and method of forming the same |
Jun. 10, 2008 |
| 7382054 |
Method for forming self-aligned contacts and local interconnects simultaneously |
Jun. 3, 2008 |
| 7381638 |
Fabrication technique using sputter etch and vacuum transfer |
Jun. 3, 2008 |
| 7375023 |
Method and apparatus for chemical mechanical polishing of semiconductor substrates |
May. 20, 2008 |
| 7348272 |
Method of fabricating interconnect |
Mar. 25, 2008 |
| 7338907 |
Selective etching processes of silicon nitride and indium oxide thin films for FeRAM device applications |
Mar. 4, 2008 |
| 7316971 |
Wire bond pads |
Jan. 8, 2008 |
| 7317253 |
Cobalt tungsten phosphate used to fill voids arising in a copper metallization process |
Jan. 8, 2008 |
| 7273775 |
Reliable and scalable virtual ground memory array formed with reduced thermal cycle |
Sep. 25, 2007 |
| 7255772 |
High pressure processing chamber for semiconductor substrate |
Aug. 14, 2007 |
| 7247256 |
CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP method |
Jul. 24, 2007 |
| 7241668 |
Planar magnetic tunnel junction substrate having recessed alignment marks |
Jul. 10, 2007 |
| 7238606 |
Semiconductor devices and method for fabricating the same |
Jul. 3, 2007 |
| 7235477 |
Multi-layer interconnection circuit module and manufacturing method thereof |
Jun. 26, 2007 |
| 7226856 |
Nano-electrode-array for integrated circuit interconnects |
Jun. 5, 2007 |
| 7223685 |
Damascene fabrication with electrochemical layer removal |
May. 29, 2007 |
| 7217649 |
System and method for stress free conductor removal |
May. 15, 2007 |
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