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Class Information
Number: 438/630
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > At least one metallization level formed of diverse conductive layers > Diverse conductive layers limited to viahole/plug > Silicide formation
Description: Processes wherein at least one of the diverse conductive layers is a compound of silicon and a metal.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8673724 Methods of fabricating semiconductor devices Mar. 18, 2014
8658485 Semiconductor device and method of fabricating the same Feb. 25, 2014
8658530 Method of fabricating an epitaxial Ni silicide film Feb. 25, 2014
8642435 Performing treatment on stressors Feb. 4, 2014
8610233 Hybrid MOSFET structure having drain side schottky junction Dec. 17, 2013
8603881 Raised trench metal semiconductor alloy formation Dec. 10, 2013
8569170 Manufacturing method of semiconductor device comprising silicide layer with varied thickness Oct. 29, 2013
8563424 Process for forming cobalt and cobalt silicide materials in tungsten contact applications Oct. 22, 2013
8551874 MOSFET gate and source/drain contact metallization Oct. 8, 2013
8536010 Method for making a disilicide Sep. 17, 2013
8492275 Method to form uniform silicide by selective implantation Jul. 23, 2013
8481378 Effecting selectivity of silicon or silicon-germanium deposition on a silicon or silicon-germanium substrate by doping Jul. 9, 2013
8470707 Silicide method Jun. 25, 2013
8440564 Schemes for forming barrier layers for copper in interconnect structures May. 14, 2013
8378496 Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection Feb. 19, 2013
8368219 Buried silicide local interconnect with sidewall spacers and method for making the same Feb. 5, 2013
8367549 Method of manufacturing semiconductor device Feb. 5, 2013
8344461 Solid-state imaging device and manufacturing method for the same Jan. 1, 2013
8343867 Method for main spacer trim-back Jan. 1, 2013
8330275 Interconnect structure for semiconductor devices Dec. 11, 2012
8329582 Semiconductor device and method of manufacturing the same Dec. 11, 2012
8314454 Local interconnect having increased misalignment tolerance Nov. 20, 2012
8314025 Method of forming semiconductor device having contact plug Nov. 20, 2012
8304319 Method for making a disilicide Nov. 6, 2012
8298934 Structure and method of creating entirely self-aligned metallic contacts Oct. 30, 2012
8283249 Local interconnect having increased misalignment tolerance Oct. 9, 2012
8278199 Method of manufacturing a semiconductor device Oct. 2, 2012
8232201 Schemes for forming barrier layers for copper in interconnect structures Jul. 31, 2012
8202799 Methods of manufacturing metal-silicide features Jun. 19, 2012
8193086 Local silicidation of via bottoms in metallization systems of semiconductor devices Jun. 5, 2012
8187970 Process for forming cobalt and cobalt silicide materials in tungsten contact applications May. 29, 2012
8178438 Manufacturing method of semiconductor device and electronic device May. 15, 2012
8173540 Methods of forming silicide regions and resulting MOS devices May. 8, 2012
8168538 Buried silicide structure and method for making May. 1, 2012
8158473 Method for manufacturing a semiconductor device having a silicide region comprised of a silicide of a nickel alloy Apr. 17, 2012
8153487 Semiconductor device and method for manufacturing the same Apr. 10, 2012
8148262 Method for manufacturing semiconductor device Apr. 3, 2012
8105946 Method of forming conductive lines of semiconductor memory device Jan. 31, 2012
8084351 Contact structure of a semiconductor device Dec. 27, 2011
8080452 Effecting selectivity of silicon or silicon-germanium deposition on a silicon or silicon-germanium substrate by doping Dec. 20, 2011
8053356 Interconnect structure for semiconductor devices Nov. 8, 2011
8039388 Main spacer trim-back method for replacement gate process Oct. 18, 2011
8039378 Method of manufacturing a semiconductor device Oct. 18, 2011
8030210 Contact barrier structure and manufacturing methods Oct. 4, 2011
8003520 Air gap structure having protective metal silicide pads on a metal feature Aug. 23, 2011
7998858 Vertical interconnect structure, memory device and associated production method Aug. 16, 2011
7989340 Methods of forming CoSi.sub.2, methods of forming field effect transistors, and methods of forming conductive contacts Aug. 2, 2011
7977236 Method of forming a transistor gate of a recessed access device, method of forming a recessed transistor gate and a non-recessed transistor gate, and method of fabricating an integrated circui Jul. 12, 2011
7964496 Schemes for forming barrier layers for copper in interconnect structures Jun. 21, 2011
7897499 Method for fabricating a semiconductor device with self-aligned contact Mar. 1, 2011

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