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Class Information
Number: 438/629
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > At least one metallization level formed of diverse conductive layers > Diverse conductive layers limited to viahole/plug
Description: Processes wherein the diverse conductive layers of a metallization level are limited in lateral extent to the viahole or plug extending through an insulating layer.










Sub-classes under this class:

Class Number Class Name Patents
438/630 Silicide formation 321


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Patent Number Title Of Patent Date Issued
8709939 Semiconductor device having a multilevel interconnect structure and method for fabricating the same Apr. 29, 2014
8709940 Structure of circuit board and method for fabricating the same Apr. 29, 2014
8709941 Method for forming contact in an integrated circuit Apr. 29, 2014
8710672 Semiconductor device and method of manufacturing the same Apr. 29, 2014
8703602 Selective seed layer treatment for feature plating Apr. 22, 2014
8691686 Method of manufacturing semiconductor device, semiconductor device, and electronic apparatus Apr. 8, 2014
8691692 Semiconductor chips and methods of forming the same Apr. 8, 2014
8691691 TSV pillar as an interconnecting structure Apr. 8, 2014
8691689 Methods for fabricating integrated circuits having low resistance device contacts Apr. 8, 2014
8691664 Backside process for a substrate Apr. 8, 2014
8692381 Integrated circuits with a resistance to single event upset occurrence and methods for providing the same Apr. 8, 2014
8686385 Phase-change random access memory device and method of manufacturing the same Apr. 1, 2014
8679966 Semiconductor device having Au-Cu electrodes, and method of manufacturing semiconductor device Mar. 25, 2014
8674508 Seal ring structures with reduced moisture-induced reliability degradation Mar. 18, 2014
8673779 Interconnect with self-formed barrier Mar. 18, 2014
8673772 Biosensor chip and a method of manufacturing the same Mar. 18, 2014
8673767 Manufacturing method for semiconductor device Mar. 18, 2014
8669176 BEOL integration scheme for copper CMP to prevent dendrite formation Mar. 11, 2014
8669177 Semiconductor device and method for manufacturing semiconductor device Mar. 11, 2014
8664767 Conductive routings in integrated circuits using under bump metallization Mar. 4, 2014
8658476 Low temperature P+ polycrystalline silicon material for non-volatile memory device Feb. 25, 2014
8658473 Ultrathin buried die module and method of manufacturing thereof Feb. 25, 2014
8642467 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method Feb. 4, 2014
8643178 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same Feb. 4, 2014
8629057 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods Jan. 14, 2014
8629060 Methods of forming through substrate interconnects Jan. 14, 2014
8623759 Method for manufacturing semiconductor device Jan. 7, 2014
8618667 Semiconductor device and method of manufacturing the same Dec. 31, 2013
8617982 Subtractive patterning to define circuit components Dec. 31, 2013
8609532 Magnetically sintered conductive via Dec. 17, 2013
8603918 Semiconductor devices and methods of manufacture thereof Dec. 10, 2013
8586471 Seed layers for metallic interconnects and products Nov. 19, 2013
8581411 Semiconductor device Nov. 12, 2013
8580676 Multiple layer barrier metal for device component formed in contact trench Nov. 12, 2013
8580677 Method of manufacturing substrate including thin film transistor Nov. 12, 2013
8575758 Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies Nov. 5, 2013
8575759 Semiconductor device and electronic apparatus including the same Nov. 5, 2013
8569888 Wiring structure and method of forming the structure Oct. 29, 2013
8563432 Method for forming through silicon via structure Oct. 22, 2013
8558390 Semiconductor device Oct. 15, 2013
8551874 MOSFET gate and source/drain contact metallization Oct. 8, 2013
8541307 Treatment method for reducing particles in dual damascene silicon nitride process Sep. 24, 2013
8519482 Reliable contacts Aug. 27, 2013
8519538 Laser etch via formation Aug. 27, 2013
8513115 Method of forming an interconnect structure having an enlarged region Aug. 20, 2013
8513113 Methods of forming semiconductor constructions and assemblies Aug. 20, 2013
8501618 Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis Aug. 6, 2013
8492808 Semiconductor device and manufacturing method thereof Jul. 23, 2013
8491984 Structure resulting from chemical shrink process over BARC (bottom anti-reflective coating) Jul. 23, 2013
8492269 Hybrid contact structure with low aspect ratio contacts in a semiconductor device Jul. 23, 2013

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