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Class Information
Number: 438/628
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > At least one metallization level formed of diverse conductive layers > Having adhesion promoting layer
Description: Processes wherein a material (e.g., layer, etc.) is utilized to promote adhesion of the electrical contact or lead to an adjacent surface.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8709939 Semiconductor device having a multilevel interconnect structure and method for fabricating the same Apr. 29, 2014
8691689 Methods for fabricating integrated circuits having low resistance device contacts Apr. 8, 2014
8669181 Diffusion barrier and etch stop films Mar. 11, 2014
8669182 Metal cap with ultra-low .kappa. dielectric material for circuit interconnect applications Mar. 11, 2014
8642391 Self-assembly of chips on a substrate Feb. 4, 2014
8629056 Method for forming self-assembled mono-layer liner for cu/porous low-k interconnections Jan. 14, 2014
8623226 Making stacked pancake motors using patterned adhesives Jan. 7, 2014
8609528 High-density patterning Dec. 17, 2013
8586471 Seed layers for metallic interconnects and products Nov. 19, 2013
8569105 Passivating glue layer to improve amorphous carbon to metal adhesion Oct. 29, 2013
8569165 Self-aligned barrier and capping layers for interconnects Oct. 29, 2013
8563423 Fluorine depleted adhesion layer for metal interconnect structure Oct. 22, 2013
8536058 Method of growing electrical conductors Sep. 17, 2013
8445378 Method of manufacturing a CMOS device including molecular storage elements in a via level May. 21, 2013
8440561 Three-dimensional semiconductor device comprising an inter-die connection on the basis of functional molecules May. 14, 2013
8421200 Semiconductor integrated circuit device and method for fabricating the same Apr. 16, 2013
8349725 Method of manufacturing semiconductor device, semiconductor manufacturing apparatus, and storage medium Jan. 8, 2013
8304341 Dicing die-bonding film Nov. 6, 2012
8298933 Conformal films on semiconductor substrates Oct. 30, 2012
8278205 Semiconductor device and method for manufacturing the same Oct. 2, 2012
8278139 Passivating glue layer to improve amorphous carbon to metal adhesion Oct. 2, 2012
8263488 Surface-coating method Sep. 11, 2012
8216933 Krypton sputtering of low resistivity tungsten Jul. 10, 2012
8163602 Ultraviolet energy curable tape and method of making a semiconductor chip using the tape Apr. 24, 2012
8119524 Method of manufacturing semiconductor device Feb. 21, 2012
8110502 Method of improving adhesion strength of low dielectric constant layers Feb. 7, 2012
8080472 Metal line having a Mo.sub.xSi.sub.y/Mo diffusion barrier of semiconductor device and method for forming the same Dec. 20, 2011
8076778 Method for preventing Al-Cu bottom damage using TiN liner Dec. 13, 2011
8030204 Semiconductor device and method of manufacturing the same Oct. 4, 2011
8021976 Method of wire bonding over active area of a semiconductor circuit Sep. 20, 2011
7981781 Metal line of semiconductor device having a diffusion barrier and method for forming the same Jul. 19, 2011
7955979 Method of growing electrical conductors Jun. 7, 2011
7951705 Multilayered cap barrier in microelectronic interconnect structures May. 31, 2011
7943509 Method of making an interconnect structure May. 17, 2011
7915160 Methods for forming small contacts Mar. 29, 2011
7915166 Diffusion barrier and etch stop films Mar. 29, 2011
7910476 Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop Mar. 22, 2011
7906430 Method of manufacturing a semiconductor device with a peeling prevention layer Mar. 15, 2011
7863194 Implantation of multiple species to address copper reliability Jan. 4, 2011
7863182 Dicing die-bonding film Jan. 4, 2011
7863173 Variable resistance non-volatile memory cells and methods of fabricating same Jan. 4, 2011
7858525 Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill Dec. 28, 2010
7846833 Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device Dec. 7, 2010
7842609 Method for manufacturing semiconductor device Nov. 30, 2010
7842605 Atomic layer profiling of diffusion barrier and metal seed layers Nov. 30, 2010
7838414 Method for manufacturing semiconductor device utilizing low dielectric layer filling gaps between metal lines Nov. 23, 2010
7829456 Method to modulate coverage of barrier and seed layer using titanium nitride Nov. 9, 2010
7745335 Semiconductor device manufactured by reducing hillock formation in metal interconnects Jun. 29, 2010
7745325 Wiring structure of a semiconductor device, method of forming the wiring structure, non-volatile memory device including the wiring structure, and method of manufacturing the non-volatile memo Jun. 29, 2010
7745324 Interconnect with recessed dielectric adjacent a noble metal cap Jun. 29, 2010

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