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Class Information
Number: 438/627
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > At least one metallization level formed of diverse conductive layers > At least one layer forms a diffusion barrier
Description: Processes wherein at least one of the diverse conductive layers forms a barrier to the migration of a contact material into the semiconductor or into another contact layer.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710567 Semiconductor device and manufacturing method thereof Apr. 29, 2014
8709939 Semiconductor device having a multilevel interconnect structure and method for fabricating the same Apr. 29, 2014
8704373 Semiconductor device and a method of manufacturing the same Apr. 22, 2014
8685851 MOS device with memory function and manufacturing method thereof Apr. 1, 2014
8680682 Barrier for through-silicon via Mar. 25, 2014
8679971 Metal-contamination-free through-substrate via structure Mar. 25, 2014
8673779 Interconnect with self-formed barrier Mar. 18, 2014
8673772 Biosensor chip and a method of manufacturing the same Mar. 18, 2014
8673766 Methods of forming copper-based conductive structures by forming a copper-based seed layer having an as-deposited thickness profile and thereafter performing an etching process and electroless Mar. 18, 2014
8669181 Diffusion barrier and etch stop films Mar. 11, 2014
8664767 Conductive routings in integrated circuits using under bump metallization Mar. 4, 2014
8664110 Method for forming semiconductor device Mar. 4, 2014
8661664 Techniques for forming narrow copper filled vias having improved conductivity Mar. 4, 2014
8648465 Semiconductor interconnect structure having enhanced performance and reliability Feb. 11, 2014
8647978 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Feb. 11, 2014
8642467 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method Feb. 4, 2014
8637396 Dielectric barrier deposition using oxygen containing precursor Jan. 28, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8623758 Subtractive metal multi-layer barrier layer for interconnect structure Jan. 7, 2014
8623757 Producing a vertical transistor including reentrant profile Jan. 7, 2014
8618661 Die having coefficient of thermal expansion graded layer Dec. 31, 2013
8617982 Subtractive patterning to define circuit components Dec. 31, 2013
8610278 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Dec. 17, 2013
8609528 High-density patterning Dec. 17, 2013
8603913 Porous dielectrics K value restoration by thermal treatment and or solvent treatment Dec. 10, 2013
8592979 Semiconductor device conductive pattern structures and methods of manufacturing the same Nov. 26, 2013
8586471 Seed layers for metallic interconnects and products Nov. 19, 2013
8580687 Semiconductor structure and method for making same Nov. 12, 2013
8580676 Multiple layer barrier metal for device component formed in contact trench Nov. 12, 2013
8569888 Wiring structure and method of forming the structure Oct. 29, 2013
8563419 Method of manufacturing an interconnect structure and design structure thereof Oct. 22, 2013
8552565 Chip package and method for forming the same Oct. 8, 2013
8546944 Multilayer dielectric memory device Oct. 1, 2013
8541302 Electronic device including a trench with a facet and a conductive structure therein and a process of forming the same Sep. 24, 2013
8536707 Semiconductor structure comprising moisture barrier and conductive redistribution layer Sep. 17, 2013
8525021 Photovoltaic devices including heterojunctions Sep. 3, 2013
8524597 Methods for forming planarized hermetic barrier layers and structures formed thereby Sep. 3, 2013
8524512 Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method Sep. 3, 2013
8518819 Semiconductor device contact structures and methods for making the same Aug. 27, 2013
8518818 Reverse damascene process Aug. 27, 2013
8518762 Semiconductor device and manufacturing method thereof Aug. 27, 2013
8502381 Barrier layer configurations and methods for processing microelectronic topographies having barrier layers Aug. 6, 2013
8492808 Semiconductor device and manufacturing method thereof Jul. 23, 2013
8492271 Semiconductor device and method of manufacturing the same Jul. 23, 2013
8492269 Hybrid contact structure with low aspect ratio contacts in a semiconductor device Jul. 23, 2013
8486773 Semiconductor device and manufacturing method thereof Jul. 16, 2013
8466556 Semiconductor device and method of manufacturing the same Jun. 18, 2013
8461684 Cobalt nitride layers for copper interconnects and methods for forming them Jun. 11, 2013
8461683 Self-forming, self-aligned barriers for back-end interconnects and methods of making same Jun. 11, 2013
8461043 Barrier layer for integrated circuit contacts Jun. 11, 2013











 
 
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