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Class Information
Number: 438/626
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > At least one metallization level formed of diverse conductive layers > Planarization
Description: Processes wherein at least one of the metallization levels or at least one separating insulating layer is leveled into a single plane at any stage in the process.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7718522 Method and apparatus for plating a semiconductor package May. 18, 2010
7718545 Fabrication process May. 18, 2010
7704856 Semiconductor device, wiring substrate forming method, and substrate processing apparatus Apr. 27, 2010
7704872 Ultraviolet assisted pore sealing of porous low k dielectric films Apr. 27, 2010
7700477 Method for fabricating semiconductor device Apr. 20, 2010
7696085 Dual damascene metal interconnect structure having a self-aligned via Apr. 13, 2010
7678684 Semiconductor integrated circuit device Mar. 16, 2010
7670915 Contact liner in integrated circuit technology Mar. 2, 2010
7663240 Semiconductor device with multiple interconnect layers and vias Feb. 16, 2010
7662711 Method of forming dual damascene pattern Feb. 16, 2010
7662672 Manufacturing process of leadframe-based BGA packages Feb. 16, 2010
7655539 Dice by grind for back surface metallized dies Feb. 2, 2010
7655556 Interconnect structures for semiconductor devices Feb. 2, 2010
7648898 Method to fabricate gate electrodes Jan. 19, 2010
7638434 Method for filling a trench in a semiconductor product Dec. 29, 2009
7638430 Method of forming contact plug of semiconductor device Dec. 29, 2009
7635644 Semiconductor device including metal interconnection and method for forming metal interconnection Dec. 22, 2009
7625816 Method of fabricating passivation Dec. 1, 2009
7601641 Two step optical planarizing layer etch Oct. 13, 2009
7585770 Method of growing carbon nanotubes and method of manufacturing field emission device having the same Sep. 8, 2009
7585761 Manufacturing method of semiconductor device Sep. 8, 2009
7585760 Method for forming planarizing copper in a low-k dielectric Sep. 8, 2009
7582556 Circuitry component and method for forming the same Sep. 1, 2009
7579270 Method for manufacturing a semiconductor device Aug. 25, 2009
7572710 Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects Aug. 11, 2009
7566971 Semiconductor device and manufacturing method thereof Jul. 28, 2009
7566652 Electrically inactive via for electromigration reliability improvement Jul. 28, 2009
7560378 Method for manufacturing semiconductor device Jul. 14, 2009
7557030 Method for fabricating a recess gate in a semiconductor device Jul. 7, 2009
7557031 Etch back with aluminum CMP for LCOS devices Jul. 7, 2009
7554199 Substrate for evaluation Jun. 30, 2009
7531448 Manufacturing method of dual damascene structure May. 12, 2009
7527188 Self-encapsulated silver alloys for interconnects May. 5, 2009
7528064 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads May. 5, 2009
7514779 Multilayer build-up wiring board Apr. 7, 2009
7510972 Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device Mar. 31, 2009
7504699 Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections Mar. 17, 2009
7498252 Dual layer dielectric stack for microelectronics having thick metal lines Mar. 3, 2009
7485566 Method of manufacturing semiconductor device Feb. 3, 2009
7485571 Method of making an integrated circuit Feb. 3, 2009
7485962 Semiconductor device, wiring substrate forming method, and substrate processing apparatus Feb. 3, 2009
7479433 Method for manufacturing semiconductor device Jan. 20, 2009
7476605 Method of manufacturing semiconductor device Jan. 13, 2009
7475368 Deflection analysis system and method for circuit design Jan. 6, 2009
7473636 Method to improve time dependent dielectric breakdown Jan. 6, 2009
7468317 Method of forming metal line of semiconductor device Dec. 23, 2008
7468320 Reduced electromigration and stressed induced migration of copper wires by surface coating Dec. 23, 2008
7465977 Method for producing a packaged integrated circuit Dec. 16, 2008
7452802 Method of forming metal wiring for high voltage element Nov. 18, 2008
7446033 Method of forming a metal interconnection of a semiconductor device, and metal interconnection formed by such method Nov. 4, 2008

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