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Class Information
Number: 438/626
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > At least one metallization level formed of diverse conductive layers > Planarization
Description: Processes wherein at least one of the metallization levels or at least one separating insulating layer is leveled into a single plane at any stage in the process.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7601641 |
Two step optical planarizing layer etch |
Oct. 13, 2009 |
| 7585760 |
Method for forming planarizing copper in a low-k dielectric |
Sep. 8, 2009 |
| 7585761 |
Manufacturing method of semiconductor device |
Sep. 8, 2009 |
| 7585770 |
Method of growing carbon nanotubes and method of manufacturing field emission device having the same |
Sep. 8, 2009 |
| 7582556 |
Circuitry component and method for forming the same |
Sep. 1, 2009 |
| 7579270 |
Method for manufacturing a semiconductor device |
Aug. 25, 2009 |
| 7572710 |
Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects |
Aug. 11, 2009 |
| 7566652 |
Electrically inactive via for electromigration reliability improvement |
Jul. 28, 2009 |
| 7566971 |
Semiconductor device and manufacturing method thereof |
Jul. 28, 2009 |
| 7560378 |
Method for manufacturing semiconductor device |
Jul. 14, 2009 |
| 7557030 |
Method for fabricating a recess gate in a semiconductor device |
Jul. 7, 2009 |
| 7557031 |
Etch back with aluminum CMP for LCOS devices |
Jul. 7, 2009 |
| 7554199 |
Substrate for evaluation |
Jun. 30, 2009 |
| 7531448 |
Manufacturing method of dual damascene structure |
May. 12, 2009 |
| 7527188 |
Self-encapsulated silver alloys for interconnects |
May. 5, 2009 |
| 7528064 |
Interconnect structures with bond-pads and methods of forming bump sites on bond-pads |
May. 5, 2009 |
| 7514779 |
Multilayer build-up wiring board |
Apr. 7, 2009 |
| 7510972 |
Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device |
Mar. 31, 2009 |
| 7504699 |
Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections |
Mar. 17, 2009 |
| 7498252 |
Dual layer dielectric stack for microelectronics having thick metal lines |
Mar. 3, 2009 |
| 7485962 |
Semiconductor device, wiring substrate forming method, and substrate processing apparatus |
Feb. 3, 2009 |
| 7485571 |
Method of making an integrated circuit |
Feb. 3, 2009 |
| 7485566 |
Method of manufacturing semiconductor device |
Feb. 3, 2009 |
| 7479433 |
Method for manufacturing semiconductor device |
Jan. 20, 2009 |
| 7476605 |
Method of manufacturing semiconductor device |
Jan. 13, 2009 |
| 7475368 |
Deflection analysis system and method for circuit design |
Jan. 6, 2009 |
| 7473636 |
Method to improve time dependent dielectric breakdown |
Jan. 6, 2009 |
| 7468317 |
Method of forming metal line of semiconductor device |
Dec. 23, 2008 |
| 7468320 |
Reduced electromigration and stressed induced migration of copper wires by surface coating |
Dec. 23, 2008 |
| 7465977 |
Method for producing a packaged integrated circuit |
Dec. 16, 2008 |
| 7452802 |
Method of forming metal wiring for high voltage element |
Nov. 18, 2008 |
| 7446033 |
Method of forming a metal interconnection of a semiconductor device, and metal interconnection formed by such method |
Nov. 4, 2008 |
| 7439179 |
Healing detrimental bonds in deposited materials |
Oct. 21, 2008 |
| 7416985 |
Semiconductor device having a multilayer interconnection structure and fabrication method thereof |
Aug. 26, 2008 |
| 7407879 |
Chemical planarization performance for copper/low-k interconnect structures |
Aug. 5, 2008 |
| 7405152 |
Reducing wire erosion during damascene processing |
Jul. 29, 2008 |
| 7405154 |
Structure and method of forming electrodeposited contacts |
Jul. 29, 2008 |
| 7399699 |
On-die reflectance arrangements |
Jul. 15, 2008 |
| 7399649 |
Semiconductor light-emitting device and fabrication method thereof |
Jul. 15, 2008 |
| 7396760 |
Method and system for reducing inter-layer capacitance in integrated circuits |
Jul. 8, 2008 |
| 7396768 |
Copper damascene chemical mechanical polishing (CMP) for thin film head writer fabrication |
Jul. 8, 2008 |
| 7397122 |
Metal wiring for semiconductor device and method for forming the same |
Jul. 8, 2008 |
| 7387963 |
Semiconductor wafer and process for producing a semiconductor wafer |
Jun. 17, 2008 |
| 7384865 |
Semiconductor device with a metal line and method of forming the same |
Jun. 10, 2008 |
| 7384864 |
Top layers of metal for high performance IC's |
Jun. 10, 2008 |
| 7381638 |
Fabrication technique using sputter etch and vacuum transfer |
Jun. 3, 2008 |
| 7378348 |
Polishing compound for insulating film for semiconductor integrated circuit and method for producing semiconductor integrated circuit |
May. 27, 2008 |
| 7375023 |
Method and apparatus for chemical mechanical polishing of semiconductor substrates |
May. 20, 2008 |
| 7354527 |
Chemical mechanical polishing pad and chemical mechanical polishing process |
Apr. 8, 2008 |
| 7354853 |
Selective dry etching of tantalum and tantalum nitride |
Apr. 8, 2008 |
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