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Class Information
Number: 438/625
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > At least one metallization level formed of diverse conductive layers
Description: Processes wherein at least one of the metallization levels is composed of plural conductive layers of differing composition or electrical characteristics.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618888 |
Temperature-controlled metallic dry-fill process |
Nov. 17, 2009 |
| 7601632 |
Method of forming a metal line of a semiconductor device |
Oct. 13, 2009 |
| 7595263 |
Atomic layer deposition of barrier materials |
Sep. 29, 2009 |
| 7592250 |
Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device |
Sep. 22, 2009 |
| 7576006 |
Protective self-aligned buffer layers for damascene interconnects |
Aug. 18, 2009 |
| 7572710 |
Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects |
Aug. 11, 2009 |
| 7569479 |
Method for fabricating semiconductor device |
Aug. 4, 2009 |
| 7569478 |
Method and apparatus for manufacturing semiconductor device, control program and computer storage medium |
Aug. 4, 2009 |
| 7541279 |
Method for manufacturing semiconductor device |
Jun. 2, 2009 |
| 7538022 |
Method of manufacturing electronic circuit device |
May. 26, 2009 |
| 7517754 |
Methods of forming semiconductor constructions |
Apr. 14, 2009 |
| 7514779 |
Multilayer build-up wiring board |
Apr. 7, 2009 |
| 7514354 |
Methods for forming damascene wiring structures having line and plug conductors formed from different materials |
Apr. 7, 2009 |
| 7510972 |
Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device |
Mar. 31, 2009 |
| 7504333 |
Method of forming bit line of semiconductor device |
Mar. 17, 2009 |
| 7504699 |
Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections |
Mar. 17, 2009 |
| 7482264 |
Method of forming metal line of semiconductor device, and semiconductor device |
Jan. 27, 2009 |
| 7476611 |
Semiconductor device and manufacturing method thereof |
Jan. 13, 2009 |
| 7468318 |
Method for manufacturing mold type semiconductor device |
Dec. 23, 2008 |
| 7452802 |
Method of forming metal wiring for high voltage element |
Nov. 18, 2008 |
| 7449409 |
Barrier layer for conductive features |
Nov. 11, 2008 |
| 7446032 |
Methods of providing an adhesion layer for adhesion of barrier and/or seed layers to dielectric films |
Nov. 4, 2008 |
| 7439179 |
Healing detrimental bonds in deposited materials |
Oct. 21, 2008 |
| 7422976 |
Top layers of metal for high performance IC's |
Sep. 9, 2008 |
| 7416985 |
Semiconductor device having a multilayer interconnection structure and fabrication method thereof |
Aug. 26, 2008 |
| 7405152 |
Reducing wire erosion during damascene processing |
Jul. 29, 2008 |
| 7402513 |
Method for forming interlayer insulation film |
Jul. 22, 2008 |
| 7396759 |
Protection of Cu damascene interconnects by formation of a self-aligned buffer layer |
Jul. 8, 2008 |
| 7396756 |
Top layers of metal for high performance IC's |
Jul. 8, 2008 |
| 7378340 |
Method of manufacturing semiconductor device and semiconductor device |
May. 27, 2008 |
| 7375022 |
Method of manufacturing wiring board |
May. 20, 2008 |
| 7368379 |
Multi-layer interconnect structure for semiconductor devices |
May. 6, 2008 |
| 7364997 |
Methods of forming integrated circuitry and methods of forming local interconnects |
Apr. 29, 2008 |
| 7358170 |
Methods of forming conductive interconnects, and methods of depositing nickel |
Apr. 15, 2008 |
| 7341937 |
Semiconductor device and method of manufacturing same |
Mar. 11, 2008 |
| 7341909 |
Methods of forming semiconductor constructions |
Mar. 11, 2008 |
| 7338884 |
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
Mar. 4, 2008 |
| 7335991 |
Pattern forming structure, pattern forming method, device, electro-optical device, and electronic apparatus |
Feb. 26, 2008 |
| 7332428 |
Metal interconnect structure and method |
Feb. 19, 2008 |
| 7329953 |
Structure for reducing leakage currents and high contact resistance for embedded memory and method for making same |
Feb. 12, 2008 |
| 7317253 |
Cobalt tungsten phosphate used to fill voids arising in a copper metallization process |
Jan. 8, 2008 |
| 7303987 |
Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same |
Dec. 4, 2007 |
| 7303988 |
Methods of manufacturing multi-level metal lines in semiconductor devices |
Dec. 4, 2007 |
| 7300867 |
Dual damascene interconnect structures having different materials for line and via conductors |
Nov. 27, 2007 |
| 7297630 |
Methods of fabricating via hole and trench |
Nov. 20, 2007 |
| 7288475 |
Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner |
Oct. 30, 2007 |
| 7273804 |
Internally reinforced bond pads |
Sep. 25, 2007 |
| 7262127 |
Method for Cu metallization of highly reliable dual damascene structures |
Aug. 28, 2007 |
| 7262126 |
Sealing and protecting integrated circuit bonding pads |
Aug. 28, 2007 |
| 7256141 |
Interface layer between dual polycrystalline silicon layers |
Aug. 14, 2007 |
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