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Class Information
Number: 438/625
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > At least one metallization level formed of diverse conductive layers
Description: Processes wherein at least one of the metallization levels is composed of plural conductive layers of differing composition or electrical characteristics.










Sub-classes under this class:

Class Number Class Name Patents
438/627 At least one layer forms a diffusion barrier 1,232
438/629 Diverse conductive layers limited to viahole/plug 994
438/628 Having adhesion promoting layer 355
438/626 Planarization 718


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8709939 Semiconductor device having a multilevel interconnect structure and method for fabricating the same Apr. 29, 2014
8679967 Apparatus and methods of forming memory lines and structures using double sidewall patterning for four times half pitch relief patterning Mar. 25, 2014
8673779 Interconnect with self-formed barrier Mar. 18, 2014
8669177 Semiconductor device and method for manufacturing semiconductor device Mar. 11, 2014
8664110 Method for forming semiconductor device Mar. 4, 2014
8653664 Barrier layers for copper interconnect Feb. 18, 2014
8609531 Methods of selectively forming ruthenium liner layer Dec. 17, 2013
8609528 High-density patterning Dec. 17, 2013
8603913 Porous dielectrics K value restoration by thermal treatment and or solvent treatment Dec. 10, 2013
8598698 Package substrate with an embedded stiffener Dec. 3, 2013
8586476 Fabrication method for circuit substrate having post-fed die side power supply connections Nov. 19, 2013
8586471 Seed layers for metallic interconnects and products Nov. 19, 2013
8569165 Self-aligned barrier and capping layers for interconnects Oct. 29, 2013
8558297 MRAM cell structure Oct. 15, 2013
8552557 Electronic component package fabrication method and structure Oct. 8, 2013
8530348 Integration of non-noble DRAM electrode Sep. 10, 2013
8518822 Integrated circuit packaging system with multi-stacked flip chips and method of manufacture thereof Aug. 27, 2013
8501617 Semiconductor devices including a topmost metal layer with at least one opening and their methods of fabrication Aug. 6, 2013
8492268 IC having viabar interconnection and related method Jul. 23, 2013
8487439 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board Jul. 16, 2013
8476112 Optimized semiconductor packaging in a three-dimensional stack Jul. 2, 2013
8450197 Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces May. 28, 2013
8435882 Film forming method for a semiconductor May. 7, 2013
8420527 Semiconductor integrated circuit device Apr. 16, 2013
8377822 Semiconductor device and manufacturing method thereof Feb. 19, 2013
8372739 Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication Feb. 12, 2013
8334202 Device fabricated using an electroplating process Dec. 18, 2012
8242013 Virtually substrate-less composite power semiconductor device and method Aug. 14, 2012
8211790 Multilayered circuitized substrate with P-aramid dielectric layers and method of making same Jul. 3, 2012
8211791 Method for fabricating circuitry component Jul. 3, 2012
8183150 Semiconductor device having silicon carbide and conductive pathway interface May. 22, 2012
8178435 High performance system-on-chip inductor using post passivation process May. 15, 2012
8143156 Methods of forming high density semiconductor devices using recursive spacer technique Mar. 27, 2012
8129267 Alpha particle blocking wire structure and method fabricating same Mar. 6, 2012
8119519 Semiconductor device manufacturing method Feb. 21, 2012
8119524 Method of manufacturing semiconductor device Feb. 21, 2012
8105935 Method of manufacturing a semiconductor device Jan. 31, 2012
8080471 MRAM cell structure Dec. 20, 2011
8076778 Method for preventing Al-Cu bottom damage using TiN liner Dec. 13, 2011
8076239 Semiconductor device and method of manufacturing the same Dec. 13, 2011
8071473 Semiconductor device manufacturing method and storage medium Dec. 6, 2011
8062971 Dual damascene process Nov. 22, 2011
8048811 Method for patterning a metallization layer by reducing resist strip induced damage of the dielectric material Nov. 1, 2011
8043962 Metal wire for a semiconductor device formed with a metal layer without voids therein and a method for forming the same Oct. 25, 2011
8008193 Manufacturing method of semiconductor device and semiconductor manufacturing apparatus therefor Aug. 30, 2011
8004087 Semiconductor device with dual damascene wirings and method for manufacturing same Aug. 23, 2011
8004084 Semiconductor device and manufacturing method thereof Aug. 23, 2011
8003524 Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement Aug. 23, 2011
7977234 Fabrication method of semiconductor integrated circuit device Jul. 12, 2011
7960277 Electronic device and method of manufacturing the same Jun. 14, 2011

1 2 3 4 5 6 7 8 9 10 11










 
 
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