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Class Information
Number: 438/624
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Separating insulating layer is laminate or composite of plural insulating materials
Description: Processes wherein there is at least one separating insulator layer between different metal levels, which separating insulator layer is itself made up of plural sublayers or which separating layer is a composite such as a mixture of silicon oxide and silicon nitride.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| RE40965 |
Method of forming low-resistance contact electrodes in semiconductor devices |
Nov. 10, 2009 |
| 7615484 |
Integrated circuit manufacturing method using hard mask |
Nov. 10, 2009 |
| 7611983 |
Semiconductor device and a manufacturing method of the same |
Nov. 3, 2009 |
| 7592660 |
Semiconductor device and method for manufacturing the same |
Sep. 22, 2009 |
| 7592250 |
Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device |
Sep. 22, 2009 |
| 7589014 |
Semiconductor device having multiple wiring layers and method of producing the same |
Sep. 15, 2009 |
| 7580088 |
Contact for semiconductor and display devices |
Aug. 25, 2009 |
| 7579590 |
Method of measuring thin layers using SIMS |
Aug. 25, 2009 |
| 7579270 |
Method for manufacturing a semiconductor device |
Aug. 25, 2009 |
| 7579258 |
Semiconductor interconnect having adjacent reservoir for bonding and method for formation |
Aug. 25, 2009 |
| 7576006 |
Protective self-aligned buffer layers for damascene interconnects |
Aug. 18, 2009 |
| 7572728 |
Semiconductor device and method for manufacturing the same |
Aug. 11, 2009 |
| 7572727 |
Semiconductor formation method that utilizes multiple etch stop layers |
Aug. 11, 2009 |
| 7572710 |
Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects |
Aug. 11, 2009 |
| 7569478 |
Method and apparatus for manufacturing semiconductor device, control program and computer storage medium |
Aug. 4, 2009 |
| 7569467 |
Semiconductor device and manufacturing method thereof |
Aug. 4, 2009 |
| 7566971 |
Semiconductor device and manufacturing method thereof |
Jul. 28, 2009 |
| 7563728 |
Methods of modifying interlayer adhesion |
Jul. 21, 2009 |
| 7563706 |
Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device |
Jul. 21, 2009 |
| 7557030 |
Method for fabricating a recess gate in a semiconductor device |
Jul. 7, 2009 |
| 7553759 |
Semiconductor device and method of manufacturing a semiconductor device |
Jun. 30, 2009 |
| 7531448 |
Manufacturing method of dual damascene structure |
May. 12, 2009 |
| 7528059 |
Method for reducing polish-induced damage in a contact structure by forming a capping layer |
May. 5, 2009 |
| 7524752 |
Method of manufacturing semiconductor device |
Apr. 28, 2009 |
| 7524750 |
Integrated process modulation (IPM) a novel solution for gapfill with HDP-CVD |
Apr. 28, 2009 |
| 7521355 |
Integrated circuit insulators and related methods |
Apr. 21, 2009 |
| 7521353 |
Method for reducing dielectric overetch when making contact to conductive features |
Apr. 21, 2009 |
| 7514779 |
Multilayer build-up wiring board |
Apr. 7, 2009 |
| 7514365 |
Method of fabricating opening and plug |
Apr. 7, 2009 |
| 7510959 |
Method of manufacturing a semiconductor device having damascene structures with air gaps |
Mar. 31, 2009 |
| 7507656 |
Method and structure for low k interlayer dielectric layer |
Mar. 24, 2009 |
| 7504727 |
Semiconductor interconnect structure utilizing a porous dielectric material as an etch stop layer between adjacent non-porous dielectric materials |
Mar. 17, 2009 |
| 7504699 |
Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections |
Mar. 17, 2009 |
| 7504330 |
Method of forming an insulative film |
Mar. 17, 2009 |
| 7504287 |
Methods for fabricating an integrated circuit |
Mar. 17, 2009 |
| 7498255 |
Post passivation interconnection schemes on top of the IC chips |
Mar. 3, 2009 |
| 7489039 |
Metal fill region of a semiconductor chip |
Feb. 10, 2009 |
| 7488680 |
Conductive through via process for electronic device carriers |
Feb. 10, 2009 |
| 7485570 |
Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor device |
Feb. 3, 2009 |
| 7485569 |
Printed circuit board including embedded chips and method of fabricating the same |
Feb. 3, 2009 |
| 7482262 |
Method of manufacturing semiconductor device |
Jan. 27, 2009 |
| 7476612 |
Method for manufacturing semiconductor device |
Jan. 13, 2009 |
| 7473630 |
Semiconductor device and method for manufacturing same |
Jan. 6, 2009 |
| 7470611 |
In situ deposition of a low K dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application |
Dec. 30, 2008 |
| 7470597 |
Method of fabricating a multilayered dielectric diffusion barrier layer |
Dec. 30, 2008 |
| 7468317 |
Method of forming metal line of semiconductor device |
Dec. 23, 2008 |
| 7462558 |
Method for fabricating a circuit component |
Dec. 9, 2008 |
| 7459787 |
Multi-layered copper line structure of semiconductor device and method for forming the same |
Dec. 2, 2008 |
| 7459389 |
Method of forming a semiconductor device having air gaps and the structure so formed |
Dec. 2, 2008 |
| 7456093 |
Method for improving a semiconductor device delamination resistance |
Nov. 25, 2008 |
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