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Class Information
Number: 438/624
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Separating insulating layer is laminate or composite of plural insulating materials
Description: Processes wherein there is at least one separating insulator layer between different metal levels, which separating insulator layer is itself made up of plural sublayers or which separating layer is a composite such as a mixture of silicon oxide and silicon nitride.










Patents under this class:

Patent Number Title Of Patent Date Issued
8709937 Method of forming micropattern, method of forming damascene metallization, and semiconductor device and semiconductor memory device fabricated using the same Apr. 29, 2014
8685851 MOS device with memory function and manufacturing method thereof Apr. 1, 2014
8679967 Apparatus and methods of forming memory lines and structures using double sidewall patterning for four times half pitch relief patterning Mar. 25, 2014
8674484 Dielectric separator layer Mar. 18, 2014
8673765 Method and apparatus for back end of line semiconductor device processing Mar. 18, 2014
8666206 Asymmetric slotted waveguide and method for fabricating the same Mar. 4, 2014
8664109 Advanced low k cap film formation process for nano electronic devices Mar. 4, 2014
8664099 Micro-electro-mechanical-system device with particles blocking function and method for making same Mar. 4, 2014
8647978 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Feb. 11, 2014
8629055 Manufacturing method of semiconductor device Jan. 14, 2014
8617981 Semiconductor device and manufacturing method thereof Dec. 31, 2013
8610278 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures Dec. 17, 2013
8609528 High-density patterning Dec. 17, 2013
8603912 Power semiconductor component and method for the production thereof Dec. 10, 2013
8598042 Device manufacturing and cleaning method Dec. 3, 2013
8592303 Wiring structure and method for manufacturing the same Nov. 26, 2013
8592302 Patterning method for fabrication of a semiconductor device Nov. 26, 2013
8586476 Fabrication method for circuit substrate having post-fed die side power supply connections Nov. 19, 2013
8575021 Substrate processing including a masking layer Nov. 5, 2013
8569888 Wiring structure and method of forming the structure Oct. 29, 2013
8569164 Through substrate structure, device package having the same, and methods for manufacturing the same Oct. 29, 2013
8551877 Sidewall and chamfer protection during hard mask removal for interconnect patterning Oct. 8, 2013
8530955 Nonvolatile semiconductor memory device and method for manufacturing same Sep. 10, 2013
8530348 Integration of non-noble DRAM electrode Sep. 10, 2013
8513777 Method and apparatus for generating reticle data Aug. 20, 2013
8497204 Method for reducing dielectric overetch when making contact to conductive features Jul. 30, 2013
8497203 Semiconductor structures and methods of manufacture Jul. 30, 2013
8492266 Semiconductor device having insulating film with surface modification layer and method for manufacturing the same Jul. 23, 2013
8487439 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board Jul. 16, 2013
8487313 Emissive device and electronic apparatus Jul. 16, 2013
8481399 Method of manufacturing semiconductor device including capacitor element provided above wiring layer that includes wiring with an upper surface having protruding portion Jul. 9, 2013
8450216 Contact etch stop layers of a field effect transistor May. 28, 2013
8445899 Organic electronic panel and method for manufacturing organic electronic panel May. 21, 2013
8445382 Side wall pore sealing for low-k dielectrics May. 21, 2013
8445377 Mechanically robust metal/low-k interconnects May. 21, 2013
8445318 Phase change memory devices including phase change layer formed by selective growth methods and methods of manufacturing the same May. 21, 2013
8435882 Film forming method for a semiconductor May. 7, 2013
8435802 Conductor layout technique to reduce stress-induced void formations May. 7, 2013
8431480 Semiconductor device and manufacturing method thereof Apr. 30, 2013
8426970 Substrate processing including a masking layer Apr. 23, 2013
8426307 Reducing resistivity in interconnect structures of integrated circuits Apr. 23, 2013
8426306 Three dimension programmable resistive random accessed memory array with shared bitline and method Apr. 23, 2013
8420527 Semiconductor integrated circuit device Apr. 16, 2013
8415247 Semiconductor device and method for manufacturing of same Apr. 9, 2013
8394701 Dielectric spacers for metal interconnects and method to form the same Mar. 12, 2013
8394656 Method of creating MEMS device cavities by a non-etching process Mar. 12, 2013
8389400 Method of manufacturing fine patterns of semiconductor device Mar. 5, 2013
8377818 Aftertreatment method for amorphous carbon film Feb. 19, 2013
8361898 Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof Jan. 29, 2013
8357997 Organic EL device and manufacturing method thereof Jan. 22, 2013











 
 
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