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Class Information
Number: 438/623
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Including organic insulating material between metal levels
Description: Processes wherein the intervening dielectric is at least partly composed of organic insulating material.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7399697 Very low dielectric constant plasma-enhanced CVD films Jul. 15, 2008
7400046 Semiconductor device with guard rings that are formed in each of the plural wiring layers Jul. 15, 2008
7396756 Top layers of metal for high performance IC's Jul. 8, 2008
7396758 Polycarbosilane buried etch stops in interconnect structures Jul. 8, 2008
7387917 BGA package substrate and method of fabricating same Jun. 17, 2008
7387971 Fabricating method for flat panel display device Jun. 17, 2008
7387973 Method for improving low-K dielectrics by supercritical fluid treatments Jun. 17, 2008
7387912 Packaging of electronic chips with air-bridge structures Jun. 17, 2008
7384864 Top layers of metal for high performance IC's Jun. 10, 2008
7381589 Silicon condenser microphone and manufacturing method Jun. 3, 2008
7378340 Method of manufacturing semiconductor device and semiconductor device May. 27, 2008
7377032 Process for producing a printed wiring board for mounting electronic components May. 27, 2008
7358170 Methods of forming conductive interconnects, and methods of depositing nickel Apr. 15, 2008
7351670 Method for producing silicon nitride films and process for fabricating semiconductor devices using said method Apr. 1, 2008
7348281 Method of filling structures for forming via-first dual damascene interconnects Mar. 25, 2008
7344897 Ferroelectric polymer memory structure and method therefor Mar. 18, 2008
7341936 Semiconductor device and method of manufacturing the same Mar. 11, 2008
7338884 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device Mar. 4, 2008
7335517 Multichip semiconductor device, chip therefor and method of formation thereof Feb. 26, 2008
7332427 Method of forming an interconnection line in a semiconductor device Feb. 19, 2008
7329953 Structure for reducing leakage currents and high contact resistance for embedded memory and method for making same Feb. 12, 2008
7326643 Method of making circuitized substrate with internal organic memory device Feb. 5, 2008
7323407 Method of fabricating dual damascene interconnections of microelectronic device using diffusion barrier layer against base material Jan. 29, 2008
7320945 Gradient low k material Jan. 22, 2008
7319068 Method of depositing low k barrier layers Jan. 15, 2008
7307015 Method for forming an interconnection line in a semiconductor device Dec. 11, 2007
7303989 Using zeolites to improve the mechanical strength of low-k interlayer dielectrics Dec. 4, 2007
7303988 Methods of manufacturing multi-level metal lines in semiconductor devices Dec. 4, 2007
7303986 Semiconductor device and a method of manufacturing the same Dec. 4, 2007
7303985 Zeolite-carbon doped oxide composite low k dielectric Dec. 4, 2007
7303940 Semiconductor component having at least one organic semiconductor layer and method for fabricating the same Dec. 4, 2007
7297640 Method for reducing argon diffusion from high density plasma films Nov. 20, 2007
7297630 Methods of fabricating via hole and trench Nov. 20, 2007
7294579 Method for forming contact opening Nov. 13, 2007
7291553 Method for forming dual damascene with improved etch profiles Nov. 6, 2007
7291919 Interlayer dielectric film, and method for forming the same and interconnection Nov. 6, 2007
7288475 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner Oct. 30, 2007
7279433 Deposition and patterning of boron nitride nanotube ILD Oct. 9, 2007
7273804 Internally reinforced bond pads Sep. 25, 2007
7271093 Low-carbon-doped silicon oxide film and damascene structure using same Sep. 18, 2007
7262127 Method for Cu metallization of highly reliable dual damascene structures Aug. 28, 2007
7259087 Semiconductor devices having a via hole and methods for forming a via hole in a semiconductor device Aug. 21, 2007
7259089 Semiconductor device manufacturing method that includes forming a wiring pattern with a mask layer that has a tapered shape Aug. 21, 2007
7256118 Semiconductor device using low-K material as interlayer insulating film and its manufacture method Aug. 14, 2007
7256499 Ultra low dielectric constant integrated circuit system Aug. 14, 2007
7253096 Bipolar transistor having raised extrinsic base with selectable self-alignment and methods of forming same Aug. 7, 2007
7247177 Production method for electric double-layer capacitor Jul. 24, 2007
7244673 Integration film scheme for copper / low-k interconnect Jul. 17, 2007
7241684 Method of forming metal wiring of semiconductor device Jul. 10, 2007
7241681 Bilayered metal hardmasks for use in dual damascene etch schemes Jul. 10, 2007

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