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Class Information
Number: 438/623
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Including organic insulating material between metal levels
Description: Processes wherein the intervening dielectric is at least partly composed of organic insulating material.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7795133 Semiconductor device and method of manufacturing the same Sep. 14, 2010
7795129 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment Sep. 14, 2010
RE41697 Method of forming planarized coatings on contact hole patterns of various duty ratios Sep. 14, 2010
7781332 Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer Aug. 24, 2010
7781339 Method of fabricating semiconductor interconnections Aug. 24, 2010
7776736 Substrate for electronic device capable of suppressing fluorine atoms exposed at the surface of insulating film from reacting with water and method for processing same Aug. 17, 2010
7772706 Air-gap ILD with unlanded vias Aug. 10, 2010
7745327 Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime Jun. 29, 2010
7745325 Wiring structure of a semiconductor device, method of forming the wiring structure, non-volatile memory device including the wiring structure, and method of manufacturing the non-volatile memo Jun. 29, 2010
7745323 Metal interconnection of a semiconductor device and method of fabricating the same Jun. 29, 2010
7745252 Semiconductor device and manufacturing method thereof Jun. 29, 2010
7737023 Method of manufacture of semiconductor integrated circuit device and semiconductor integrated circuit device Jun. 15, 2010
RE41369 Semiconductor device and method of manufacturing the same Jun. 8, 2010
7732348 Method of producing a porous dielectric element and corresponding dielectric element Jun. 8, 2010
7723226 Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio May. 25, 2010
7723227 Methods of forming copper-comprising conductive lines in the fabrication of integrated circuitry May. 25, 2010
7713863 Method for manufacturing a semiconductor device and method for etching the same May. 11, 2010
7709298 Selectively altering a predetermined portion or an external member in contact with the predetermined portion May. 4, 2010
7709371 Repairing damage to low-k dielectric materials using silylating agents May. 4, 2010
7704872 Ultraviolet assisted pore sealing of porous low k dielectric films Apr. 27, 2010
7700418 Method for production of thin-film semiconductor device Apr. 20, 2010
7691704 Method for manufacturing semiconductor device having damascene MIM type capacitor Apr. 6, 2010
7682977 Methods of forming trench isolation and methods of forming arrays of FLASH memory cells Mar. 23, 2010
7674705 Method of forming a semiconductor device Mar. 9, 2010
7666712 Design of BEOL patterns to reduce the stresses on structures below chip bondpads Feb. 23, 2010
7646098 Multilayered circuitized substrate with p-aramid dielectric layers and method of making same Jan. 12, 2010
7642187 Method of forming wiring of a semiconductor memory device Jan. 5, 2010
7638424 Technique for non-destructive metal delamination monitoring in semiconductor devices Dec. 29, 2009
7633163 Very low dielectric constant plasma-enhanced CVD films Dec. 15, 2009
7629250 Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies Dec. 8, 2009
7628866 Method of cleaning wafer after etching process Dec. 8, 2009
7625818 Method for forming vias in a substrate Dec. 1, 2009
7622307 Semiconductor devices having a planarized insulating layer and methods of forming the same Nov. 24, 2009
7611986 Dual damascene patterning method Nov. 3, 2009
7601631 Very low dielectric constant plasma-enhanced CVD films Oct. 13, 2009
7598173 Electro-optic displays, and components for use therein Oct. 6, 2009
7598166 Dielectric layers for metal lines in semiconductor chips Oct. 6, 2009
7592249 Method for manufacturing a semiconductor device Sep. 22, 2009
7582555 CVD flowable gap fill Sep. 1, 2009
7579647 Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration Aug. 25, 2009
7575981 Method for fabricating isolation layer in semiconductor device Aug. 18, 2009
7575999 Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies Aug. 18, 2009
7572723 Micropad for bonding and a method therefor Aug. 11, 2009
7572710 Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects Aug. 11, 2009
7563706 Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device Jul. 21, 2009
7563707 Laser process for reliable and low-resistance electrical contacts Jul. 21, 2009
7563728 Methods of modifying interlayer adhesion Jul. 21, 2009
7560307 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same Jul. 14, 2009
7560377 Plasma processes for depositing low dielectric constant films Jul. 14, 2009
7554176 Integrated circuits having a multi-layer structure with a seal ring Jun. 30, 2009

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