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Class Information
Number: 438/623
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Including organic insulating material between metal levels
Description: Processes wherein the intervening dielectric is at least partly composed of organic insulating material.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7960294 Method of modifying interlayer adhesion Jun. 14, 2011
7952188 Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip May. 31, 2011
7947978 Semiconductor chip with bond area May. 24, 2011
7939446 Process for reversing tone of patterns on integerated circuit and structural process for nanoscale fabrication May. 10, 2011
7932172 Semiconductor chip and process for forming the same Apr. 26, 2011
7932175 Method to form a via Apr. 26, 2011
7928000 Method for forming self aligned contacts for integrated circuit devices Apr. 19, 2011
7923366 Post passivation interconnection schemes on top of IC chip Apr. 12, 2011
7915161 Post passivation interconnection schemes on top of IC chip Mar. 29, 2011
7915157 Chip structure and process for forming the same Mar. 29, 2011
7915160 Methods for forming small contacts Mar. 29, 2011
7915159 Treating agent materials Mar. 29, 2011
7910475 Method for forming low dielectric constant fluorine-doped layers Mar. 22, 2011
7906422 Chip structure and process for forming the same Mar. 15, 2011
7906848 Semiconductor device Mar. 15, 2011
7902641 Semiconductor device and manufacturing method therefor Mar. 8, 2011
7902067 Post passivation interconnection schemes on top of the IC chips Mar. 8, 2011
7901743 Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system Mar. 8, 2011
7897504 Method for fabricating semiconductor device Mar. 1, 2011
7892965 Post passivation interconnection schemes on top of IC chip Feb. 22, 2011
7883986 Methods of forming trench isolation and methods of forming arrays of FLASH memory cells Feb. 8, 2011
7875547 Contact hole structures and contact structures and fabrication methods thereof Jan. 25, 2011
7875981 Insulating film material, multilayer interconnection structure, method for manufacturing same, and method for manufacturing semiconductor device Jan. 25, 2011
7875549 Fluorine doped carbon films produced by modification by radicals Jan. 25, 2011
7871925 Stack package and method for manufacturing the same Jan. 18, 2011
7871923 Self-aligned air-gap in interconnect structures Jan. 18, 2011
7858513 Fabrication of self-aligned via holes in polymer thin films Dec. 28, 2010
7858507 Method and system for creating photosensitive array with integrated backplane Dec. 28, 2010
7851265 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus Dec. 14, 2010
7852189 Packaged spiral inductor structures, processes of making same, and systems containing same Dec. 14, 2010
7847368 Multilayer film with stack of nanometer-scale thicknesses Dec. 7, 2010
7842601 Method of forming small pitch pattern using double spacers Nov. 30, 2010
7842602 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method Nov. 30, 2010
7838440 Method for manufacturing semiconductor device having porous low dielectric constant layer formed for insulation between metal lines Nov. 23, 2010
7834458 Interconnect structure for semiconductor devices Nov. 16, 2010
7827681 Method of manufacturing electronic component integrated substrate Nov. 9, 2010
7830013 Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof Nov. 9, 2010
7825403 Circuit board including a substrate with a recessed portion and manufacturing method thereof, electro-optical device and electronic apparatus Nov. 2, 2010
7825023 Method of manufacturing an interconnection structure Nov. 2, 2010
7825042 Very low dielectric constant plasma-enhanced CVD films Nov. 2, 2010
7825022 Method of enabling solder deposition on a substrate and electronic package formed thereby Nov. 2, 2010
7820477 Organic thin film transistor array substrate and fabrication method thereof Oct. 26, 2010
7820544 Method for forming metal wiring of semiconductor device and a semiconductor device manufactured by the same Oct. 26, 2010
7816721 Transmission/reception semiconductor device with memory element and antenna on same side of conductive adhesive Oct. 19, 2010
7811852 Organic semiconductor device Oct. 12, 2010
7807219 Repairing and restoring strength of etch-damaged low-k dielectric materials Oct. 5, 2010
7803705 Manufacturing method of semiconductor device and film deposition system Sep. 28, 2010
7799673 Semiconductor device manufacturing method Sep. 21, 2010
7796228 Display substrate, method of manufacturing the same and display device having the same Sep. 14, 2010
7795136 Metal wiring of semiconductor device and forming method thereof Sep. 14, 2010

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