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Class Information
Number: 438/623
Name: Semiconductor device manufacturing: process > Coating with electrically or thermally conductive material > To form ohmic contact to semiconductive material > Contacting multiple semiconductive regions (i.e., interconnects) > Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) > Including organic insulating material between metal levels
Description: Processes wherein the intervening dielectric is at least partly composed of organic insulating material.










Patents under this class:
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Patent Number Title Of Patent Date Issued
5114757 Enhancement of polyimide adhesion on reactive metals May. 19, 1992
5114754 Passivation of metal in metal/polyimide structures May. 19, 1992
5112448 Self-aligned process for fabrication of interconnect structures in semiconductor applications May. 12, 1992
5110712 Incorporation of dielectric layers in a semiconductor May. 5, 1992
5109267 Method for producing an integrated circuit structure with a dense multilayer metallization pattern Apr. 28, 1992
5103288 Semiconductor device having multilayered wiring structure with a small parasitic capacitance Apr. 7, 1992
5091339 Trenching techniques for forming vias and channels in multilayer electrical interconnects Feb. 25, 1992
5091289 Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions Feb. 25, 1992
5024969 Hybrid circuit structure fabrication methods using high energy electron beam curing Jun. 18, 1991
5023205 Method of fabricating hybrid circuit structures Jun. 11, 1991
4963512 Method for forming conductor layers and method for fabricating multilayer substrates Oct. 16, 1990
4874721 Method of manufacturing a multichip package with increased adhesive strength Oct. 17, 1989
4857481 Method of fabricating airbridge metal interconnects Aug. 15, 1989
4843034 Fabrication of interlayer conductive paths in integrated circuits Jun. 27, 1989
4840923 Simultaneous multiple level interconnection process Jun. 20, 1989
4837183 Semiconductor device metallization process Jun. 6, 1989
4816115 Process of making via holes in a double-layer insulation Mar. 28, 1989
4803177 Method of forming interconnections and crossings between metallization levels of an integrated circuit Feb. 7, 1989
4801507 Arylsiloxane/silicate compositions useful as interlayer dielectric films Jan. 31, 1989
4743568 Multilevel interconnect transfer process May. 10, 1988
4721689 Method for simultaneously forming an interconnection level and via studs Jan. 26, 1988
4699803 Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers Oct. 13, 1987
4670967 Forming multilayer interconnections for a semiconductor device by vapor phase growth process Jun. 9, 1987
H274 Method of manufacturing an integrated circuit chip and integrated circuit chip produced thereby May. 5, 1987
4656050 Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers Apr. 7, 1987
4654113 Process for fabricating a semiconductor device Mar. 31, 1987
4654223 Method for forming a film of dielectric material on an electric component Mar. 31, 1987
4639277 Semiconductor material on a substrate, said substrate comprising, in order, a layer of organic polymer, a layer of metal or metal alloy and a layer of dielectric material Jan. 27, 1987
4618878 Semiconductor device having a multilayer wiring structure using a polyimide resin Oct. 21, 1986
4569876 Multi-layered substrate having a fine wiring structure for LSI or VLSI circuits Feb. 11, 1986
4536951 Method of producing a layered structure Aug. 27, 1985
4529620 Method of making deformable light modulator structure Jul. 16, 1985
4523372 Process for fabricating semiconductor device Jun. 18, 1985
4519872 Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes May. 28, 1985
4507333 Biphenylene end-capped quinoxaline polymers and their use as insulating coatings for semiconductor devices Mar. 26, 1985
4495220 Polyimide inter-metal dielectric process Jan. 22, 1985
4489481 Insulator and metallization method for VLSI devices with anisotropically-etched contact holes Dec. 25, 1984
4423547 Method for forming dense multilevel interconnection metallurgy for semiconductor devices Jan. 3, 1984
4394211 Method of manufacturing a semiconductor device having a layer of polymide resin Jul. 19, 1983
4357369 Method of plasma etching a substrate Nov. 2, 1982
4357203 Plasma etching of polyimide Nov. 2, 1982
4349609 Electronic device having multilayer wiring structure Sep. 14, 1982
4347306 Method of manufacturing electronic device having multilayer wiring structure Aug. 31, 1982
4328262 Method of manufacturing semiconductor devices having photoresist film as a permanent layer May. 4, 1982
4218283 Method for fabricating semiconductor device and etchant for polymer resin Aug. 19, 1980
4118595 Crossovers and method of fabrication Oct. 3, 1978
4057659 Semiconductor device and a method of producing such device Nov. 8, 1977
4040083 Aluminum oxide layer bonding polymer resin layer to semiconductor device Aug. 2, 1977
4017886 Discrete semiconductor device having polymer resin as insulator and method for making the same Apr. 12, 1977
4001870 Isolating protective film for semiconductor devices and method for making the same Jan. 4, 1977

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